JPS6448452A - Cooling structure of integrated circuit - Google Patents
Cooling structure of integrated circuitInfo
- Publication number
- JPS6448452A JPS6448452A JP20416887A JP20416887A JPS6448452A JP S6448452 A JPS6448452 A JP S6448452A JP 20416887 A JP20416887 A JP 20416887A JP 20416887 A JP20416887 A JP 20416887A JP S6448452 A JPS6448452 A JP S6448452A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuits
- cooling plate
- integrated circuit
- cooling
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To simplify cooling device itself, and to improve reliability by mounting a cooling plate, to which a tapped hole is formed, and a screw being oppositely contacted with an integrated circuit and consisting of a thermally excellent conductive material, screwing the screw to the cooling plate and conducting the heat of the integrated circuit over the cooling plate through the screw. CONSTITUTION:A cooling plate, which is set up in parallel with a substrate to which a plurality of integrated circuits 1 are mounted, the inside of which has a circuit 5 for a refrigerant and to which tapped holes 6 respectively faced to the integrated circuits 1 oppositely are formed, and screws 7 screwed to the tapped holes 6 and composed of a thermal good conductive material oppositely contacted with the integrated circuits are provided. The heat of the integrated circuits 1 is conducted over the cooling plate through the thermal conductive screws 7, and the integrated circuits 1 loaded on substrates in a large number per substrate can be cooled according to a water cooling system. Consequently, no fan for forced air cooling is required while each integrated circuit 1 can be cooled uniformly, thus reducing the noises of a device, then improving reliability.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20416887A JPS6448452A (en) | 1987-08-19 | 1987-08-19 | Cooling structure of integrated circuit |
US07/222,818 US4942497A (en) | 1987-07-24 | 1988-07-21 | Cooling structure for heat generating electronic components mounted on a substrate |
CA000572835A CA1290078C (en) | 1987-07-24 | 1988-07-22 | Cooling structure for heat generating electronic components mounted on a substrate |
EP88306812A EP0302641B1 (en) | 1987-07-24 | 1988-07-25 | Cooling structure for heat generating electronic components mounted on a substrate |
DE88306812T DE3885028T2 (en) | 1987-07-24 | 1988-07-25 | Cooling structure for electronic heat generating components mounted on a substrate. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20416887A JPS6448452A (en) | 1987-08-19 | 1987-08-19 | Cooling structure of integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448452A true JPS6448452A (en) | 1989-02-22 |
Family
ID=16485964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20416887A Pending JPS6448452A (en) | 1987-07-24 | 1987-08-19 | Cooling structure of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448452A (en) |
-
1987
- 1987-08-19 JP JP20416887A patent/JPS6448452A/en active Pending
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