DE3877699D1 - Hochtemperatur-trennfolie fuer gedruckte schaltungsplatten. - Google Patents

Hochtemperatur-trennfolie fuer gedruckte schaltungsplatten.

Info

Publication number
DE3877699D1
DE3877699D1 DE8888310261T DE3877699T DE3877699D1 DE 3877699 D1 DE3877699 D1 DE 3877699D1 DE 8888310261 T DE8888310261 T DE 8888310261T DE 3877699 T DE3877699 T DE 3877699T DE 3877699 D1 DE3877699 D1 DE 3877699D1
Authority
DE
Germany
Prior art keywords
high temperature
printed circuit
circuit boards
partition film
temperature partition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888310261T
Other languages
English (en)
Other versions
DE3877699T2 (de
Inventor
Peter Andrew Sipos
Erica Marie-Jose Besso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Canada Inc
Original Assignee
DuPont Canada Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DuPont Canada Inc filed Critical DuPont Canada Inc
Application granted granted Critical
Publication of DE3877699D1 publication Critical patent/DE3877699D1/de
Publication of DE3877699T2 publication Critical patent/DE3877699T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8888310261T 1987-11-03 1988-11-01 Hochtemperatur-trennfolie fuer gedruckte schaltungsplatten. Expired - Fee Related DE3877699T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878725746A GB8725746D0 (en) 1987-11-03 1987-11-03 Release sheet for printed circuit board

Publications (2)

Publication Number Publication Date
DE3877699D1 true DE3877699D1 (de) 1993-03-04
DE3877699T2 DE3877699T2 (de) 1993-07-01

Family

ID=10626372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888310261T Expired - Fee Related DE3877699T2 (de) 1987-11-03 1988-11-01 Hochtemperatur-trennfolie fuer gedruckte schaltungsplatten.

Country Status (6)

Country Link
US (2) US4966960A (de)
EP (1) EP0315407B1 (de)
JP (1) JPH01159217A (de)
CA (1) CA1310781C (de)
DE (1) DE3877699T2 (de)
GB (1) GB8725746D0 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1296833C (en) * 1988-04-05 1992-03-03 Erica Marie-Jose Besso Polymethylpentene release sheet
JP3029487B2 (ja) * 1991-05-13 2000-04-04 住友ベークライト株式会社 銅張積層板の製造方法
DE4204685A1 (de) * 1992-02-17 1993-08-19 Basf Ag Verfahren zur herstellung von formteilen
US5709931A (en) * 1995-08-09 1998-01-20 Ahlstrom Filtration Inc. Release liners for production of molded products
US6593400B1 (en) † 1999-06-30 2003-07-15 Minerals Technologies Inc. Talc antiblock compositions and method of preparation
KR20030033624A (ko) * 2001-10-24 2003-05-01 주식회사 효성 마스터배치를 이용한 폴리아미드 수지조성물 및폴리아미드 필름과 이들의 제조방법
TWI303959B (en) * 2003-01-17 2008-12-01 Matsushita Electric Ind Co Ltd Manufacturing method of substrate, release sheet, manufacturing method of substrate, and manufacturing method using the same
US20080122141A1 (en) * 2006-11-29 2008-05-29 Bryan Bedal Sinterable Powder

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2705227A (en) * 1954-03-15 1955-03-29 Du Pont Heat stabilization of polyamides
US3340339A (en) * 1963-06-07 1967-09-05 Du Pont Method of incorporating a phosphinate and particulate material in a polyamide to make low friction filament
GB1073505A (en) * 1964-04-29 1967-06-28 Du Pont Improvements relating to carbonamides
GB1530257A (en) * 1975-11-18 1978-10-25 Tba Industrial Products Ltd Reinforced thermoplastic materials
US4339556A (en) * 1977-11-02 1982-07-13 Monsanto Company Flame retardant resin compositions
DE3067169D1 (en) * 1979-10-10 1984-04-26 Allied Corp Polyamide release film for sheet molding compound, sheet compound prepared therewith and process of making
US4399556A (en) * 1982-03-12 1983-08-16 Whidden Glenn H Device for locating audio surveillance apparatus
CA1230526A (en) * 1983-12-09 1987-12-22 Martin J. Wilheim Mold release sheet and method of manufacture
JPS61241341A (ja) * 1985-04-19 1986-10-27 Aisero Kagaku Kk 金属製品包装用ポリオレフイン系樹脂組成物
US4786678A (en) * 1986-12-29 1988-11-22 Mobil Oil Corporation Method of producing films from polyethylene resin, an additive and a second polymeric resin
US4810745A (en) * 1987-07-16 1989-03-07 Century Adhesives Corp. Cold-seal adhesives and comestible packages formed therewith

Also Published As

Publication number Publication date
EP0315407B1 (de) 1993-01-20
CA1310781C (en) 1992-11-24
GB8725746D0 (en) 1987-12-09
EP0315407A3 (en) 1990-01-17
DE3877699T2 (de) 1993-07-01
US4966960A (en) 1990-10-30
JPH01159217A (ja) 1989-06-22
US5043041A (en) 1991-08-27
EP0315407A2 (de) 1989-05-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee