DE3885028D1 - Kühlungsstruktur für auf einem Substrat montierte elektronische Wärmeerzeugende Bauelemente. - Google Patents

Kühlungsstruktur für auf einem Substrat montierte elektronische Wärmeerzeugende Bauelemente.

Info

Publication number
DE3885028D1
DE3885028D1 DE88306812T DE3885028T DE3885028D1 DE 3885028 D1 DE3885028 D1 DE 3885028D1 DE 88306812 T DE88306812 T DE 88306812T DE 3885028 T DE3885028 T DE 3885028T DE 3885028 D1 DE3885028 D1 DE 3885028D1
Authority
DE
Germany
Prior art keywords
substrate
cooling structure
components mounted
generating components
electronic heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88306812T
Other languages
English (en)
Other versions
DE3885028T2 (de
Inventor
Shinji C O Nec Corporatio Mine
Terumi C O Nec Corp Shimonishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62185182A external-priority patent/JP2716129B2/ja
Priority claimed from JP62189201A external-priority patent/JP2521966B2/ja
Priority claimed from JP20416887A external-priority patent/JPS6448452A/ja
Priority claimed from JP1987157800U external-priority patent/JPH0163141U/ja
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE3885028D1 publication Critical patent/DE3885028D1/de
Publication of DE3885028T2 publication Critical patent/DE3885028T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE88306812T 1987-07-24 1988-07-25 Kühlungsstruktur für auf einem Substrat montierte elektronische Wärmeerzeugende Bauelemente. Expired - Fee Related DE3885028T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62185182A JP2716129B2 (ja) 1987-07-24 1987-07-24 集積回路の冷却構造
JP62189201A JP2521966B2 (ja) 1987-07-29 1987-07-29 集積回路の冷却構造
JP20416887A JPS6448452A (en) 1987-08-19 1987-08-19 Cooling structure of integrated circuit
JP1987157800U JPH0163141U (de) 1987-10-15 1987-10-15

Publications (2)

Publication Number Publication Date
DE3885028D1 true DE3885028D1 (de) 1993-11-25
DE3885028T2 DE3885028T2 (de) 1994-05-11

Family

ID=27473502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88306812T Expired - Fee Related DE3885028T2 (de) 1987-07-24 1988-07-25 Kühlungsstruktur für auf einem Substrat montierte elektronische Wärmeerzeugende Bauelemente.

Country Status (4)

Country Link
US (1) US4942497A (de)
EP (1) EP0302641B1 (de)
CA (1) CA1290078C (de)
DE (1) DE3885028T2 (de)

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JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
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US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
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JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
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JP3509274B2 (ja) * 1994-07-13 2004-03-22 セイコーエプソン株式会社 樹脂封止型半導体装置およびその製造方法
JP3367299B2 (ja) * 1994-11-11 2003-01-14 セイコーエプソン株式会社 樹脂封止型半導体装置およびその製造方法
JP3542677B2 (ja) * 1995-02-27 2004-07-14 セイコーエプソン株式会社 樹脂封止型半導体装置およびその製造方法
JP3309686B2 (ja) * 1995-03-17 2002-07-29 セイコーエプソン株式会社 樹脂封止型半導体装置及びその製造方法
US5802707A (en) * 1996-03-28 1998-09-08 Intel Corporation Controlled bondline thickness attachment mechanism
US5999407A (en) * 1998-10-22 1999-12-07 Lockheed Martin Corp. Electronic module with conductively heat-sunk components
US6356448B1 (en) 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US6452113B2 (en) 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6304450B1 (en) 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US6741480B2 (en) 1999-07-15 2004-05-25 Incep Technologies, Inc. Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US6801431B2 (en) * 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6947293B2 (en) * 1999-07-15 2005-09-20 Incep Technologies Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6847529B2 (en) * 1999-07-15 2005-01-25 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US20030214800A1 (en) * 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6618268B2 (en) 1999-07-15 2003-09-09 Incep Technologies, Inc. Apparatus for delivering power to high performance electronic assemblies
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
JP4089098B2 (ja) * 1999-08-18 2008-05-21 横河電機株式会社 プリント基板の冷却構造
US7167379B2 (en) * 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
JP4158347B2 (ja) * 2001-03-21 2008-10-01 日本電気株式会社 電子部品取付構造
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US6999317B2 (en) * 2003-08-12 2006-02-14 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
US7849914B2 (en) * 2006-05-02 2010-12-14 Clockspeed, Inc. Cooling apparatus for microelectronic devices
US7719842B2 (en) * 2008-02-18 2010-05-18 International Business Machines Corporation Method of providing flexible heat sink installations for early blade board manufacturing
EP2247172B1 (de) * 2009-04-27 2013-01-30 Siemens Aktiengesellschaft Kühlsystem, Kühlplatte und Baugruppe mit Kühlsystem
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US9265176B2 (en) 2013-03-08 2016-02-16 International Business Machines Corporation Multi-component electronic module with integral coolant-cooling
US9686887B2 (en) 2014-09-15 2017-06-20 Nicholas Michael D'Onofrio Liquid cooled metal core printed circuit board
CN109399630B (zh) * 2018-12-19 2020-12-11 长沙新材料产业研究院有限公司 一种在金刚石合成设备中便于控制衬底温度的装置

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US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US3912001A (en) * 1974-03-11 1975-10-14 Gen Electric Water cooled heat sink assembly
US3908188A (en) * 1974-08-14 1975-09-23 Us Air Force Heat sink for microstrip circuit
SU572951A1 (ru) * 1974-10-24 1977-09-15 Предприятие П/Я А-3162 Устройство дл охлаждени элементов радиоаппаратуры
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US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4204246A (en) * 1976-02-14 1980-05-20 Sony Corporation Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
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US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4115836A (en) * 1977-04-25 1978-09-19 Burroughs Corporation Cooling system for dual-in-line packages
JPS6011830B2 (ja) * 1977-05-24 1985-03-28 日本電気株式会社 電子部品の冷却装置
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US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
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JPS57106062A (en) * 1980-12-24 1982-07-01 Hitachi Ltd Package for integrated circuit
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
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JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
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DE3766384D1 (de) * 1986-02-25 1991-01-10 Nec Corp Fluessigkeitskuehlungssystem fuer integrierte schaltungschips.
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US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
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Also Published As

Publication number Publication date
DE3885028T2 (de) 1994-05-11
CA1290078C (en) 1991-10-01
EP0302641B1 (de) 1993-10-20
EP0302641A1 (de) 1989-02-08
US4942497A (en) 1990-07-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee