FR2649829B1 - Substrat ceramique multicouche pour cablage - Google Patents
Substrat ceramique multicouche pour cablageInfo
- Publication number
- FR2649829B1 FR2649829B1 FR9009110A FR9009110A FR2649829B1 FR 2649829 B1 FR2649829 B1 FR 2649829B1 FR 9009110 A FR9009110 A FR 9009110A FR 9009110 A FR9009110 A FR 9009110A FR 2649829 B1 FR2649829 B1 FR 2649829B1
- Authority
- FR
- France
- Prior art keywords
- wiring
- ceramic substrate
- multilayer ceramic
- multilayer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18255389A JPH0797705B2 (ja) | 1989-07-17 | 1989-07-17 | 多層セラミツク基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2649829A1 FR2649829A1 (fr) | 1991-01-18 |
FR2649829B1 true FR2649829B1 (fr) | 1992-02-07 |
Family
ID=16120290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9009110A Expired - Lifetime FR2649829B1 (fr) | 1989-07-17 | 1990-07-17 | Substrat ceramique multicouche pour cablage |
Country Status (4)
Country | Link |
---|---|
US (1) | US5110654A (fr) |
JP (1) | JPH0797705B2 (fr) |
CA (1) | CA2021285C (fr) |
FR (1) | FR2649829B1 (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2767645B2 (ja) * | 1990-03-07 | 1998-06-18 | 富士通株式会社 | 多層配線基板の製造方法 |
JP3223199B2 (ja) * | 1991-10-25 | 2001-10-29 | ティーディーケイ株式会社 | 多層セラミック部品の製造方法および多層セラミック部品 |
US5531945A (en) * | 1992-04-13 | 1996-07-02 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of base board for printed wiring |
KR20040088592A (ko) | 1996-01-11 | 2004-10-16 | 이비덴 가부시키가이샤 | 프린트 배선판 및 그의 제조방법 |
US6255601B1 (en) * | 1997-04-01 | 2001-07-03 | Applied Materials, Inc. | Conductive feedthrough for a ceramic body and method of fabricating same |
US6303879B1 (en) * | 1997-04-01 | 2001-10-16 | Applied Materials, Inc. | Laminated ceramic with multilayer electrodes and method of fabrication |
US6267839B1 (en) * | 1999-01-12 | 2001-07-31 | Applied Materials, Inc. | Electrostatic chuck with improved RF power distribution |
US7319197B2 (en) | 2002-05-23 | 2008-01-15 | International Business Machines Corporation | Structure of stacked vias in multiple layer electrode device carriers |
JP3960277B2 (ja) * | 2002-10-23 | 2007-08-15 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
JP4960583B2 (ja) * | 2004-07-07 | 2012-06-27 | Tdk株式会社 | 積層型lc複合部品 |
JP2006229034A (ja) * | 2005-02-18 | 2006-08-31 | Toshiba Corp | 配線基板とその製造方法 |
DE102006018874A1 (de) * | 2006-04-24 | 2007-10-25 | Infineon Technologies Ag | Schaltungsanordnung zur Koppelung einer Spannungsversorgung an ein Halbleiterbauelement, Verfahren zur Herstellung der Schaltungsanordnung sowie Datenverarbeitungsgerät umfassend die Schaltungsanordnung |
JP5397007B2 (ja) * | 2009-05-14 | 2014-01-22 | 富士通株式会社 | プリント配線板および電子部品パッケージ |
JP5430494B2 (ja) * | 2009-09-28 | 2014-02-26 | 京セラ株式会社 | 配線基板 |
KR101161971B1 (ko) * | 2010-07-21 | 2012-07-04 | 삼성전기주식회사 | 다층 회로 기판 및 다층 회로 기판의 제조 방법 |
JP5833398B2 (ja) * | 2011-06-27 | 2015-12-16 | 新光電気工業株式会社 | 配線基板及びその製造方法、半導体装置 |
JP2015191991A (ja) * | 2014-03-28 | 2015-11-02 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
JP6380547B2 (ja) * | 2014-09-30 | 2018-08-29 | 株式会社村田製作所 | 多層基板 |
JP2016085818A (ja) * | 2014-10-24 | 2016-05-19 | 日本特殊陶業株式会社 | 誘導加熱コイル、電磁調理器および瞬間湯沸器 |
JP2016106427A (ja) * | 2016-03-03 | 2016-06-16 | 京セラサーキットソリューションズ株式会社 | 配線基板の製造方法および実装構造体の製造方法 |
JP6869209B2 (ja) * | 2018-07-20 | 2021-05-12 | 日本特殊陶業株式会社 | 配線基板 |
JP7076347B2 (ja) * | 2018-09-18 | 2022-05-27 | 日本特殊陶業株式会社 | 導波管 |
JP2020150000A (ja) * | 2019-03-11 | 2020-09-17 | 日立金属株式会社 | セラミックス基板 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4650923A (en) * | 1984-06-01 | 1987-03-17 | Narumi China Corporation | Ceramic article having a high moisture proof |
US4739448A (en) * | 1984-06-25 | 1988-04-19 | Magnavox Government And Industrial Electronics Company | Microwave multiport multilayered integrated circuit chip carrier |
JPH067578B2 (ja) * | 1985-01-28 | 1994-01-26 | 日本電気株式会社 | セラミツク多層基板 |
US4712161A (en) * | 1985-03-25 | 1987-12-08 | Olin Corporation | Hybrid and multi-layer circuitry |
JPS6273799A (ja) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | 多層セラミツク配線基板 |
FR2593346B1 (fr) * | 1986-01-17 | 1990-05-25 | Nec Corp | Substrat de cablage utilisant une ceramique comme isolant |
JPS62244631A (ja) * | 1986-04-17 | 1987-10-26 | 日本電気株式会社 | 複合積層セラミツク部品の製造方法 |
US4871608A (en) * | 1986-12-10 | 1989-10-03 | Ngk Spark Plug Co., Ltd. | High-density wiring multilayered substrate |
JPH0247892A (ja) * | 1988-08-10 | 1990-02-16 | Hitachi Ltd | セラミック多層配線基板 |
-
1989
- 1989-07-17 JP JP18255389A patent/JPH0797705B2/ja not_active Expired - Lifetime
-
1990
- 1990-07-16 CA CA 2021285 patent/CA2021285C/fr not_active Expired - Lifetime
- 1990-07-16 US US07/552,535 patent/US5110654A/en not_active Expired - Lifetime
- 1990-07-17 FR FR9009110A patent/FR2649829B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2021285C (fr) | 1993-02-09 |
FR2649829A1 (fr) | 1991-01-18 |
JPH0348495A (ja) | 1991-03-01 |
CA2021285A1 (fr) | 1991-01-18 |
JPH0797705B2 (ja) | 1995-10-18 |
US5110654A (en) | 1992-05-05 |
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