FR2525849B1 - Substrat de circuit imprime - Google Patents

Substrat de circuit imprime

Info

Publication number
FR2525849B1
FR2525849B1 FR8207127A FR8207127A FR2525849B1 FR 2525849 B1 FR2525849 B1 FR 2525849B1 FR 8207127 A FR8207127 A FR 8207127A FR 8207127 A FR8207127 A FR 8207127A FR 2525849 B1 FR2525849 B1 FR 2525849B1
Authority
FR
France
Prior art keywords
printed circuit
circuit substrate
substrate
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8207127A
Other languages
English (en)
Other versions
FR2525849A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hutchinson SA
Original Assignee
Hutchinson SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hutchinson SA filed Critical Hutchinson SA
Priority to FR8207127A priority Critical patent/FR2525849B1/fr
Publication of FR2525849A1 publication Critical patent/FR2525849A1/fr
Application granted granted Critical
Publication of FR2525849B1 publication Critical patent/FR2525849B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
FR8207127A 1982-04-26 1982-04-26 Substrat de circuit imprime Expired FR2525849B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8207127A FR2525849B1 (fr) 1982-04-26 1982-04-26 Substrat de circuit imprime

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8207127A FR2525849B1 (fr) 1982-04-26 1982-04-26 Substrat de circuit imprime

Publications (2)

Publication Number Publication Date
FR2525849A1 FR2525849A1 (fr) 1983-10-28
FR2525849B1 true FR2525849B1 (fr) 1985-08-09

Family

ID=9273370

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8207127A Expired FR2525849B1 (fr) 1982-04-26 1982-04-26 Substrat de circuit imprime

Country Status (1)

Country Link
FR (1) FR2525849B1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196865B1 (fr) * 1985-03-27 1990-09-12 Ibiden Co, Ltd. Substrats pour circuits électroniques
DE3567140D1 (en) * 1985-08-14 1989-02-02 Toray Industries Laminate board containing uniformly distributed filler particles and method for producing the same
DE3735109A1 (de) * 1987-10-16 1989-05-03 Basf Ag Leiterplatte
JPH02296389A (ja) * 1989-05-11 1990-12-06 Japan Gore Tex Inc 印刷回路基板
JPH08501185A (ja) * 1992-05-29 1996-02-06 エム−ラッド エレクトロマグネティック テクノロジー リミテッド プリント回路用基板
FR2713139B1 (fr) * 1993-12-03 1995-12-29 Loic Demeure Support métallisé à base de mousse organique, assemblage d'au moins deux de ces supports et procédé de fabrication de ce support.
FR2770448B1 (fr) * 1997-11-06 1999-12-10 Euramax Coated Products Sa Plaque composite directement formable a froid, procede de fabrication et utilisation pour enseignes
DE19952246A1 (de) * 1998-11-04 2000-05-31 Thomson Brandt Gmbh Elektromechanisches Bauteil
JP3243461B2 (ja) * 1999-07-30 2002-01-07 川崎重工業株式会社 サンドイッチ構造
US6703114B1 (en) * 2002-10-17 2004-03-09 Arlon Laminate structures, methods for production thereof and uses therefor
DE10356882A1 (de) 2003-12-03 2005-11-03 Langenfelder, Dieter Verfahren zur Herstellung eines elektromechanischen Bauteils

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3263023A (en) * 1964-04-09 1966-07-26 Westinghouse Electric Corp Printed circuits on honeycomb support with pierceable insulation therebetween
NL7607048A (nl) * 1976-06-28 1977-12-30 Philips Nv Dragerplaat voor gedrukte bedradingen.
DE2814633A1 (de) * 1978-04-05 1979-10-11 Guenther Dr Ing Herrmann Basismaterialien zur herstellung gedruckter schaltungen
FR2462840A1 (fr) * 1979-07-31 1981-02-13 Pisante Jacques Nouveau procede et dispositif pour la realisation de circuits electriques

Also Published As

Publication number Publication date
FR2525849A1 (fr) 1983-10-28

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Legal Events

Date Code Title Description
ST Notification of lapse