FR2655195B1 - Dispositif a semiconducteurs comportant un blindage contre le rayonnement electromagnetique et procede de fabrication. - Google Patents
Dispositif a semiconducteurs comportant un blindage contre le rayonnement electromagnetique et procede de fabrication.Info
- Publication number
- FR2655195B1 FR2655195B1 FR9014645A FR9014645A FR2655195B1 FR 2655195 B1 FR2655195 B1 FR 2655195B1 FR 9014645 A FR9014645 A FR 9014645A FR 9014645 A FR9014645 A FR 9014645A FR 2655195 B1 FR2655195 B1 FR 2655195B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- semiconductor device
- electromagnetic radiation
- radiation shielding
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30112589 | 1989-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2655195A1 FR2655195A1 (fr) | 1991-05-31 |
FR2655195B1 true FR2655195B1 (fr) | 1997-07-18 |
Family
ID=17893127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9014645A Expired - Fee Related FR2655195B1 (fr) | 1989-11-24 | 1990-11-23 | Dispositif a semiconducteurs comportant un blindage contre le rayonnement electromagnetique et procede de fabrication. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2655195B1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04183001A (ja) * | 1990-11-16 | 1992-06-30 | Mitsubishi Electric Corp | マイクロ波ic用パッケージ |
US5581217A (en) * | 1995-09-21 | 1996-12-03 | Hughes Aircraft Company | Microwave shielding structures comprising parallel-plate waveguide |
DE10309614A1 (de) * | 2003-03-05 | 2004-09-23 | Infineon Technologies Ag | Halbleiterstruktur und Verfahren zur Herstellung derselben |
FR2932355A1 (fr) * | 2008-06-06 | 2009-12-11 | Thales Sa | Boitier hyperfrequence a isolation amelioree. |
JP5518086B2 (ja) * | 2009-09-29 | 2014-06-11 | 京セラ株式会社 | 素子収納用パッケージおよび実装構造体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS547196B2 (fr) * | 1971-08-26 | 1979-04-04 | ||
JPS61135211A (ja) * | 1984-12-05 | 1986-06-23 | Mitsubishi Electric Corp | マイクロ波半導体増幅器 |
JPH0669040B2 (ja) * | 1985-05-13 | 1994-08-31 | 株式会社東芝 | 光半導体装置 |
CA1320006C (fr) * | 1986-06-02 | 1993-07-06 | Norio Hidaka | Boitier de circuit integre |
JPH0793392B2 (ja) * | 1986-10-25 | 1995-10-09 | 新光電気工業株式会社 | 超高周波素子用パツケ−ジ |
JPS63143856A (ja) * | 1986-12-08 | 1988-06-16 | Nec Corp | 半導体装置 |
JPS6417446A (en) * | 1987-07-13 | 1989-01-20 | Toshiba Corp | Semiconductor device and manufacture thereof |
US4922325A (en) * | 1987-10-02 | 1990-05-01 | American Telephone And Telegraph Company | Multilayer ceramic package with high frequency connections |
JPH01265606A (ja) * | 1988-04-15 | 1989-10-23 | Matsushita Electric Works Ltd | 高周波用増幅器 |
JPH0272660A (ja) * | 1988-09-07 | 1990-03-12 | Kawasaki Steel Corp | 半導体装置 |
JPH02222598A (ja) * | 1989-02-23 | 1990-09-05 | Fujitsu Ltd | 半導体装置モジュール |
EP0393584B1 (fr) * | 1989-04-17 | 1994-07-13 | Matsushita Electric Industrial Co., Ltd. | Dispositif semi-conducteur à haute fréquence |
-
1990
- 1990-11-23 FR FR9014645A patent/FR2655195B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2655195A1 (fr) | 1991-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |