FR2541511B1 - Substrat pour support de circuits integres - Google Patents

Substrat pour support de circuits integres

Info

Publication number
FR2541511B1
FR2541511B1 FR8402717A FR8402717A FR2541511B1 FR 2541511 B1 FR2541511 B1 FR 2541511B1 FR 8402717 A FR8402717 A FR 8402717A FR 8402717 A FR8402717 A FR 8402717A FR 2541511 B1 FR2541511 B1 FR 2541511B1
Authority
FR
France
Prior art keywords
substrate
integrated circuit
circuit support
support
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8402717A
Other languages
English (en)
Other versions
FR2541511A1 (fr
Inventor
Graham John Baldwin
Michael Owen Mccann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smiths Group PLC
Original Assignee
Smiths Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smiths Group PLC filed Critical Smiths Group PLC
Publication of FR2541511A1 publication Critical patent/FR2541511A1/fr
Application granted granted Critical
Publication of FR2541511B1 publication Critical patent/FR2541511B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8402717A 1983-02-22 1984-02-20 Substrat pour support de circuits integres Expired FR2541511B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838304890A GB8304890D0 (en) 1983-02-22 1983-02-22 Chip-carrier substrates

Publications (2)

Publication Number Publication Date
FR2541511A1 FR2541511A1 (fr) 1984-08-24
FR2541511B1 true FR2541511B1 (fr) 1987-06-05

Family

ID=10538408

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8402717A Expired FR2541511B1 (fr) 1983-02-22 1984-02-20 Substrat pour support de circuits integres

Country Status (3)

Country Link
US (1) US4509096A (fr)
FR (1) FR2541511B1 (fr)
GB (1) GB8304890D0 (fr)

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1229155A (fr) * 1983-03-29 1987-11-10 Toshihiko Watari Progiciel lsi a grande densite pour circuite logiques
US4600970A (en) * 1984-05-29 1986-07-15 Rca Corporation Leadless chip carriers having self-aligning mounting pads
DE3567771D1 (en) * 1984-11-02 1989-02-23 Siemens Ag Wave resistance-adapted chip support for a microwave semiconductor
US4835598A (en) * 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
GB8522159D0 (en) * 1985-09-06 1985-10-09 Lucas Elect Electron Syst Connection of electrical component
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
US4700276A (en) * 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US4700273A (en) * 1986-06-03 1987-10-13 Kaufman Lance R Circuit assembly with semiconductor expansion matched thermal path
US4730232A (en) * 1986-06-25 1988-03-08 Westinghouse Electric Corp. High density microelectronic packaging module for high speed chips
JPS6376444A (ja) * 1986-09-19 1988-04-06 Nec Corp チツプキヤリア
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
JPS6437132U (fr) * 1987-08-31 1989-03-06
CA1283225C (fr) * 1987-11-09 1991-04-16 Shinji Mine Systeme de refroidissement pour bloc de circuit integre tridimensionnel
US4860165A (en) * 1988-04-27 1989-08-22 Prime Computer, Inc. Semiconductor chip carrier package
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
US4937707A (en) * 1988-05-26 1990-06-26 International Business Machines Corporation Flexible carrier for an electronic device
US4987100A (en) * 1988-05-26 1991-01-22 International Business Machines Corporation Flexible carrier for an electronic device
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nippon Electric Co Kühlungsstruktur für elektronische Bauelemente
US5014114A (en) * 1988-09-30 1991-05-07 Harris Corporation High speed, high density semiconductor memory package with chip level repairability
US5122475A (en) * 1988-09-30 1992-06-16 Harris Corporation Method of making a high speed, high density semiconductor memory package with chip level repairability
US4951123A (en) * 1988-09-30 1990-08-21 Westinghouse Electric Corp. Integrated circuit chip assembly utilizing selective backside deposition
US5073840A (en) * 1988-10-06 1991-12-17 Microlithics Corporation Circuit board with coated metal support structure and method for making same
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US5043845A (en) * 1989-10-16 1991-08-27 Eastman Kodak Company High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact
US5287247A (en) * 1990-09-21 1994-02-15 Lsi Logic Corporation Computer system module assembly
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US5291374A (en) * 1990-12-17 1994-03-01 Kabushiki Kaisha Toshiba Semiconductor device having an opening and method of manufacturing the same
US5198887A (en) * 1991-03-06 1993-03-30 Motorola, Inc. Semiconductor chip carrier
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
US5303122A (en) * 1991-10-31 1994-04-12 Ford Motor Company Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted
US5272375A (en) * 1991-12-26 1993-12-21 E. I. Du Pont De Nemours And Company Electronic assembly with optimum heat dissipation
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
JP2678958B2 (ja) * 1992-03-02 1997-11-19 カシオ計算機株式会社 フィルム配線基板およびその製造方法
TW238419B (fr) * 1992-08-21 1995-01-11 Olin Corp
US5339218A (en) * 1993-05-20 1994-08-16 Microsemi Corporation Surface mount device
WO1994029900A1 (fr) * 1993-06-09 1994-12-22 Lykat Corporation Dispositif de dissipation de chaleur pour boitier de puce a circuit integre
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
US5650593A (en) * 1994-05-26 1997-07-22 Amkor Electronics, Inc. Thermally enhanced chip carrier package
US5519363A (en) * 1994-05-31 1996-05-21 The Whitaker Corporation Controlled impedance lines connected to optoelectronic devices
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
DE19532992A1 (de) * 1995-09-07 1997-03-13 Telefunken Microelectron Leiterplatte
US5617294A (en) 1995-09-29 1997-04-01 Intel Corporation Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
US6000125A (en) * 1996-01-30 1999-12-14 Samsung Electronics America, Inc. Method of heat dissipation from two surfaces of a microprocessor
GB2309827B (en) * 1996-01-30 1998-04-22 Samsung Electronics Co Ltd Surface complemental heat dissipation device
FR2748156B1 (fr) * 1996-04-26 1998-08-07 Suisse Electronique Microtech Dispositif comprenant deux substrats destines a former un microsysteme ou une partie d'un microsysteme et procede d'assemblage de deux substrats micro-usines
US6395991B1 (en) 1996-07-29 2002-05-28 International Business Machines Corporation Column grid array substrate attachment with heat sink stress relief
US5708566A (en) * 1996-10-31 1998-01-13 Motorola, Inc. Solder bonded electronic module
US5796169A (en) * 1996-11-19 1998-08-18 International Business Machines Corporation Structurally reinforced ball grid array semiconductor package and systems
US6053394A (en) * 1998-01-13 2000-04-25 International Business Machines Corporation Column grid array substrate attachment with heat sink stress relief
US6054653A (en) * 1998-01-28 2000-04-25 Hansen; Gregory Robert Apparatus for attaching a surface mount component
RO121308B1 (ro) * 1998-05-28 2007-02-28 Rompower Inc. Structură de încapsulare pentru circuite electronice de putere
US6154364A (en) * 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6243269B1 (en) * 1998-12-29 2001-06-05 Ncr Corporation Centralized cooling interconnect for electronic packages
SE513786C2 (sv) * 1999-03-09 2000-11-06 Ericsson Telefon Ab L M Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden
US6215180B1 (en) * 1999-03-17 2001-04-10 First International Computer Inc. Dual-sided heat dissipating structure for integrated circuit package
EP1427013A3 (fr) * 1999-09-22 2004-07-07 Siemens Aktiengesellschaft Appareil de commande, notamment pour applications automobiles
US6411516B1 (en) * 2001-06-15 2002-06-25 Hughes Electronics Corporation Copper slug pedestal for a printed circuit board
US20060293727A1 (en) * 2002-05-09 2006-12-28 Greg Spooner System and method for treating exposed tissue with light emitting diodes
CN100352317C (zh) * 2002-06-07 2007-11-28 松下电器产业株式会社 电子元件安装板、电子元件模块、制造电子元件安装板的方法及通信设备
US6625028B1 (en) * 2002-06-20 2003-09-23 Agilent Technologies, Inc. Heat sink apparatus that provides electrical isolation for integrally shielded circuit
US7741566B2 (en) * 2003-05-07 2010-06-22 Merix Corporation Microelectronic substrates with thermally conductive pathways and methods of making same
WO2004103038A1 (fr) * 2003-05-07 2004-11-25 Merix Corporation Substrats micro-electroniques a voies a conduction thermique et leurs procedes de fabrication
US7038311B2 (en) * 2003-12-18 2006-05-02 Texas Instruments Incorporated Thermally enhanced semiconductor package
US7489517B2 (en) * 2004-04-05 2009-02-10 Thomas Joel Massingill Die down semiconductor package
GB0413420D0 (en) * 2004-06-15 2004-07-21 Radstone Technology Plc Heat management in printed wiring boards
US20080083981A1 (en) * 2006-06-07 2008-04-10 Romig Matthew D Thermally Enhanced BGA Packages and Methods
CN101460018B (zh) * 2007-12-14 2011-02-16 华为技术有限公司 一种印制电路板及其制造方法、射频装置
US8232576B1 (en) 2008-03-25 2012-07-31 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and ceramic block in post
US8310043B2 (en) 2008-03-25 2012-11-13 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with ESD protection layer
US8531024B2 (en) * 2008-03-25 2013-09-10 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
US8269336B2 (en) * 2008-03-25 2012-09-18 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and signal post
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post
US8110446B2 (en) * 2008-03-25 2012-02-07 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
US8525214B2 (en) 2008-03-25 2013-09-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with thermal via
US8193556B2 (en) * 2008-03-25 2012-06-05 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and cavity in post
US8067784B2 (en) * 2008-03-25 2011-11-29 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and substrate
US8415703B2 (en) * 2008-03-25 2013-04-09 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
US8288792B2 (en) * 2008-03-25 2012-10-16 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/post heat spreader
US20090284932A1 (en) * 2008-03-25 2009-11-19 Bridge Semiconductor Corporation Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry
US9018667B2 (en) * 2008-03-25 2015-04-28 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and dual adhesives
US7948076B2 (en) * 2008-03-25 2011-05-24 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and vertical signal routing
US8354688B2 (en) 2008-03-25 2013-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
US8207553B2 (en) * 2008-03-25 2012-06-26 Bridge Semiconductor Corporation Semiconductor chip assembly with base heat spreader and cavity in base
US20110156090A1 (en) * 2008-03-25 2011-06-30 Lin Charles W C Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts
US8329510B2 (en) 2008-03-25 2012-12-11 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
US20110278638A1 (en) 2008-03-25 2011-11-17 Lin Charles W C Semiconductor chip assembly with post/dielectric/post heat spreader
US8314438B2 (en) * 2008-03-25 2012-11-20 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and cavity in bump
US8203167B2 (en) 2008-03-25 2012-06-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
US8212279B2 (en) 2008-03-25 2012-07-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader, signal post and cavity
US8378372B2 (en) * 2008-03-25 2013-02-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
US8148747B2 (en) * 2008-03-25 2012-04-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/cap heat spreader
US8324723B2 (en) * 2008-03-25 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
US20100072511A1 (en) * 2008-03-25 2010-03-25 Lin Charles W C Semiconductor chip assembly with copper/aluminum post/base heat spreader
US8129742B2 (en) 2008-03-25 2012-03-06 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and plated through-hole
US20110163348A1 (en) * 2008-03-25 2011-07-07 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump
US20100052005A1 (en) * 2008-03-25 2010-03-04 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and conductive trace
US8409963B2 (en) * 2009-04-28 2013-04-02 CDA Procesing Limited Liability Company Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
US8324653B1 (en) 2009-08-06 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with ceramic/metal substrate
US8698186B2 (en) * 2011-07-19 2014-04-15 Cofan Usa, Inc. Circuit board with thermo-conductive pillar
EP3310140B1 (fr) 2016-10-14 2021-07-14 Vitesco Technologies GmbH Ensemble de montage à dissipateur thermique
DE102017205360B3 (de) * 2017-03-29 2018-07-19 Te Connectivity Germany Gmbh Elektrisches Kontaktelement und Verfahren zur Herstellung einer hartgelöteten, elektrisch leitenden Verbindung mit einem Gegenkontakt mittels eines eingepressten Lotkörpers aus Hartlot
IT201800010103A1 (it) * 2018-11-07 2020-05-07 Cisel S R L Circuiti Stampati Per Applicazioni Elettr Scheda di circuito stampato con sistema di raffreddamento.

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB821830A (en) * 1955-08-29 1959-10-14 Mullard Radio Valve Co Ltd Improvements in and relating to semi-conductor devices
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US3492535A (en) * 1968-01-08 1970-01-27 Ncr Co Ceramic circuit card
DE1815799C3 (de) * 1968-12-19 1979-09-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung eines Halbleiterbauelementgehäuses
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
FR2207401B1 (fr) * 1972-11-22 1975-09-12 Cii
JPS5116302B2 (fr) * 1973-10-22 1976-05-22
FR2350697A1 (fr) * 1976-05-06 1977-12-02 Cii Structure perfectionnee de circuits multicouches
US4420767A (en) * 1978-11-09 1983-12-13 Zilog, Inc. Thermally balanced leadless microelectronic circuit chip carrier
GB2062971B (en) * 1979-11-08 1983-09-07 Standard Telephones Cables Ltd Heat sink printed circuit board
WO1981003734A1 (fr) * 1980-06-19 1981-12-24 Digital Equipment Corp Conditionnement de circuit integre a dissipateur thermique
US4383270A (en) * 1980-07-10 1983-05-10 Rca Corporation Structure for mounting a semiconductor chip to a metal core substrate
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
DE3115017A1 (de) * 1981-04-14 1982-11-04 Blaupunkt-Werke Gmbh, 3200 Hildesheim Elektronisches bauelement
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
US4413308A (en) * 1981-08-31 1983-11-01 Bell Telephone Laboratories, Incorporated Printed wiring board construction
FR2520932A1 (fr) * 1982-02-02 1983-08-05 Thomson Csf Support de montage de boitier de circuit integre, a connexions de sorties reparties sur le perimetre du boitier

Also Published As

Publication number Publication date
FR2541511A1 (fr) 1984-08-24
US4509096A (en) 1985-04-02
GB8304890D0 (en) 1983-03-23

Similar Documents

Publication Publication Date Title
FR2541511B1 (fr) Substrat pour support de circuits integres
FR2613536B1 (fr) Substrat pour circuit conducteur multicouche
DE3275789D1 (en) Substrate for mounting integrated circuit chips
FR2494908B1 (fr) Element support pour modules de circuit integre
SE7810314L (sv) Substrat for sammanbindning av integrerade kretsar
FR2596231B1 (fr) Boitier pour circuits electroniques
DE3484313D1 (de) Integrierte halbleiterschaltung.
KR900008927A (ko) 반도체 집적회로
FR2556503B1 (fr) Substrat d'interconnexion en alumine pour composant electronique
DE69430765D1 (de) Eingebettetes Substrat für integrierte Schaltungsmodule
DK201690D0 (da) Fremgangsmaade til fremstilling af trykte kredsloeb
GB8421200D0 (en) Semiconductor integrated circuit
DE68928320D1 (de) Randmontierte Packung vom Oberflächen-Montierungstyp, für integrierte Halbleiterschaltungsanordnungen
DE69226098D1 (de) Lokale Kontaktverbindungen für integrierte Schaltungen
DE3855797D1 (de) Integrierte Halbleiterschaltung
FR2649829B1 (fr) Substrat ceramique multicouche pour cablage
DE3873938D1 (de) Laminiertes substrat fuer integrierte schaltungen.
FR2596923B1 (fr) Connecteur pour support de circuit integre
DE69030223D1 (de) Gestapeltes Mehrschichtsubstrat zum Montieren integrierter Schaltungen
DE3485592D1 (de) Integrierte halbleiterschaltungsanordnung.
DE3475366D1 (en) Master-slice-type semiconductor integrated circuit device
DE3486077D1 (de) Integrierte halbleiterschaltungsanordnung.
KR880700946A (ko) 전자부품 또는 회로 사이에서 정보를 전달하기 위한 장치
FR2608840B1 (fr) Structure de refroidissement pour circuits integres
DE3476628D1 (en) Substrate material for printed circuits

Legal Events

Date Code Title Description
ST Notification of lapse