DE3880065T2 - Automatische Montagevorrichtung für elektronische Bauteile. - Google Patents

Automatische Montagevorrichtung für elektronische Bauteile.

Info

Publication number
DE3880065T2
DE3880065T2 DE88117236T DE3880065T DE3880065T2 DE 3880065 T2 DE3880065 T2 DE 3880065T2 DE 88117236 T DE88117236 T DE 88117236T DE 3880065 T DE3880065 T DE 3880065T DE 3880065 T2 DE3880065 T2 DE 3880065T2
Authority
DE
Germany
Prior art keywords
electronic components
assembly device
automatic assembly
automatic
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88117236T
Other languages
English (en)
Other versions
DE3880065D1 (de
Inventor
Toshikatsu Okumura
Atsushi Kura
Yoshio Tanabe
Kazuyoshi Ohyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62262247A external-priority patent/JPH0774969B2/ja
Priority claimed from JP62286220A external-priority patent/JP2584255B2/ja
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Application granted granted Critical
Publication of DE3880065D1 publication Critical patent/DE3880065D1/de
Publication of DE3880065T2 publication Critical patent/DE3880065T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
DE88117236T 1987-10-16 1988-10-17 Automatische Montagevorrichtung für elektronische Bauteile. Expired - Fee Related DE3880065T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62262247A JPH0774969B2 (ja) 1987-10-16 1987-10-16 電子部品の装着装置
JP62286220A JP2584255B2 (ja) 1987-11-12 1987-11-12 部品実装方法

Publications (2)

Publication Number Publication Date
DE3880065D1 DE3880065D1 (de) 1993-05-13
DE3880065T2 true DE3880065T2 (de) 1993-10-14

Family

ID=26545463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88117236T Expired - Fee Related DE3880065T2 (de) 1987-10-16 1988-10-17 Automatische Montagevorrichtung für elektronische Bauteile.

Country Status (3)

Country Link
US (1) US4914808A (de)
EP (1) EP0312116B1 (de)
DE (1) DE3880065T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2776860B2 (ja) * 1989-01-11 1998-07-16 株式会社日立製作所 電子部品装着装置及び装着方法
JP2804601B2 (ja) * 1989-05-31 1998-09-30 三洋電機株式会社 部品供給装置
JPH0821798B2 (ja) * 1989-09-05 1996-03-04 富士機械製造株式会社 電子部品供給装置
US5193268A (en) * 1989-11-07 1993-03-16 Sanyo Electric Co., Ltd. Parts feeding system utilizing an unmanned conveying machine
FR2657225B1 (fr) * 1990-01-16 1992-04-10 Dassault Electronique Procede et dispositif de traitement de composants electroniques destines a etre montes sur une structure electronique.
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
GB2262516B (en) * 1991-12-21 1995-03-22 Tdk Corp Electronic component feed system
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
US5933349A (en) * 1995-12-29 1999-08-03 Compaq Computer Corporation Component placement
JP3728350B2 (ja) * 1996-06-11 2005-12-21 松下電器産業株式会社 部品実装方法及び部品実装装置
JPH10224099A (ja) * 1997-02-04 1998-08-21 Fuji Mach Mfg Co Ltd 回路部品装着方法および回路部品装着システム
JP3422645B2 (ja) * 1997-02-14 2003-06-30 富士通株式会社 回路素子配置装置
JPH10313194A (ja) * 1997-05-12 1998-11-24 Fuji Mach Mfg Co Ltd 回路部品供給装置，フィーダおよび回路部品供給方法
KR100328345B1 (ko) * 1999-09-01 2002-03-12 정문술 표면실장장치 및 그 실장방법
EP1350419B1 (de) 2000-08-04 2013-02-20 Panasonic Corporation Verfahren zur optimierung der bestückungsfolge, vorichtung dafür und bestücker
JP2002204096A (ja) 2000-12-28 2002-07-19 Fuji Mach Mfg Co Ltd 電気部品装着システムおよび電気部品装着方法
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2006513565A (ja) * 2003-01-16 2006-04-20 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ チップ移送方法及び装置
JP3966189B2 (ja) * 2003-02-27 2007-08-29 オムロン株式会社 基板検査方法およびこの方法を用いた基板検査装置
NL1029247C2 (nl) * 2005-06-14 2006-12-18 Assembleon Nv Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel.
SG173943A1 (en) * 2010-03-04 2011-09-29 Ah Yoong Sim Rotary die bonding apparatus and methodology thereof
US10712729B2 (en) * 2015-04-09 2020-07-14 Panasonic Intellectual Property Management Co., Ltd. Setting support system for setting operational parameter
CN111432621B (zh) * 2015-11-17 2021-05-11 株式会社富士 安装处理方法及安装系统
CN106115260A (zh) * 2016-08-17 2016-11-16 华天科技（昆山）电子有限公司 器件高速取放装置
CN111761354B (zh) * 2020-07-17 2022-09-20 佛山迪标门窗科技有限公司 一种隐形防盗网铝合金螺栓组装器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
JPS57199296A (en) * 1981-06-01 1982-12-07 Matsushita Electric Ind Co Ltd Device for mounting electric part
JPS6012799A (ja) * 1983-07-01 1985-01-23 三洋電機株式会社 チップ状電子部品の自動装着装置
JPS61152100A (ja) * 1984-12-26 1986-07-10 ティーディーケイ株式会社 電子部品装着装置及びその方法
JPS61126338U (de) * 1985-01-22 1986-08-08
US4763405A (en) * 1986-08-21 1988-08-16 Matsushita Electric Industrial Co., Ltd. Chip-placement machine with test function

Also Published As

Publication number Publication date
EP0312116B1 (de) 1993-04-07
EP0312116A2 (de) 1989-04-19
US4914808A (en) 1990-04-10
EP0312116A3 (en) 1990-04-11
DE3880065D1 (de) 1993-05-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP

8339 Ceased/non-payment of the annual fee