DE3786844D1 - Packung fuer integrierte schaltung. - Google Patents
Packung fuer integrierte schaltung.Info
- Publication number
- DE3786844D1 DE3786844D1 DE8787304862T DE3786844T DE3786844D1 DE 3786844 D1 DE3786844 D1 DE 3786844D1 DE 8787304862 T DE8787304862 T DE 8787304862T DE 3786844 T DE3786844 T DE 3786844T DE 3786844 D1 DE3786844 D1 DE 3786844D1
- Authority
- DE
- Germany
- Prior art keywords
- package
- integrated circuit
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
- H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
- H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12773986 | 1986-06-02 | ||
JP62125733A JPS63107055A (ja) | 1986-06-02 | 1987-05-25 | 集積回路用パッケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3786844D1 true DE3786844D1 (de) | 1993-09-09 |
DE3786844T2 DE3786844T2 (de) | 1993-11-11 |
Family
ID=26462067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87304862T Expired - Fee Related DE3786844T2 (de) | 1986-06-02 | 1987-06-02 | Packung für integrierte Schaltung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4881116A (de) |
EP (1) | EP0249378B1 (de) |
CA (1) | CA1320006C (de) |
DE (1) | DE3786844T2 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4922325A (en) * | 1987-10-02 | 1990-05-01 | American Telephone And Telegraph Company | Multilayer ceramic package with high frequency connections |
EP0331289A3 (de) * | 1988-02-26 | 1991-04-03 | Hitachi, Ltd. | Halbleiteranordnung mit Impedanz-Anpassungsmitteln |
US5132770A (en) * | 1988-08-25 | 1992-07-21 | Kabushiki Kaisha Toshiba | Semiconductor device having improved multi-layered substrate structure |
GB2233821A (en) * | 1989-07-11 | 1991-01-16 | Oxley Dev Co Ltd | Ceramic package including a semiconductor chip |
EP0412528A3 (en) * | 1989-08-11 | 1993-01-20 | Fujitsu Limited | Electronic circuit package and production thereof |
US5206986A (en) * | 1989-08-11 | 1993-05-04 | Fujitsu Limited | Method of producing an electronic circuit package |
FR2655195B1 (fr) * | 1989-11-24 | 1997-07-18 | Mitsubishi Electric Corp | Dispositif a semiconducteurs comportant un blindage contre le rayonnement electromagnetique et procede de fabrication. |
US5256590A (en) * | 1989-11-24 | 1993-10-26 | Mitsubishi Denki Kabushiki Kaisha | Method of making a shielded semiconductor device |
JPH0766949B2 (ja) * | 1990-09-28 | 1995-07-19 | 富士通株式会社 | Icパッケージ |
JPH04256203A (ja) * | 1991-02-07 | 1992-09-10 | Mitsubishi Electric Corp | マイクロ波帯ic用パッケージ |
JP2766920B2 (ja) * | 1992-01-07 | 1998-06-18 | 三菱電機株式会社 | Icパッケージ及びその実装方法 |
US5283463A (en) * | 1992-03-05 | 1994-02-01 | Westinghouse Electric Corp. | High power self commutating semiconductor switch |
US5468994A (en) * | 1992-12-10 | 1995-11-21 | Hewlett-Packard Company | High pin count package for semiconductor device |
US5338970A (en) * | 1993-03-24 | 1994-08-16 | Intergraph Corporation | Multi-layered integrated circuit package with improved high frequency performance |
US5753972A (en) * | 1993-10-08 | 1998-05-19 | Stratedge Corporation | Microelectronics package |
US5465008A (en) * | 1993-10-08 | 1995-11-07 | Stratedge Corporation | Ceramic microelectronics package |
US6172412B1 (en) * | 1993-10-08 | 2001-01-09 | Stratedge Corporation | High frequency microelectronics package |
US5736783A (en) * | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
US5631807A (en) * | 1995-01-20 | 1997-05-20 | Minnesota Mining And Manufacturing Company | Electronic circuit structure with aperture suspended component |
US5602421A (en) * | 1995-01-31 | 1997-02-11 | Hughes Aircraft Company | Microwave monolithic integrated circuit package with improved RF ports |
US5650760A (en) * | 1995-11-13 | 1997-07-22 | Hughes Aircraft Company | Microwave enclosure |
US6301122B1 (en) | 1996-06-13 | 2001-10-09 | Matsushita Electric Industrial Co., Ltd. | Radio frequency module with thermally and electrically coupled metal film on insulating substrate |
AU4902897A (en) | 1996-11-08 | 1998-05-29 | W.L. Gore & Associates, Inc. | Method for improving reliability of thin circuit substrates by increasing the T of the substrate |
US5955704A (en) * | 1996-11-21 | 1999-09-21 | Dell U.S.A., L.P. | Optimal PWA high density routing to minimize EMI substrate coupling in a computer system |
FR2769130B1 (fr) * | 1997-09-30 | 2001-06-08 | Thomson Csf | Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede |
EP1298728A1 (de) * | 2001-09-27 | 2003-04-02 | Agilent Technologies, Inc. (a Delaware corporation) | Halbleitergehäuse mit einer Abschirmungeinrichtung gegen elektromagnetische Interferenzen |
US6960490B2 (en) * | 2002-03-14 | 2005-11-01 | Epitactix Pty Ltd. | Method and resulting structure for manufacturing semiconductor substrates |
JP3938742B2 (ja) * | 2002-11-18 | 2007-06-27 | Necエレクトロニクス株式会社 | 電子部品装置及びその製造方法 |
US20070251883A1 (en) * | 2006-04-28 | 2007-11-01 | Niu Q Jason | Reverse Osmosis Membrane with Branched Poly(Alkylene Oxide) Modified Antifouling Surface |
JP2010034212A (ja) * | 2008-07-28 | 2010-02-12 | Toshiba Corp | 高周波セラミックパッケージおよびその作製方法 |
TWI446506B (zh) * | 2011-01-05 | 2014-07-21 | Unimicron Technology Corp | 具開口之封裝基板及其製法 |
JP7156641B2 (ja) | 2019-02-14 | 2022-10-19 | 住友電工デバイス・イノベーション株式会社 | 半導体装置用のパッケージおよび半導体装置 |
CN113838826A (zh) * | 2020-06-23 | 2021-12-24 | 华邦电子股份有限公司 | 封装结构及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5854661A (ja) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | 多層セラミツク半導体パツケ−ジ |
JPS58190046A (ja) * | 1982-04-30 | 1983-11-05 | Fujitsu Ltd | 半導体装置 |
US4551746A (en) * | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
US4560962A (en) * | 1983-08-30 | 1985-12-24 | Burroughs Corporation | Multilayered printed circuit board with controlled 100 ohm impedance |
JPS60134440A (ja) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | 半導体集積回路装置 |
US4673904A (en) * | 1984-11-14 | 1987-06-16 | Itt Corporation | Micro-coaxial substrate |
-
1987
- 1987-05-28 CA CA000538310A patent/CA1320006C/en not_active Expired - Fee Related
- 1987-06-02 DE DE87304862T patent/DE3786844T2/de not_active Expired - Fee Related
- 1987-06-02 EP EP87304862A patent/EP0249378B1/de not_active Expired - Lifetime
-
1989
- 1989-05-02 US US07/346,243 patent/US4881116A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0249378A3 (en) | 1988-10-12 |
EP0249378A2 (de) | 1987-12-16 |
DE3786844T2 (de) | 1993-11-11 |
EP0249378B1 (de) | 1993-08-04 |
US4881116A (en) | 1989-11-14 |
CA1320006C (en) | 1993-07-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |