DE3877699D1 - Hochtemperatur-trennfolie fuer gedruckte schaltungsplatten. - Google Patents
Hochtemperatur-trennfolie fuer gedruckte schaltungsplatten.Info
- Publication number
- DE3877699D1 DE3877699D1 DE8888310261T DE3877699T DE3877699D1 DE 3877699 D1 DE3877699 D1 DE 3877699D1 DE 8888310261 T DE8888310261 T DE 8888310261T DE 3877699 T DE3877699 T DE 3877699T DE 3877699 D1 DE3877699 D1 DE 3877699D1
- Authority
- DE
- Germany
- Prior art keywords
- high temperature
- printed circuit
- circuit boards
- partition film
- temperature partition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
- B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB878725746A GB8725746D0 (en) | 1987-11-03 | 1987-11-03 | Release sheet for printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3877699D1 true DE3877699D1 (de) | 1993-03-04 |
DE3877699T2 DE3877699T2 (de) | 1993-07-01 |
Family
ID=10626372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888310261T Expired - Fee Related DE3877699T2 (de) | 1987-11-03 | 1988-11-01 | Hochtemperatur-trennfolie fuer gedruckte schaltungsplatten. |
Country Status (6)
Country | Link |
---|---|
US (2) | US4966960A (de) |
EP (1) | EP0315407B1 (de) |
JP (1) | JPH01159217A (de) |
CA (1) | CA1310781C (de) |
DE (1) | DE3877699T2 (de) |
GB (1) | GB8725746D0 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1296833C (en) * | 1988-04-05 | 1992-03-03 | Erica Marie-Jose Besso | Polymethylpentene release sheet |
JP3029487B2 (ja) * | 1991-05-13 | 2000-04-04 | 住友ベークライト株式会社 | 銅張積層板の製造方法 |
DE4204685A1 (de) * | 1992-02-17 | 1993-08-19 | Basf Ag | Verfahren zur herstellung von formteilen |
US5709931A (en) * | 1995-08-09 | 1998-01-20 | Ahlstrom Filtration Inc. | Release liners for production of molded products |
US6593400B1 (en) † | 1999-06-30 | 2003-07-15 | Minerals Technologies Inc. | Talc antiblock compositions and method of preparation |
KR20030033624A (ko) * | 2001-10-24 | 2003-05-01 | 주식회사 효성 | 마스터배치를 이용한 폴리아미드 수지조성물 및폴리아미드 필름과 이들의 제조방법 |
TWI303959B (en) * | 2003-01-17 | 2008-12-01 | Matsushita Electric Ind Co Ltd | Manufacturing method of substrate, release sheet, manufacturing method of substrate, and manufacturing method using the same |
US20080122141A1 (en) * | 2006-11-29 | 2008-05-29 | Bryan Bedal | Sinterable Powder |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2705227A (en) * | 1954-03-15 | 1955-03-29 | Du Pont | Heat stabilization of polyamides |
US3340339A (en) * | 1963-06-07 | 1967-09-05 | Du Pont | Method of incorporating a phosphinate and particulate material in a polyamide to make low friction filament |
GB1073505A (en) * | 1964-04-29 | 1967-06-28 | Du Pont | Improvements relating to carbonamides |
GB1530257A (en) * | 1975-11-18 | 1978-10-25 | Tba Industrial Products Ltd | Reinforced thermoplastic materials |
US4339556A (en) * | 1977-11-02 | 1982-07-13 | Monsanto Company | Flame retardant resin compositions |
EP0027191B1 (de) * | 1979-10-10 | 1984-03-21 | Allied Corporation | Polyamidtrennfolie für formbaren Schichtwerkstoff, damit hergestellter Schichtwerkstoff und Herstellungsverfahren |
US4399556A (en) * | 1982-03-12 | 1983-08-16 | Whidden Glenn H | Device for locating audio surveillance apparatus |
CA1230526A (en) * | 1983-12-09 | 1987-12-22 | Martin J. Wilheim | Mold release sheet and method of manufacture |
JPS61241341A (ja) * | 1985-04-19 | 1986-10-27 | Aisero Kagaku Kk | 金属製品包装用ポリオレフイン系樹脂組成物 |
US4786678A (en) * | 1986-12-29 | 1988-11-22 | Mobil Oil Corporation | Method of producing films from polyethylene resin, an additive and a second polymeric resin |
US4810745A (en) * | 1987-07-16 | 1989-03-07 | Century Adhesives Corp. | Cold-seal adhesives and comestible packages formed therewith |
-
1987
- 1987-11-03 GB GB878725746A patent/GB8725746D0/en active Pending
-
1988
- 1988-10-03 CA CA000582175A patent/CA1310781C/en not_active Expired - Lifetime
- 1988-10-27 JP JP63269603A patent/JPH01159217A/ja active Pending
- 1988-11-01 EP EP88310261A patent/EP0315407B1/de not_active Expired - Lifetime
- 1988-11-01 DE DE8888310261T patent/DE3877699T2/de not_active Expired - Fee Related
- 1988-11-02 US US07/266,878 patent/US4966960A/en not_active Expired - Lifetime
-
1990
- 1990-06-14 US US07/538,641 patent/US5043041A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0315407A2 (de) | 1989-05-10 |
CA1310781C (en) | 1992-11-24 |
DE3877699T2 (de) | 1993-07-01 |
EP0315407A3 (en) | 1990-01-17 |
EP0315407B1 (de) | 1993-01-20 |
US4966960A (en) | 1990-10-30 |
GB8725746D0 (en) | 1987-12-09 |
JPH01159217A (ja) | 1989-06-22 |
US5043041A (en) | 1991-08-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |