KR880010489A - 집적 회로용 복합기판 - Google Patents

집적 회로용 복합기판 Download PDF

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Publication number
KR880010489A
KR880010489A KR1019880001677A KR880001677A KR880010489A KR 880010489 A KR880010489 A KR 880010489A KR 1019880001677 A KR1019880001677 A KR 1019880001677A KR 880001677 A KR880001677 A KR 880001677A KR 880010489 A KR880010489 A KR 880010489A
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South Korea
Prior art keywords
glass
less
laminated structure
layer
primary layer
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KR1019880001677A
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English (en)
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KR960006709B1 (ko
Inventor
마이클 홀러란 루이스
알버트 메르켈 그레고리
죤 파이슬리 로버트
앤 윅셀 캐드린
Original Assignee
알프레드 엘. 마이클슨
코닝 글라스 웍스
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Publication of KR880010489A publication Critical patent/KR880010489A/ko
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Publication of KR960006709B1 publication Critical patent/KR960006709B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Products (AREA)
  • Glass Compositions (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

집적 회로용 복합기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 최소한 2종의 무기세라믹층이 무기세라믹 결합매체와 서로 결합되어 있는 층화된 구조에서, 일차층의 물질은 50W/m.K 이상의 열전도도를 나타내며, 이차층의 물질은 25W/m.K 이하의 열전도도를 나타내고 10 이하의 유전상수, 1050℃ 이하의 소결온도와 1차층의 열팽창선형계수와 유사한 선형 계수를 갖으며, 결합매체의 물질은 2차층의 소결온도 이하의 온도에서 흐르며 또한 1차 및 2차층의 열팽창 선형계수와 유사한 선형계수를 갖는 것을 특징으로 하는 적층화된 구조물.
  2. 제1항에 있어서, 상기 1차층의 물질이 전기적으로 절연상태인 적층화된 구조물.
  3. 제1항에 있어서, 상기 1차층의 물질이 텅스텐, AIN, 및 SiC로 구성된 그룹으로부터 선택된 적층화된 구조물.
  4. 제1항에 있어서, 상기 2차층의 물질이 유리, 유리세락믹 및 유리 결합된 세라믹으로 구성된 그룹으로부터 선택된 것을 특징으로 하는 적층화된 구조물.
  5. 제4항에 있어서, 상기 유리-세라믹은 LiO2, Na2O와 K2O가 필수적으로 없으며, 주된 결정상이 코르디어라이트, 월레마이트 및 그들의 상의 혼합물로 구성된 그룹으로부터 선택된 적층화된 구조물.
  6. 제5항에 있어서, 상기 월레마이트를 포함하고 있는 유리-세라믹이 필수적으로 기제인 산화물에 대해 중량%로 표시된 15-45%의 ZnO, 10-30% Al2O3그리고 30-55%의 SiO2로 구성되어 있는 적층화된 구조물.
  7. 제1항에 있어서, 상기 세라믹 결합매체가 보로실리케이트 유리 및 불투명 봉함 유리로 구성된 그룹으로부터 선택된 적층화된 구조물.
  8. 제7항에 있어서, 상기 불투명 봉함 유리가 리드티타늄 보로실리케이트내의 조성물을 갖는 적층화된 구조물.
  9. 제1항에 있어서, 일차층은 50W/m.K 이상의 열전도도를 나타내며, 이층이 25W/m.K 이하의 열전도도를 보이며 10이하의 유전상수와1050℃ 이하의 소결온도를 갖고 상기 일차층의 열팽창 선형계수와 유사한 열팽창 선형계수를 갖는 물질로 구성된 두 개의 층 사이에 삽입된 것을 특지응로 하는 적층화된 구조물.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880001677A 1987-02-18 1988-02-17 집적 회로용 복합기판 KR960006709B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/015,992 US4775596A (en) 1987-02-18 1987-02-18 Composite substrate for integrated circuits
US015992 1987-02-18
US015,992 1987-02-18

Publications (2)

Publication Number Publication Date
KR880010489A true KR880010489A (ko) 1988-10-10
KR960006709B1 KR960006709B1 (ko) 1996-05-22

Family

ID=21774762

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880001677A KR960006709B1 (ko) 1987-02-18 1988-02-17 집적 회로용 복합기판

Country Status (5)

Country Link
US (1) US4775596A (ko)
EP (1) EP0281220B1 (ko)
JP (1) JPS63213948A (ko)
KR (1) KR960006709B1 (ko)
DE (1) DE3873938T2 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3871013D1 (de) * 1987-07-29 1992-06-17 Mitsui Toatsu Chemicals Verfahren zur gewinnung von aluminiumnitrid und daraus hergestelltes sinterprodukt.
US5073526A (en) * 1988-01-27 1991-12-17 W. R. Grace & Co.-Conn. Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
US5017434A (en) * 1988-01-27 1991-05-21 Enloe Jack H Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
JP2952303B2 (ja) * 1988-11-15 1999-09-27 旭テクノグラス株式会社 複合型回路装置
US4906514A (en) * 1988-11-21 1990-03-06 Corning Incorporated Metallized substrate for electronic device
US4927711A (en) * 1988-12-23 1990-05-22 Corning Incorporated Hybrid circuits and thick film dielectrics used therein
US5200241A (en) * 1989-05-18 1993-04-06 General Electric Company Metal-ceramic structure with intermediate high temperature reaction barrier layer
US4973564A (en) * 1989-09-05 1990-11-27 Corning Incorporated Bonding frits for ceramic composites
US5830570A (en) * 1989-12-19 1998-11-03 Kyocera Corporation Aluminum nitride substrate and process for preparation thereof
US5080977A (en) * 1990-07-31 1992-01-14 United States Of America, As Represented By The Administrator, Nat'l. Aero. And Space Admin. Composite thermal barrier coating
JPH06296084A (ja) * 1993-02-12 1994-10-21 Ngk Spark Plug Co Ltd 高熱伝導体及びこれを備えた配線基板とこれらの製造方法
US6696103B1 (en) 1993-03-19 2004-02-24 Sumitomo Electric Industries, Ltd. Aluminium nitride ceramics and method for preparing the same
JP3593707B2 (ja) * 1993-03-19 2004-11-24 住友電気工業株式会社 窒化アルミニウムセラミックスとその製造方法
US5482903A (en) * 1993-12-22 1996-01-09 International Business Machines Corporation Aluminum nitride body utilizing a vitreous sintering additive
JP3467872B2 (ja) * 1994-12-02 2003-11-17 株式会社村田製作所 多層セラミック基板の製造方法
US6017485A (en) * 1996-03-28 2000-01-25 Carborundum Corporation Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
DE19815648C2 (de) * 1998-04-07 2000-07-13 Maxon Motor Gmbh Verfahren zum Herstellen eines Sintergleitlagers und Sintergleitlager
US6319757B1 (en) * 1998-07-08 2001-11-20 Caldus Semiconductor, Inc. Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
JP3407716B2 (ja) * 2000-06-08 2003-05-19 株式会社村田製作所 複合積層電子部品
US20040238099A1 (en) * 2003-05-29 2004-12-02 Milano Vincent J. Economical method of manufacturing features in a ceramic circuit board
JP4722047B2 (ja) * 2004-07-29 2011-07-13 京セラ株式会社 機能素子及びその製造方法、並びに機能素子実装構造体
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3482149A (en) * 1967-05-16 1969-12-02 Sprague Electric Co Sintered glass integrated circuit structure product and method of making the same
US3978316A (en) * 1975-09-19 1976-08-31 Corning Glass Works Electrical heating unit
FR2451899A1 (fr) * 1979-03-23 1980-10-17 Labo Electronique Physique Composition dielectrique, encre serigraphiable comportant une telle composition, et produits obtenus
JPS57180005A (en) * 1981-04-30 1982-11-05 Hitachi Ltd Silicon carbide electric insulator with low dielectric constant
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
EP0097944B1 (en) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Method for directly bonding ceramic and metal members and laminated body of the same
JPS61266350A (ja) * 1985-05-21 1986-11-26 株式会社日立製作所 配線回路用セラミック基板
FR2585015A1 (fr) * 1985-07-16 1987-01-23 Centre Nat Rech Scient Poudre ceramique de type cordierite frittable a basse temperature, procede de preparation et composition ceramique obtenue par frittage de cette poudre

Also Published As

Publication number Publication date
EP0281220A1 (en) 1988-09-07
EP0281220B1 (en) 1992-08-26
DE3873938T2 (de) 1993-03-04
KR960006709B1 (ko) 1996-05-22
JPS63213948A (ja) 1988-09-06
DE3873938D1 (de) 1992-10-01
US4775596A (en) 1988-10-04

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