KR880010489A - 집적 회로용 복합기판 - Google Patents

집적 회로용 복합기판 Download PDF

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Publication number
KR880010489A
KR880010489A KR1019880001677A KR880001677A KR880010489A KR 880010489 A KR880010489 A KR 880010489A KR 1019880001677 A KR1019880001677 A KR 1019880001677A KR 880001677 A KR880001677 A KR 880001677A KR 880010489 A KR880010489 A KR 880010489A
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South Korea
Prior art keywords
glass
less
laminated structure
layer
primary layer
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KR1019880001677A
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English (en)
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KR960006709B1 (ko
Inventor
마이클 홀러란 루이스
알버트 메르켈 그레고리
죤 파이슬리 로버트
앤 윅셀 캐드린
Original Assignee
알프레드 엘. 마이클슨
코닝 글라스 웍스
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Publication of KR880010489A publication Critical patent/KR880010489A/ko
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Publication of KR960006709B1 publication Critical patent/KR960006709B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Glass Compositions (AREA)

Abstract

내용 없음

Description

집적 회로용 복합기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 최소한 2종의 무기세라믹층이 무기세라믹 결합매체와 서로 결합되어 있는 층화된 구조에서, 일차층의 물질은 50W/m.K 이상의 열전도도를 나타내며, 이차층의 물질은 25W/m.K 이하의 열전도도를 나타내고 10 이하의 유전상수, 1050℃ 이하의 소결온도와 1차층의 열팽창선형계수와 유사한 선형 계수를 갖으며, 결합매체의 물질은 2차층의 소결온도 이하의 온도에서 흐르며 또한 1차 및 2차층의 열팽창 선형계수와 유사한 선형계수를 갖는 것을 특징으로 하는 적층화된 구조물.
  2. 제1항에 있어서, 상기 1차층의 물질이 전기적으로 절연상태인 적층화된 구조물.
  3. 제1항에 있어서, 상기 1차층의 물질이 텅스텐, AIN, 및 SiC로 구성된 그룹으로부터 선택된 적층화된 구조물.
  4. 제1항에 있어서, 상기 2차층의 물질이 유리, 유리세락믹 및 유리 결합된 세라믹으로 구성된 그룹으로부터 선택된 것을 특징으로 하는 적층화된 구조물.
  5. 제4항에 있어서, 상기 유리-세라믹은 LiO2, Na2O와 K2O가 필수적으로 없으며, 주된 결정상이 코르디어라이트, 월레마이트 및 그들의 상의 혼합물로 구성된 그룹으로부터 선택된 적층화된 구조물.
  6. 제5항에 있어서, 상기 월레마이트를 포함하고 있는 유리-세라믹이 필수적으로 기제인 산화물에 대해 중량%로 표시된 15-45%의 ZnO, 10-30% Al2O3그리고 30-55%의 SiO2로 구성되어 있는 적층화된 구조물.
  7. 제1항에 있어서, 상기 세라믹 결합매체가 보로실리케이트 유리 및 불투명 봉함 유리로 구성된 그룹으로부터 선택된 적층화된 구조물.
  8. 제7항에 있어서, 상기 불투명 봉함 유리가 리드티타늄 보로실리케이트내의 조성물을 갖는 적층화된 구조물.
  9. 제1항에 있어서, 일차층은 50W/m.K 이상의 열전도도를 나타내며, 이층이 25W/m.K 이하의 열전도도를 보이며 10이하의 유전상수와1050℃ 이하의 소결온도를 갖고 상기 일차층의 열팽창 선형계수와 유사한 열팽창 선형계수를 갖는 물질로 구성된 두 개의 층 사이에 삽입된 것을 특지응로 하는 적층화된 구조물.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880001677A 1987-02-18 1988-02-17 집적 회로용 복합기판 KR960006709B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/015,992 US4775596A (en) 1987-02-18 1987-02-18 Composite substrate for integrated circuits
US015,992 1987-02-18
US015992 1996-04-15

Publications (2)

Publication Number Publication Date
KR880010489A true KR880010489A (ko) 1988-10-10
KR960006709B1 KR960006709B1 (ko) 1996-05-22

Family

ID=21774762

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880001677A KR960006709B1 (ko) 1987-02-18 1988-02-17 집적 회로용 복합기판

Country Status (5)

Country Link
US (1) US4775596A (ko)
EP (1) EP0281220B1 (ko)
JP (1) JPS63213948A (ko)
KR (1) KR960006709B1 (ko)
DE (1) DE3873938T2 (ko)

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Publication number Priority date Publication date Assignee Title
DE3871013D1 (de) * 1987-07-29 1992-06-17 Mitsui Toatsu Chemicals Verfahren zur gewinnung von aluminiumnitrid und daraus hergestelltes sinterprodukt.
US5073526A (en) * 1988-01-27 1991-12-17 W. R. Grace & Co.-Conn. Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
US5017434A (en) * 1988-01-27 1991-05-21 Enloe Jack H Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
JP2952303B2 (ja) * 1988-11-15 1999-09-27 旭テクノグラス株式会社 複合型回路装置
US4906514A (en) * 1988-11-21 1990-03-06 Corning Incorporated Metallized substrate for electronic device
US4927711A (en) * 1988-12-23 1990-05-22 Corning Incorporated Hybrid circuits and thick film dielectrics used therein
US5200241A (en) * 1989-05-18 1993-04-06 General Electric Company Metal-ceramic structure with intermediate high temperature reaction barrier layer
US4973564A (en) * 1989-09-05 1990-11-27 Corning Incorporated Bonding frits for ceramic composites
US5830570A (en) * 1989-12-19 1998-11-03 Kyocera Corporation Aluminum nitride substrate and process for preparation thereof
US5080977A (en) * 1990-07-31 1992-01-14 United States Of America, As Represented By The Administrator, Nat'l. Aero. And Space Admin. Composite thermal barrier coating
JPH06296084A (ja) * 1993-02-12 1994-10-21 Ngk Spark Plug Co Ltd 高熱伝導体及びこれを備えた配線基板とこれらの製造方法
JP3593707B2 (ja) * 1993-03-19 2004-11-24 住友電気工業株式会社 窒化アルミニウムセラミックスとその製造方法
US6696103B1 (en) 1993-03-19 2004-02-24 Sumitomo Electric Industries, Ltd. Aluminium nitride ceramics and method for preparing the same
US5482903A (en) * 1993-12-22 1996-01-09 International Business Machines Corporation Aluminum nitride body utilizing a vitreous sintering additive
JP3467872B2 (ja) * 1994-12-02 2003-11-17 株式会社村田製作所 多層セラミック基板の製造方法
US6017485A (en) * 1996-03-28 2000-01-25 Carborundum Corporation Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
DE19815648C2 (de) * 1998-04-07 2000-07-13 Maxon Motor Gmbh Verfahren zum Herstellen eines Sintergleitlagers und Sintergleitlager
US6319757B1 (en) * 1998-07-08 2001-11-20 Caldus Semiconductor, Inc. Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
JP3407716B2 (ja) * 2000-06-08 2003-05-19 株式会社村田製作所 複合積層電子部品
US20040238099A1 (en) * 2003-05-29 2004-12-02 Milano Vincent J. Economical method of manufacturing features in a ceramic circuit board
WO2006011601A1 (ja) * 2004-07-29 2006-02-02 Kyocera Corporation 機能素子及びその製造方法、並びに機能素子実装構造体
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法

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US3482149A (en) * 1967-05-16 1969-12-02 Sprague Electric Co Sintered glass integrated circuit structure product and method of making the same
US3978316A (en) * 1975-09-19 1976-08-31 Corning Glass Works Electrical heating unit
FR2451899A1 (fr) * 1979-03-23 1980-10-17 Labo Electronique Physique Composition dielectrique, encre serigraphiable comportant une telle composition, et produits obtenus
JPS57180005A (en) * 1981-04-30 1982-11-05 Hitachi Ltd Silicon carbide electric insulator with low dielectric constant
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
EP0097944B1 (en) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Method for directly bonding ceramic and metal members and laminated body of the same
JPS61266350A (ja) * 1985-05-21 1986-11-26 株式会社日立製作所 配線回路用セラミック基板
FR2585015A1 (fr) * 1985-07-16 1987-01-23 Centre Nat Rech Scient Poudre ceramique de type cordierite frittable a basse temperature, procede de preparation et composition ceramique obtenue par frittage de cette poudre

Also Published As

Publication number Publication date
US4775596A (en) 1988-10-04
EP0281220B1 (en) 1992-08-26
DE3873938D1 (de) 1992-10-01
DE3873938T2 (de) 1993-03-04
EP0281220A1 (en) 1988-09-07
JPS63213948A (ja) 1988-09-06
KR960006709B1 (ko) 1996-05-22

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