DE69024684D1 - Keramisches Substrat mit eingebauter LC-Schaltung - Google Patents

Keramisches Substrat mit eingebauter LC-Schaltung

Info

Publication number
DE69024684D1
DE69024684D1 DE69024684T DE69024684T DE69024684D1 DE 69024684 D1 DE69024684 D1 DE 69024684D1 DE 69024684 T DE69024684 T DE 69024684T DE 69024684 T DE69024684 T DE 69024684T DE 69024684 D1 DE69024684 D1 DE 69024684D1
Authority
DE
Germany
Prior art keywords
built
circuit
ceramic substrate
ceramic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69024684T
Other languages
English (en)
Other versions
DE69024684T2 (de
Inventor
Naoto Kitahara
Masami Koshimura
Mikiya Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of DE69024684D1 publication Critical patent/DE69024684D1/de
Application granted granted Critical
Publication of DE69024684T2 publication Critical patent/DE69024684T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/013—Thick-film circuits

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Ceramic Capacitors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69024684T 1989-03-23 1990-03-23 Keramisches Substrat mit eingebauter LC-Schaltung Expired - Lifetime DE69024684T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1069304A JPH02249294A (ja) 1989-03-23 1989-03-23 Ｌｃ内蔵形セラミックス基板

Publications (2)

Publication Number Publication Date
DE69024684D1 true DE69024684D1 (de) 1996-02-22
DE69024684T2 DE69024684T2 (de) 1996-06-20

Family

ID=13398689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69024684T Expired - Lifetime DE69024684T2 (de) 1989-03-23 1990-03-23 Keramisches Substrat mit eingebauter LC-Schaltung

Country Status (4)

Country Link
US (1) US5029043A (de)
EP (1) EP0388980B1 (de)
JP (1) JPH02249294A (de)
DE (1) DE69024684T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2725439B2 (ja) * 1990-05-17 1998-03-11 株式会社 村田製作所 電子部品の周波数調整方法
JP2953140B2 (ja) * 1991-09-20 1999-09-27 株式会社村田製作所 トランス
DE69325058T2 (de) * 1992-07-20 1999-09-30 Gen Motors Corp Ferromagnetische und ferroelektrische Verbundmaterialien
TW293955B (de) * 1994-02-09 1996-12-21 Mitsubishi Materials Corp
US5619791A (en) * 1994-06-30 1997-04-15 Lucent Technologies Inc. Method for fabricating highly conductive vias
TW265450B (en) * 1994-06-30 1995-12-11 At & T Corp Devices using metallized magnetic substrates
JPH08316766A (ja) * 1995-05-16 1996-11-29 Murata Mfg Co Ltd Ｌｃフィルタ
JP3127792B2 (ja) * 1995-07-19 2001-01-29 株式会社村田製作所 Ｌｃ共振器およびｌｃフィルタ
DE19824783A1 (de) 1998-06-03 1999-12-16 Siemens Ag Vorrichtung zur Formung eines Elektronenstrahls, Verfahren zur Herstellung der Vorrichtung und Anwendung
JP2001053571A (ja) * 1999-08-06 2001-02-23 Murata Mfg Co Ltd Ｌｃノイズフィルタ
JP2001168669A (ja) * 1999-12-09 2001-06-22 Murata Mfg Co Ltd 積層型デュプレクサ
JP3758464B2 (ja) * 2000-05-12 2006-03-22 株式会社村田製作所 積層電子部品
US6569346B1 (en) 2001-12-28 2003-05-27 Industrial Technology Research Institute Ferrite with high permeability and high dielectric constant and method for making the same
CN100563404C (zh) * 2002-08-23 2009-11-25 日本瑞翁株式会社 电路衬底、使用电路衬底的电子设备及电路衬底的制造方法
US7196607B2 (en) * 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates
US7883637B2 (en) 2006-12-25 2011-02-08 Kyocera Corporation Composite sintered body of dielectric substance and magnetic substance, and LC composite electronic component
WO2010038890A1 (ja) * 2008-09-30 2010-04-08 双信電機株式会社 複合電子部品
JP5106350B2 (ja) * 2008-10-29 2012-12-26 京セラ株式会社 磁性体と誘電体との複合焼結体およびそれを用いたｌｃ複合電子部品
KR20120099978A (ko) * 2011-03-02 2012-09-12 삼성전기주식회사 적층 세라믹 커패시터
CN112863336B (zh) * 2021-01-11 2022-07-12 武汉华星光电半导体显示技术有限公司 显示模组及显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2648804A (en) * 1951-02-01 1953-08-11 Erie Resistor Corp Multiple element circuit components
GB1370855A (en) * 1972-06-12 1974-10-16 Electrical Res Ass Electrical capacitors
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
JPS5924533B2 (ja) * 1979-06-28 1984-06-09 ティーディーケイ株式会社 複合電子部品
JPS609220U (ja) * 1983-06-28 1985-01-22 株式会社村田製作所 Ｌｃ複合部品
JPS61139093A (ja) * 1984-12-10 1986-06-26 富士通株式会社 セラミツク多層印刷配線板
JPH0632382B2 (ja) * 1985-01-22 1994-04-27 松下電器産業株式会社 回路基板
JPS6261305A (ja) * 1985-09-11 1987-03-18 Murata Mfg Co Ltd 積層チツプコイル
JPS6379398A (ja) * 1986-09-24 1988-04-09 株式会社日立製作所 多層配線基板
US4758922A (en) * 1986-11-14 1988-07-19 Matsushita Electric Industrial Co., Ltd. High frequency circuit having a microstrip resonance element
JPS63300593A (ja) * 1987-05-29 1988-12-07 Nec Corp セラミック複合基板
JPH02232915A (ja) * 1989-03-07 1990-09-14 Mitsubishi Mining & Cement Co Ltd チップ型ｌｃ複合セラミックス部品

Also Published As

Publication number Publication date
JPH02249294A (ja) 1990-10-05
US5029043A (en) 1991-07-02
EP0388980A3 (de) 1991-09-04
EP0388980B1 (de) 1996-01-10
EP0388980A2 (de) 1990-09-26
DE69024684T2 (de) 1996-06-20

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