JPS5582487A - Electronic circuit device - Google Patents

Electronic circuit device

Info

Publication number
JPS5582487A
JPS5582487A JP15781778A JP15781778A JPS5582487A JP S5582487 A JPS5582487 A JP S5582487A JP 15781778 A JP15781778 A JP 15781778A JP 15781778 A JP15781778 A JP 15781778A JP S5582487 A JPS5582487 A JP S5582487A
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit device
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15781778A
Other languages
Japanese (ja)
Other versions
JPS6149838B2 (en
Inventor
Mitsuo Oosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP15781778A priority Critical patent/JPS5582487A/en
Priority to GB7943132A priority patent/GB2037489B/en
Priority to DE19792950450 priority patent/DE2950450A1/en
Priority to IT42915/79A priority patent/IT1193457B/en
Priority to CA000342057A priority patent/CA1140680A/en
Priority to NL7909108A priority patent/NL7909108A/en
Publication of JPS5582487A publication Critical patent/JPS5582487A/en
Publication of JPS6149838B2 publication Critical patent/JPS6149838B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772Conductors directly under a component but not electrically connected to the component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10363Jumpers, i.e. non-printed cross-over connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/1053Mounted components directly electrically connected to each other, i.e. not via the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10583Cylindrically shaped component; Fixing means therefore
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305Affixing by adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
JP15781778A 1978-12-18 1978-12-18 Electronic circuit device Granted JPS5582487A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP15781778A JPS5582487A (en) 1978-12-18 1978-12-18 Electronic circuit device
GB7943132A GB2037489B (en) 1978-12-18 1979-12-14 Circuit components interconnected by solder layers
DE19792950450 DE2950450A1 (en) 1978-12-18 1979-12-14 ELECTRONIC CIRCUIT FIXED ON PRINTED CIRCUIT BOARD
IT42915/79A IT1193457B (en) 1978-12-18 1979-12-17 ELECTRONIC CIRCUIT COMPLEX MOUNTED ON A PRINTED CIRCUIT PANEL
CA000342057A CA1140680A (en) 1978-12-18 1979-12-17 Electronic circuit arrangement mounted on printed circuit board
NL7909108A NL7909108A (en) 1978-12-18 1979-12-18 ELECTRONIC CIRCUIT MOUNTED ON A PRINTED WIRING BOARD.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15781778A JPS5582487A (en) 1978-12-18 1978-12-18 Electronic circuit device

Publications (2)

Publication Number Publication Date
JPS5582487A true JPS5582487A (en) 1980-06-21
JPS6149838B2 JPS6149838B2 (en) 1986-10-31

Family

ID=15657940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15781778A Granted JPS5582487A (en) 1978-12-18 1978-12-18 Electronic circuit device

Country Status (6)

Country Link
JP (1) JPS5582487A (en)
CA (1) CA1140680A (en)
DE (1) DE2950450A1 (en)
GB (1) GB2037489B (en)
IT (1) IT1193457B (en)
NL (1) NL7909108A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724775U (en) * 1980-07-17 1982-02-08
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
JPS61210601A (en) * 1985-03-14 1986-09-18 進工業株式会社 Chip resistor
FR2584887A1 (en) * 1985-07-12 1987-01-16 Thomson Semi Conducteurs BIPOLE HOUSING FOR SURFACE COMPONENT AND PACKAGING OF HOUSINGS ACCORDING TO THE INVENTION
US4801904A (en) * 1986-01-14 1989-01-31 Murata Manufacturing Co., Ltd. Chip-like LC filter
DE3619212A1 (en) * 1986-06-07 1987-12-10 Philips Patentverwaltung PASSIVE ELECTRICAL COMPONENT
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US4755785A (en) * 1987-01-29 1988-07-05 Bel Fuse Inc. Surface mounted fuse assembly
DE4126913A1 (en) * 1991-08-14 1993-02-18 Siemens Ag METHOD FOR SOLDERING AND ASSEMBLING PCBS WITH COMPONENTS
JP3152834B2 (en) * 1993-06-24 2001-04-03 株式会社東芝 Electronic circuit device
JP7390969B2 (en) 2020-05-12 2023-12-04 株式会社豊田中央研究所 Ring for spinning machine and its manufacturing method

Also Published As

Publication number Publication date
NL7909108A (en) 1980-06-20
IT1193457B (en) 1988-06-22
IT7942915A0 (en) 1979-12-17
GB2037489B (en) 1983-05-05
DE2950450A1 (en) 1980-07-03
GB2037489A (en) 1980-07-09
JPS6149838B2 (en) 1986-10-31
CA1140680A (en) 1983-02-01

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