KR830001068U - 인쇄 회로기판 - Google Patents

인쇄 회로기판

Info

Publication number
KR830001068U
KR830001068U KR2019810005023U KR810005023U KR830001068U KR 830001068 U KR830001068 U KR 830001068U KR 2019810005023 U KR2019810005023 U KR 2019810005023U KR 810005023 U KR810005023 U KR 810005023U KR 830001068 U KR830001068 U KR 830001068U
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Application number
KR2019810005023U
Other languages
English (en)
Other versions
KR850000216Y1 (ko
Inventor
도시오 다까시
미쯔오 오오자와
Original Assignee
소니 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 가부시끼 가이샤 filed Critical 소니 가부시끼 가이샤
Publication of KR830001068U publication Critical patent/KR830001068U/ko
Application granted granted Critical
Publication of KR850000216Y1 publication Critical patent/KR850000216Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
KR2019810005023U 1980-07-17 1981-07-15 인쇄 회로기판 KR850000216Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1980101141U JPS5724775U (ko) 1980-07-17 1980-07-17
JP151672 1980-10-29

Publications (2)

Publication Number Publication Date
KR830001068U true KR830001068U (ko) 1983-09-22
KR850000216Y1 KR850000216Y1 (ko) 1985-02-15

Family

ID=14292798

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019810005023U KR850000216Y1 (ko) 1980-07-17 1981-07-15 인쇄 회로기판

Country Status (9)

Country Link
US (1) US4413309A (ko)
JP (1) JPS5724775U (ko)
KR (1) KR850000216Y1 (ko)
AU (1) AU543036B2 (ko)
CA (1) CA1170782A (ko)
DE (1) DE3128409A1 (ko)
FR (1) FR2487153A1 (ko)
GB (1) GB2080629B (ko)
NL (1) NL8103388A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190105954A (ko) * 2018-03-07 2019-09-18 박노정 양식망 고정구

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US4658332A (en) * 1983-04-04 1987-04-14 Raytheon Company Compliant layer printed circuit board
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
DE3420497A1 (de) * 1983-07-14 1985-01-31 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum schaltungsmaessigen ergaenzen einer in dickschichttechnik beschalteten dickschichtschaltungsplatine sowie mit hilfe dieses verfahrens hergestellte abstimmvorrichtung
GB8322473D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
GB8322474D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
FR2555010B1 (fr) * 1983-11-15 1986-08-29 Thomson Csf Procede de brasage a la vague et capteur capillaire de brasure mettant en oeuvre ce procede
US4605987A (en) * 1983-12-22 1986-08-12 Motorola, Inc. Method of controlling printed circuit board solder fillets and printed circuit boards including solder fillet control patterns
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
DE3445625A1 (de) * 1984-12-14 1986-06-26 Pulsotronic Merten Gmbh & Co Kg, 5270 Gummersbach Verfahren zum loeten einer beidseitig mit smd-bauelementen bestueckten leiterbahnenplatine und eine nach diesem verfahren geloetete platine
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
JPS62184785U (ko) * 1986-05-16 1987-11-24
US4851966A (en) * 1986-11-10 1989-07-25 Motorola, Inc. Method and apparatus of printed circuit board assembly with optimal placement of components
US4739917A (en) * 1987-01-12 1988-04-26 Ford Motor Company Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
US4806706A (en) * 1987-04-08 1989-02-21 Nippon Cmk Corp. Printed wiring board
US4779339A (en) * 1987-05-06 1988-10-25 Nippon Cmk Corporation Method of producing printed circuit boards
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
JPS63195772U (ko) * 1987-06-05 1988-12-16
US4881906A (en) * 1988-02-25 1989-11-21 Helwett-Packard Company Method for obtaining electrical interconnect using a solderable mechanical fastener
US4965700A (en) * 1988-05-26 1990-10-23 International Business Machines Corporation Thin film package for mixed bonding of chips
US4859808A (en) * 1988-06-28 1989-08-22 Delco Electronics Corporation Electrical conductor having unique solder dam configuration
US4893216A (en) * 1988-08-09 1990-01-09 Northern Telecom Limited Circuit board and method of soldering
US4982892A (en) * 1989-11-09 1991-01-08 International Business Machines Corporation Solder interconnects for selective line coupling
JPH03122578U (ko) * 1990-03-26 1991-12-13
US5384433A (en) * 1991-10-29 1995-01-24 Aptix Corporation Printed circuit structure including power, decoupling and signal termination
US5243140A (en) * 1991-10-04 1993-09-07 International Business Machines Corporation Direct distribution repair and engineering change system
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5723823A (en) * 1994-06-09 1998-03-03 Dell Usa, L.P. Circuit board with enhanced rework configuration
JP2673098B2 (ja) * 1994-08-03 1997-11-05 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント配線基板及び実装構造体
US5637835A (en) * 1995-05-26 1997-06-10 The Foxboro Company Automatic test detection of unsoldered thru-hole connector leads
JPH0964244A (ja) * 1995-08-17 1997-03-07 Hitachi Ltd 半導体装置およびその製造方法
US6492598B1 (en) 1995-11-30 2002-12-10 Micron Technology, Inc. Printed circuit board assembly and method for making a printed circuit board assembly
US5738269A (en) * 1996-04-19 1998-04-14 Motorola, Inc. Method for forming a solder bump
JP3420076B2 (ja) * 1998-08-31 2003-06-23 新光電気工業株式会社 フリップチップ実装基板の製造方法及びフリップチップ実装基板及びフリップチップ実装構造
US6294742B1 (en) * 1999-07-27 2001-09-25 Agilent Technologies, Inc. Apparatus and method for adapting surface mount solder pad for heat sink function
KR20010017187A (ko) * 1999-08-09 2001-03-05 윤종용 인쇄 회로 기판 및 이 인쇄 회로 기판의 스크린 프린팅을 위한마스크
US6223973B1 (en) * 1999-11-16 2001-05-01 Visteon Global Technologies, Inc. Apparatus and method for connecting printed circuit boards through soldered lap joints
US7645940B2 (en) * 2004-02-06 2010-01-12 Solectron Corporation Substrate with via and pad structures
US7190157B2 (en) * 2004-10-25 2007-03-13 Agilent Technologies, Inc. Method and apparatus for layout independent test point placement on a printed circuit board
JP4948452B2 (ja) * 2008-03-10 2012-06-06 パナソニック株式会社 表面実装デバイスの実装構造体、及び表面実装デバイスの補強実装方法
ITMI20111777A1 (it) * 2011-09-30 2013-03-31 St Microelectronics Srl Sistema elettronico per saldatura ad onda
TW201352078A (zh) * 2012-06-05 2013-12-16 Hon Hai Prec Ind Co Ltd 印刷電路板
AT14221U1 (de) * 2014-05-19 2015-06-15 Tridonic Gmbh & Co Kg Leuchtmittel mit LED und Verfahren zur Montage
DE102017209097A1 (de) * 2017-05-31 2018-12-06 Robert Bosch Gmbh Verbindungsanordnung und korrespondierendes Verfahren zur Montage eines elektronischen Bauteils auf einer Leiterplatte
US20230047568A1 (en) * 2021-08-10 2023-02-16 Imagine Tf, Llc Printed circuit boards with embossed metalized circuit traces

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US3431350A (en) * 1966-03-31 1969-03-04 Texas Instruments Inc Circuit board
US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
US3621116A (en) * 1969-12-29 1971-11-16 Bertram C Adams Printed circuit board
GB1392619A (en) * 1972-06-07 1975-04-30 Jermyn T Jermyn Ind Circuit board
DE2154958C3 (de) * 1971-11-05 1976-01-08 Norddeutsche Mende Rundfunk Kg, 2800 Bremen Sicherheitslötstelle in hochspannungsführenden Leiterbahnen in gedruckten Schaltungen
DE2228218B1 (de) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum tauchloeten von traegerplaettchen
US3805117A (en) * 1972-12-12 1974-04-16 Rca Corp Hybrid electron device containing semiconductor chips
GB1416671A (en) * 1973-02-14 1975-12-03 Siemens Ag Layer circuits
JPS5441102B2 (ko) * 1975-03-04 1979-12-06
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
GB2034127B (en) * 1978-10-13 1983-05-18 Matsushita Electric Ind Co Ltd Printed circuits and methods their manufacture
JPS5582487A (en) * 1978-12-18 1980-06-21 Sony Corp Electronic circuit device
FR2479639A1 (fr) * 1980-03-25 1981-10-02 Thomson Csf Dispositif d'assemblage entre composants electroniques de caracteristiques mecaniques differentes et son procede de realisation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190105954A (ko) * 2018-03-07 2019-09-18 박노정 양식망 고정구

Also Published As

Publication number Publication date
AU543036B2 (en) 1985-03-28
GB2080629B (en) 1983-09-01
DE3128409A1 (de) 1982-03-25
AU7280381A (en) 1982-01-21
GB2080629A (en) 1982-02-03
NL8103388A (nl) 1982-02-16
US4413309A (en) 1983-11-01
FR2487153A1 (fr) 1982-01-22
CA1170782A (en) 1984-07-10
KR850000216Y1 (ko) 1985-02-15
FR2487153B1 (ko) 1985-03-22
JPS5724775U (ko) 1982-02-08

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