DE3873938D1 - Laminiertes substrat fuer integrierte schaltungen. - Google Patents

Laminiertes substrat fuer integrierte schaltungen.

Info

Publication number
DE3873938D1
DE3873938D1 DE8888300331T DE3873938T DE3873938D1 DE 3873938 D1 DE3873938 D1 DE 3873938D1 DE 8888300331 T DE8888300331 T DE 8888300331T DE 3873938 T DE3873938 T DE 3873938T DE 3873938 D1 DE3873938 D1 DE 3873938D1
Authority
DE
Germany
Prior art keywords
integrated circuits
laminated substrate
laminated
substrate
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888300331T
Other languages
English (en)
Other versions
DE3873938T2 (de
Inventor
Louis Michael Holleran
Gregory Albert Merkel
Robert John Paisley
Kathleen Ann Wexell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Application granted granted Critical
Publication of DE3873938D1 publication Critical patent/DE3873938D1/de
Publication of DE3873938T2 publication Critical patent/DE3873938T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Laminated Bodies (AREA)
  • Glass Compositions (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8888300331T 1987-02-18 1988-01-15 Laminiertes substrat fuer integrierte schaltungen. Expired - Fee Related DE3873938T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/015,992 US4775596A (en) 1987-02-18 1987-02-18 Composite substrate for integrated circuits

Publications (2)

Publication Number Publication Date
DE3873938D1 true DE3873938D1 (de) 1992-10-01
DE3873938T2 DE3873938T2 (de) 1993-03-04

Family

ID=21774762

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888300331T Expired - Fee Related DE3873938T2 (de) 1987-02-18 1988-01-15 Laminiertes substrat fuer integrierte schaltungen.

Country Status (5)

Country Link
US (1) US4775596A (de)
EP (1) EP0281220B1 (de)
JP (1) JPS63213948A (de)
KR (1) KR960006709B1 (de)
DE (1) DE3873938T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0301529B1 (de) * 1987-07-29 1992-05-13 MITSUI TOATSU CHEMICALS, Inc. Verfahren zur Gewinnung von Aluminiumnitrid und daraus hergestelltes Sinterprodukt
US5073526A (en) * 1988-01-27 1991-12-17 W. R. Grace & Co.-Conn. Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
US5017434A (en) * 1988-01-27 1991-05-21 Enloe Jack H Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
JP2952303B2 (ja) * 1988-11-15 1999-09-27 旭テクノグラス株式会社 複合型回路装置
US4906514A (en) * 1988-11-21 1990-03-06 Corning Incorporated Metallized substrate for electronic device
US4927711A (en) * 1988-12-23 1990-05-22 Corning Incorporated Hybrid circuits and thick film dielectrics used therein
US5200241A (en) * 1989-05-18 1993-04-06 General Electric Company Metal-ceramic structure with intermediate high temperature reaction barrier layer
US4973564A (en) * 1989-09-05 1990-11-27 Corning Incorporated Bonding frits for ceramic composites
US5830570A (en) * 1989-12-19 1998-11-03 Kyocera Corporation Aluminum nitride substrate and process for preparation thereof
US5080977A (en) * 1990-07-31 1992-01-14 United States Of America, As Represented By The Administrator, Nat'l. Aero. And Space Admin. Composite thermal barrier coating
JPH06296084A (ja) * 1993-02-12 1994-10-21 Ngk Spark Plug Co Ltd 高熱伝導体及びこれを備えた配線基板とこれらの製造方法
US6696103B1 (en) 1993-03-19 2004-02-24 Sumitomo Electric Industries, Ltd. Aluminium nitride ceramics and method for preparing the same
JP3593707B2 (ja) * 1993-03-19 2004-11-24 住友電気工業株式会社 窒化アルミニウムセラミックスとその製造方法
US5482903A (en) * 1993-12-22 1996-01-09 International Business Machines Corporation Aluminum nitride body utilizing a vitreous sintering additive
JP3467872B2 (ja) * 1994-12-02 2003-11-17 株式会社村田製作所 多層セラミック基板の製造方法
US6017485A (en) * 1996-03-28 2000-01-25 Carborundum Corporation Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
DE19815648C2 (de) * 1998-04-07 2000-07-13 Maxon Motor Gmbh Verfahren zum Herstellen eines Sintergleitlagers und Sintergleitlager
US6319757B1 (en) * 1998-07-08 2001-11-20 Caldus Semiconductor, Inc. Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
JP3407716B2 (ja) 2000-06-08 2003-05-19 株式会社村田製作所 複合積層電子部品
US20040238099A1 (en) * 2003-05-29 2004-12-02 Milano Vincent J. Economical method of manufacturing features in a ceramic circuit board
JP4722047B2 (ja) * 2004-07-29 2011-07-13 京セラ株式会社 機能素子及びその製造方法、並びに機能素子実装構造体
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3482149A (en) * 1967-05-16 1969-12-02 Sprague Electric Co Sintered glass integrated circuit structure product and method of making the same
US3978316A (en) * 1975-09-19 1976-08-31 Corning Glass Works Electrical heating unit
FR2451899A1 (fr) * 1979-03-23 1980-10-17 Labo Electronique Physique Composition dielectrique, encre serigraphiable comportant une telle composition, et produits obtenus
JPS57180005A (en) * 1981-04-30 1982-11-05 Hitachi Ltd Silicon carbide electric insulator with low dielectric constant
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
DE3376829D1 (en) * 1982-06-29 1988-07-07 Toshiba Kk Method for directly bonding ceramic and metal members and laminated body of the same
JPS61266350A (ja) * 1985-05-21 1986-11-26 株式会社日立製作所 配線回路用セラミック基板
FR2585015A1 (fr) * 1985-07-16 1987-01-23 Centre Nat Rech Scient Poudre ceramique de type cordierite frittable a basse temperature, procede de preparation et composition ceramique obtenue par frittage de cette poudre

Also Published As

Publication number Publication date
EP0281220A1 (de) 1988-09-07
DE3873938T2 (de) 1993-03-04
KR880010489A (ko) 1988-10-10
EP0281220B1 (de) 1992-08-26
JPS63213948A (ja) 1988-09-06
US4775596A (en) 1988-10-04
KR960006709B1 (ko) 1996-05-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee