KR900008062A - 전자 장치용 금속화기질 - Google Patents

전자 장치용 금속화기질 Download PDF

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KR900008062A
KR900008062A KR1019890016578A KR890016578A KR900008062A KR 900008062 A KR900008062 A KR 900008062A KR 1019890016578 A KR1019890016578 A KR 1019890016578A KR 890016578 A KR890016578 A KR 890016578A KR 900008062 A KR900008062 A KR 900008062A
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glass
electronic device
oxide
zno
sio
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KR1019890016578A
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리 프랜시스 게이로드
윌리스 마틴 프랜시스
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에이. 엘. 미첼슨
코닝 인코오포레이티드
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Publication of KR900008062A publication Critical patent/KR900008062A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

내용 없음

Description

전자 장치용 금속화기질
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 단순회로판의 평면도,
제2도는 제1도의 측면도,
제3도는 제1도의 3-3선을 따라 절단한 단면도.

Claims (17)

  1. 코디얼라이트 타입의 유리-세라믹 또는 알루미늄 나이트라이드로 구성된 세라믹 기질과 상기 기질 표면에 있는 후막 회로소자로 구성되고, 상기 필름은 유리-세라믹 매트릭스내에 분산된 전기전도성 금속분말로 구성되어 있고, 상기 매트릭스는 납-티타네이트 주결정상을 함유하며, 상기 회로소자는 기질의 열팽창 계수에 적합한열팽창계수를 갖는 것을 특징으로 하는 전자소자.
  2. 제1항에 있어서, 상기 기질의 알루미늄 나이트라이드로 구성되는 것을 특징으로 하는 전자소자.
  3. 제1항에 있어서, 상기 기질이 코이얼라이트 타입의 유리-세라믹인 것을 특징으로 하는 전자소자.
  4. 제1항에 있어서, 상기 전기전도성 금속이 팔라듐-은 혼합물인 것을 특징으로 하는 전자소자.
  5. 제1항에 있어서, 상기 전기전도성 금속이 구리인 것을 특징으로 하는 전자소자.
  6. 제1항에 있어서, 상기 전기전도성 금속이 82∼98.5%의 필름으로 구성되는 것을 특징으로 하는 전자소자.
  7. 제6항에 있어서, 상기 전기전도성 금속의 함량이 약 90%인 것을 특징으로 하는 전자소자.
  8. 제1항에 있어서, 상기 유리-세라믹 매트릭스가 유리배치로 부터의 옥사이드에 기준하여 계산된 wt%로 조성은 PbO 60∼80%, B2O3최소한 1%, SiO2최소한 5%, B2O3+SiO21∼20%, TiO25∼18%, 20%까지의 ZnO 및 BaO로 구성된 그룹으로부터 선택된 2가 옥사이드 및 Al2O30∼2%으로 구성되는 것을 특징으로 하는 전자소자.
  9. 제8항에 있어서, 상기 선택된 2가 금속 옥사이드가 ZnO인 것을 특징으로 하는 전자소자.
  10. 제8항에 있어서, 상기 유리-세라믹 매트릭스가 PbO 63wt%, ZnO 10wt%, B2O37wt%, SiO27wt%, TiO212wt% 및 Al2O31wt%의 조성으로 구성되는 것을 특징으로 하는 전자소자.
  11. 구리, Pd-Ag 혼합물 또는 귀금속으로 구성된 그룹으로부터 선택된 전기전도성 금속분말 82∼98.5%과 납-아연-티타늄-보로실리케이트군 또는 납-바륨-티타늄-보로실리케이트군 등의 조성을 갖는 유리분말 18∼1.5%가 혼합된 것으로 구성되고, 상기 유리분말은 열적으로 원상태 그대로 결정화되어 납-티타네이트 결정상을 제공할 수 있고, 상기 혼합된 분말들을 일시적인 유리용매로 혼합되는 것을 특징으로 하는 금속화 페이스트,.
  12. 제11항에 있어서, 상기 금속분말이 Pb-Ag혼합물인 것을 특징으로하는 금속화 페이스트.
  13. 제11항에 있어서, 상기 금속분말이 구리인 것을 특징으로 하는 금속화 페이스트.
  14. 제11항에 있어서, 상기 유리분말이 약10%의 금속-유리 혼합물인 것을 특징으로 하는 금속화 페이스트.
  15. 제11항에 있어서, 상기 유리가 배치로 부터 옥사이드를 기준으로 계산한 wt%로, 조성은 PbO 60∼80%, B2O3최소한 1%, SiO2최소한 5% B2O3+ SiO210∼20%, TiO25∼18%, 20%까지의 ZnO 및 BaO로 구성된 그룹으로 선택된 2가 옥사이드 및 Al2O30∼2%의 조성인 것을 특징으로 하는 금속화 페이스트.
  16. 제15항에 있어서, 상기 선택된 2가 금속옥사이드가 ZnO인 것을 특징으로 하는 하는 금속화 페이스트.
  17. 제15항에 있어서, 상기 유리가 PbO 63wt%, ZnO 10wt%, B2O37wt%, SiO27wt%, TiO212wt% 및 Al2O31wt%로 구성되는 것을 특징으로 하는 금속화 페이스트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890016578A 1988-11-21 1989-11-15 전자 장치용 금속화기질 KR900008062A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US273586 1988-11-21
US07/273,586 US4906514A (en) 1988-11-21 1988-11-21 Metallized substrate for electronic device

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KR900008062A true KR900008062A (ko) 1990-06-02

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US (1) US4906514A (ko)
EP (1) EP0370227A3 (ko)
JP (1) JPH02189813A (ko)
KR (1) KR900008062A (ko)
CA (1) CA1337376C (ko)

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US5073526A (en) * 1988-01-27 1991-12-17 W. R. Grace & Co.-Conn. Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
JP2572823B2 (ja) * 1988-09-22 1997-01-16 日本碍子株式会社 セラミック接合体
JP2906282B2 (ja) * 1990-09-20 1999-06-14 富士通株式会社 ガラスセラミック・グリーンシートと多層基板、及び、その製造方法
US6207288B1 (en) 1991-02-05 2001-03-27 Cts Corporation Copper ink for aluminum nitride
JPH05218654A (ja) * 1991-10-25 1993-08-27 Internatl Business Mach Corp <Ibm> マイクロ波を用いたセラミック複合構造の製造方法
EP0558841A1 (en) * 1992-03-04 1993-09-08 CTS Corporation Copper ink for aluminium nitride
US5277937A (en) * 1992-06-03 1994-01-11 Corning Incorporated Method for controlling the conductance of a heated cellular substrate
JP3528037B2 (ja) * 1998-12-24 2004-05-17 株式会社村田製作所 ガラスセラミック基板の製造方法
DE19922553A1 (de) 1999-05-17 2000-12-07 Siemens Ag Verfahren zum Herstellen eines automaten-bondbaren kermamischen Schaltungsträgers und automaten-bondbarer keramischer Schaltungsträger
US6444297B1 (en) * 2000-07-19 2002-09-03 Electro Technik Industries, Inc. Method of producing a thick film metallization on an aluminum nitride substrate
ITFI20050142A1 (it) * 2005-06-23 2006-12-24 Colorobbia Italiana Spa Materiali per la ricopertura di corpi ceramici, processi per la loro preparazione loro uso e manufatti ceramici che li comprendono
JP5943295B2 (ja) * 2012-06-22 2016-07-05 日本電気硝子株式会社 電極形成用ガラス及びこれを用いた電極形成材料
CN105185428A (zh) * 2015-10-08 2015-12-23 中国振华集团云科电子有限公司 一种银浆的混合轧制方法及其制备得到的银浆

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US4775596A (en) * 1987-02-18 1988-10-04 Corning Glass Works Composite substrate for integrated circuits

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JPH02189813A (ja) 1990-07-25
CA1337376C (en) 1995-10-24
US4906514A (en) 1990-03-06
EP0370227A2 (en) 1990-05-30
EP0370227A3 (en) 1991-04-24

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