DE69116422D1 - Supraleitendes Mehrschichtkeramiksubstrat - Google Patents

Supraleitendes Mehrschichtkeramiksubstrat

Info

Publication number
DE69116422D1
DE69116422D1 DE69116422T DE69116422T DE69116422D1 DE 69116422 D1 DE69116422 D1 DE 69116422D1 DE 69116422 T DE69116422 T DE 69116422T DE 69116422 T DE69116422 T DE 69116422T DE 69116422 D1 DE69116422 D1 DE 69116422D1
Authority
DE
Germany
Prior art keywords
ceramic substrate
multilayer ceramic
superconducting multilayer
superconducting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69116422T
Other languages
English (en)
Inventor
Byung Tae Ahn
Robert Bruce Beyers
Emanuel Israel Cooper
Edward August Giess
Eugene John O'sullivan
Judith Marie Roldan
Lubomyr Taras Romankiw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69116422D1 publication Critical patent/DE69116422D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0661—Processes performed after copper oxide formation, e.g. patterning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/93—Electric superconducting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
    • Y10S505/701—Coated or thin film device, i.e. active or passive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
    • Y10S505/701—Coated or thin film device, i.e. active or passive
    • Y10S505/703—Microelectronic device with superconducting conduction line
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
    • Y10S505/704—Wire, fiber, or cable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
DE69116422T 1990-05-18 1991-02-08 Supraleitendes Mehrschichtkeramiksubstrat Expired - Lifetime DE69116422D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52640390A 1990-05-18 1990-05-18

Publications (1)

Publication Number Publication Date
DE69116422D1 true DE69116422D1 (de) 1996-02-29

Family

ID=24097194

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69116422T Expired - Lifetime DE69116422D1 (de) 1990-05-18 1991-02-08 Supraleitendes Mehrschichtkeramiksubstrat

Country Status (4)

Country Link
US (1) US5834405A (de)
EP (1) EP0456963B1 (de)
JP (1) JP2648725B2 (de)
DE (1) DE69116422D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2858463B1 (fr) * 2003-07-28 2007-08-24 Centre Nat Rech Scient Procede et systeme de realisation de composants inductifs supraconducteurs en couches minces, et dispositifs incluant de tels composants
KR100857011B1 (ko) * 2005-03-04 2008-09-04 가부시키가이샤 무라타 세이사쿠쇼 세라믹 다층 기판 및 그 제조방법
CN106008327B (zh) * 2016-05-05 2018-10-02 中国计量大学 一种有机无机杂化铋碘阴离子簇基半导体材料
KR102023398B1 (ko) 2017-03-31 2019-09-23 강릉원주대학교산학협력단 Ｂｍｗ계 고주파 유전체 세라믹 소재 및 그 제조방법
WO2018182180A1 (ko) * 2017-03-31 2018-10-04 강릉원주대학교산학협력단 Ｂｍｗ계 고주파 유전체 세라믹 소재 및 그 제조방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0283312A3 (de) * 1987-03-20 1990-09-26 Fujikura Ltd. Verfahren zur Herstellung eines supraleitendes Drahtes und damit hergestellter Draht
JP2527179B2 (ja) * 1987-03-26 1996-08-21 日本電信電話株式会社 超伝導性複合材の作製方法
CA1329952C (en) * 1987-04-27 1994-05-31 Yoshihiko Imanaka Multi-layer superconducting circuit substrate and process for manufacturing same
EP0290271B1 (de) * 1987-05-08 1995-03-15 Fujitsu Limited Supraleitende Schaltungskarte und Verfahren zu ihrer Herstellung
US4965249A (en) * 1987-10-02 1990-10-23 U.S. Philips Corporation Method of manufacturing a superconducting wire
US4994435A (en) * 1987-10-16 1991-02-19 The Furukawa Electric Co., Ltd. Laminated layers of a substrate, noble metal, and interlayer underneath an oxide superconductor
DE3744145A1 (de) * 1987-12-24 1989-07-06 Asea Brown Boveri Supraleiter und verfahren zu seiner herstellung
JP2579335B2 (ja) * 1988-02-04 1997-02-05 富士通株式会社 超伝導体素子の製造方法
JPH0287421A (ja) * 1988-09-22 1990-03-28 Semiconductor Energy Lab Co Ltd 酸化物超伝導体
US4872086A (en) * 1988-10-20 1989-10-03 Motorola, Inc. Dielectric RF devices suited for use with superconductors
US4954481A (en) * 1988-12-29 1990-09-04 The United States Of America As Represented By The Secretary Of Commerce Superconductor-polymer composites
JPH02183915A (ja) * 1989-01-09 1990-07-18 Furukawa Electric Co Ltd:The 酸化物超電導成形体
US5049539A (en) * 1989-01-31 1991-09-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Low cost, formable, high TC superconducting wire
US5087605A (en) * 1989-06-01 1992-02-11 Bell Communications Research, Inc. Layered lattice-matched superconducting device and method of making
US5104849A (en) * 1989-06-06 1992-04-14 The Furukawa Electric Co., Ltd. Oxide superconductor and method of manufacturing the same

Also Published As

Publication number Publication date
JP2648725B2 (ja) 1997-09-03
US5834405A (en) 1998-11-10
EP0456963B1 (de) 1996-01-17
JPH05315658A (ja) 1993-11-26
EP0456963A1 (de) 1991-11-21

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Legal Events

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