JPS6448452A - Cooling structure of integrated circuit - Google Patents

Cooling structure of integrated circuit

Info

Publication number
JPS6448452A
JPS6448452A JP20416887A JP20416887A JPS6448452A JP S6448452 A JPS6448452 A JP S6448452A JP 20416887 A JP20416887 A JP 20416887A JP 20416887 A JP20416887 A JP 20416887A JP S6448452 A JPS6448452 A JP S6448452A
Authority
JP
Japan
Prior art keywords
integrated circuits
cooling plate
integrated circuit
cooling
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20416887A
Other languages
Japanese (ja)
Inventor
Terumi Shimonishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20416887A priority Critical patent/JPS6448452A/en
Priority to US07/222,818 priority patent/US4942497A/en
Priority to CA000572835A priority patent/CA1290078C/en
Priority to EP88306812A priority patent/EP0302641B1/en
Priority to DE88306812T priority patent/DE3885028T2/en
Publication of JPS6448452A publication Critical patent/JPS6448452A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To simplify cooling device itself, and to improve reliability by mounting a cooling plate, to which a tapped hole is formed, and a screw being oppositely contacted with an integrated circuit and consisting of a thermally excellent conductive material, screwing the screw to the cooling plate and conducting the heat of the integrated circuit over the cooling plate through the screw. CONSTITUTION:A cooling plate, which is set up in parallel with a substrate to which a plurality of integrated circuits 1 are mounted, the inside of which has a circuit 5 for a refrigerant and to which tapped holes 6 respectively faced to the integrated circuits 1 oppositely are formed, and screws 7 screwed to the tapped holes 6 and composed of a thermal good conductive material oppositely contacted with the integrated circuits are provided. The heat of the integrated circuits 1 is conducted over the cooling plate through the thermal conductive screws 7, and the integrated circuits 1 loaded on substrates in a large number per substrate can be cooled according to a water cooling system. Consequently, no fan for forced air cooling is required while each integrated circuit 1 can be cooled uniformly, thus reducing the noises of a device, then improving reliability.
JP20416887A 1987-07-24 1987-08-19 Cooling structure of integrated circuit Pending JPS6448452A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP20416887A JPS6448452A (en) 1987-08-19 1987-08-19 Cooling structure of integrated circuit
US07/222,818 US4942497A (en) 1987-07-24 1988-07-21 Cooling structure for heat generating electronic components mounted on a substrate
CA000572835A CA1290078C (en) 1987-07-24 1988-07-22 Cooling structure for heat generating electronic components mounted on a substrate
EP88306812A EP0302641B1 (en) 1987-07-24 1988-07-25 Cooling structure for heat generating electronic components mounted on a substrate
DE88306812T DE3885028T2 (en) 1987-07-24 1988-07-25 Cooling structure for electronic heat generating components mounted on a substrate.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20416887A JPS6448452A (en) 1987-08-19 1987-08-19 Cooling structure of integrated circuit

Publications (1)

Publication Number Publication Date
JPS6448452A true JPS6448452A (en) 1989-02-22

Family

ID=16485964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20416887A Pending JPS6448452A (en) 1987-07-24 1987-08-19 Cooling structure of integrated circuit

Country Status (1)

Country Link
JP (1) JPS6448452A (en)

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