DE3763504D1 - Kuehlungssystem fuer elektronische bauelemente. - Google Patents

Kuehlungssystem fuer elektronische bauelemente.

Info

Publication number
DE3763504D1
DE3763504D1 DE8787303101T DE3763504T DE3763504D1 DE 3763504 D1 DE3763504 D1 DE 3763504D1 DE 8787303101 T DE8787303101 T DE 8787303101T DE 3763504 T DE3763504 T DE 3763504T DE 3763504 D1 DE3763504 D1 DE 3763504D1
Authority
DE
Germany
Prior art keywords
electronic components
cooling system
cooling
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787303101T
Other languages
English (en)
Inventor
Tsukasa Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE3763504D1 publication Critical patent/DE3763504D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE8787303101T 1986-04-09 1987-04-09 Kuehlungssystem fuer elektronische bauelemente. Expired - Fee Related DE3763504D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61082724A JPS62238653A (ja) 1986-04-09 1986-04-09 冷却構造

Publications (1)

Publication Number Publication Date
DE3763504D1 true DE3763504D1 (de) 1990-08-09

Family

ID=13782360

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787303101T Expired - Fee Related DE3763504D1 (de) 1986-04-09 1987-04-09 Kuehlungssystem fuer elektronische bauelemente.

Country Status (4)

Country Link
US (1) US4794981A (de)
EP (1) EP0241290B1 (de)
JP (1) JPS62238653A (de)
DE (1) DE3763504D1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nec Corp Kühlungsstruktur für elektronische Bauelemente
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
JPH03257953A (ja) * 1990-03-08 1991-11-18 Nobuo Mikoshiba 半導体素子
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
DE4210835C1 (de) * 1992-04-01 1993-06-17 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
US5359768A (en) * 1992-07-30 1994-11-01 Intel Corporation Method for mounting very small integrated circuit package on PCB
US5550326A (en) * 1994-07-13 1996-08-27 Parker-Hannifin Corporation Heat dissipator for electronic components
KR100245971B1 (ko) * 1995-11-30 2000-03-02 포만 제프리 엘 중합접착제를 금속에 접착시키기 위한 접착력 촉진층을 이용하는 히트싱크어셈블리 및 그 제조방법
US6173760B1 (en) * 1998-08-04 2001-01-16 International Business Machines Corporation Co-axial bellows liquid heatsink for high power module test
JP2941801B1 (ja) * 1998-09-17 1999-08-30 北川工業株式会社 熱伝導材
EP1372864B1 (de) * 2001-02-28 2006-10-18 Porter Instrument Company, Inc. Mit einem verteiler versehenes fluidabgabesystem
KR100895522B1 (ko) * 2001-03-28 2009-04-30 니혼폴리올레핀 가부시키가이샤 접착성 수지 조성물 및 그것을 이용한 다층 적층 구조체
EP1328143A1 (de) * 2002-01-10 2003-07-16 Wen-Chen Wei Biegsames Wärmerohr
WO2006125152A2 (en) * 2005-05-19 2006-11-23 Parker Hannifin Corporation Thermal lamination module
US7272006B2 (en) * 2005-09-30 2007-09-18 Intel Corporation IC coolant microchannel assembly with integrated attachment hardware
US7849914B2 (en) * 2006-05-02 2010-12-14 Clockspeed, Inc. Cooling apparatus for microelectronic devices
JP4697475B2 (ja) * 2007-05-21 2011-06-08 トヨタ自動車株式会社 パワーモジュールの冷却器及びパワーモジュール
JP6008582B2 (ja) * 2012-05-28 2016-10-19 新光電気工業株式会社 半導体パッケージ、放熱板及びその製造方法
US11006548B2 (en) * 2013-02-01 2021-05-11 Smart Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
CN105045126B (zh) * 2015-08-17 2019-01-11 珠海美光原科技股份有限公司 智能温度控制系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US4237086A (en) * 1979-02-22 1980-12-02 Rockwell International Corporation Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
US4489570A (en) * 1982-12-01 1984-12-25 The Board Of Trustees Of The Leland Stanford Junior University Fast cooldown miniature refrigerators
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
US4546410A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4666545A (en) * 1984-06-27 1987-05-19 The Bergquist Company Method of making a mounting base pad for semiconductor devices
JPS6115353A (ja) * 1984-06-29 1986-01-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション チツプ冷却装置
JPH06101523B2 (ja) * 1985-03-04 1994-12-12 株式会社日立製作所 集積回路チツプ冷却装置
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices

Also Published As

Publication number Publication date
EP0241290A1 (de) 1987-10-14
EP0241290B1 (de) 1990-07-04
US4794981A (en) 1989-01-03
JPS62238653A (ja) 1987-10-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee