DE3866768D1 - Mit keramik beschichtete metallische substrate fuer elektronische anwendungen. - Google Patents
Mit keramik beschichtete metallische substrate fuer elektronische anwendungen.Info
- Publication number
- DE3866768D1 DE3866768D1 DE8888106600T DE3866768T DE3866768D1 DE 3866768 D1 DE3866768 D1 DE 3866768D1 DE 8888106600 T DE8888106600 T DE 8888106600T DE 3866768 T DE3866768 T DE 3866768T DE 3866768 D1 DE3866768 D1 DE 3866768D1
- Authority
- DE
- Germany
- Prior art keywords
- coated metal
- metal substrates
- electronic applications
- ceramic coated
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
- C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/045,930 US4794048A (en) | 1987-05-04 | 1987-05-04 | Ceramic coated metal substrates for electronic applications |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3866768D1 true DE3866768D1 (de) | 1992-01-23 |
Family
ID=21940606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888106600T Expired - Lifetime DE3866768D1 (de) | 1987-05-04 | 1988-04-25 | Mit keramik beschichtete metallische substrate fuer elektronische anwendungen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4794048A (de) |
EP (1) | EP0289903B1 (de) |
CA (1) | CA1326979C (de) |
DE (1) | DE3866768D1 (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4997698A (en) * | 1987-05-04 | 1991-03-05 | Allied-Signal, Inc. | Ceramic coated metal substrates for electronic applications |
JPH0695554B2 (ja) * | 1987-10-12 | 1994-11-24 | 工業技術院長 | 単結晶マグネシアスピネル膜の形成方法 |
US4965229A (en) * | 1988-02-05 | 1990-10-23 | Matsushita Electric Industrial Co., Ltd. | Glass ceramic for coating metal substrate |
US5015803A (en) * | 1989-05-31 | 1991-05-14 | Olin Corporation | Thermal performance package for integrated circuit chip |
US5276492A (en) * | 1989-08-14 | 1994-01-04 | Spectrum Sciences B.V. | Imaging method and apparatus |
JP2763664B2 (ja) * | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | 分布定数回路用配線基板 |
DE4103778C1 (de) * | 1991-02-08 | 1992-05-14 | Schott Glaswerke, 6500 Mainz, De | |
US5250474A (en) * | 1991-02-07 | 1993-10-05 | Schott Glaswerke | Glass powder which is crystallizable to yield a sintered glass ceramic containing hexagonal cordierite as the principal crystalline phase |
JP2850640B2 (ja) * | 1992-04-28 | 1999-01-27 | 株式会社デンソー | 混成集積回路装置 |
US5427823A (en) * | 1993-08-31 | 1995-06-27 | American Research Corporation Of Virginia | Laser densification of glass ceramic coatings on carbon-carbon composite materials |
JPH07211711A (ja) * | 1994-01-25 | 1995-08-11 | Sumitomo Electric Ind Ltd | 絶縁基板及びその製造方法 |
JP2730620B2 (ja) * | 1994-07-05 | 1998-03-25 | ナシヨナル・サイエンス・カウンシル | イリジウム/パラジウム酸化物メッキ層を有するチタニウム電極の製法 |
US5476821A (en) * | 1994-11-01 | 1995-12-19 | Corning Incorporated | High modulus glass-ceramics containing fine grained spinel-type crystals |
US5565262A (en) * | 1995-01-27 | 1996-10-15 | David Sarnoff Research Center, Inc. | Electrical feedthroughs for ceramic circuit board support substrates |
WO1997038481A1 (en) * | 1996-04-10 | 1997-10-16 | Virginia Tech Intellectual Properties, Inc. | Process for providing a glass-ceramic dielectric layer on an electrically conductive substrate and electrostatic chucks made by the process |
US6078359A (en) | 1996-07-15 | 2000-06-20 | The Regents Of The University Of California | Vacuum compatible miniature CCD camera head |
US5998037A (en) * | 1997-12-22 | 1999-12-07 | Ferro Corporation | Porcelain enamel composition for electronic applications |
US6641939B1 (en) | 1998-07-01 | 2003-11-04 | The Morgan Crucible Company Plc | Transition metal oxide doped alumina and methods of making and using |
US6196070B1 (en) * | 1998-10-14 | 2001-03-06 | Alliedsignal Inc. | Flow sensor with wide dynamic range |
US6308723B1 (en) | 1998-11-18 | 2001-10-30 | Alliedsignal, Inc. | Piezo-resistive position indicator |
US6911894B2 (en) * | 1998-12-07 | 2005-06-28 | Honeywell International Inc. | Sensor package for harsh environments |
US7258003B2 (en) * | 1998-12-07 | 2007-08-21 | Honeywell International Inc. | Flow sensor with self-aligned flow channel |
WO2000040398A1 (en) * | 1999-01-07 | 2000-07-13 | The Penn State Research Foundation | Fabrication of particulate tapes by electrophoretic deposition |
US6233817B1 (en) * | 1999-01-17 | 2001-05-22 | Delphi Technologies, Inc. | Method of forming thick-film hybrid circuit on a metal circuit board |
JP2000244123A (ja) * | 1999-02-19 | 2000-09-08 | Hitachi Ltd | 多層セラミック回路基板 |
JP3608990B2 (ja) * | 1999-10-19 | 2005-01-12 | 新光電気工業株式会社 | 多層回路基板およびその製造方法 |
GB2365007B (en) * | 2000-07-21 | 2002-06-26 | Murata Manufacturing Co | Insulative ceramic compact |
US6807875B2 (en) * | 2000-12-01 | 2004-10-26 | Honeywell International Inc. | Self-compensating position sensor |
US6629367B2 (en) | 2000-12-06 | 2003-10-07 | Motorola, Inc. | Electrically isolated via in a multilayer ceramic package |
US6681623B2 (en) | 2001-10-30 | 2004-01-27 | Honeywell International Inc. | Flow and pressure sensor for harsh fluids |
US20030193055A1 (en) * | 2002-04-10 | 2003-10-16 | Martter Robert H. | Lighting device and method |
DE10245234B4 (de) | 2002-09-27 | 2011-11-10 | Schott Ag | Kristallisierbares Glas, seine Verwendung zur Herstellung einer hochsteifen, bruchfesten Glaskeramik mit gut polierbarer Oberfläche sowie Verwendung der Glaskeramik |
DE10245233B3 (de) * | 2002-09-27 | 2004-02-12 | Schott Glas | Kristallisierbares Glas und seine Verwendung zur Herstellung einer hochsteifen, bruchfesten Glaskeramik |
AU2003901559A0 (en) * | 2003-04-07 | 2003-05-01 | Unisearch Limited | Glass texturing method |
US20040221896A1 (en) * | 2003-05-08 | 2004-11-11 | Ballenger Devane R. | Position detector for an electro hydraulic servo valve |
US7183587B2 (en) * | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
US7475607B2 (en) * | 2004-01-08 | 2009-01-13 | Honeywell International Inc. | Sensing apparatus with an integrated gasket on a beam component |
US6945118B2 (en) * | 2004-01-13 | 2005-09-20 | Honeywell International Inc. | Ceramic on metal pressure transducer |
US7214881B2 (en) * | 2004-04-01 | 2007-05-08 | Delphi Technologies, Inc. | High temperature electrical connection |
US20060097385A1 (en) | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
US20060124953A1 (en) * | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
US7322732B2 (en) | 2004-12-23 | 2008-01-29 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
US7304694B2 (en) * | 2005-01-12 | 2007-12-04 | Cree, Inc. | Solid colloidal dispersions for backlighting of liquid crystal displays |
US20070075824A1 (en) * | 2005-10-03 | 2007-04-05 | Honeywell International Inc. | Advanced thick film potentiometers |
US7210346B1 (en) | 2005-12-21 | 2007-05-01 | Honeywell International Inc. | Modular sensing apparatus |
US7266999B2 (en) * | 2006-01-30 | 2007-09-11 | Honeywell International Inc. | Thick film technology based ultra high pressure sensor utilizing integral port and diaphragm construction |
WO2007139781A2 (en) | 2006-05-23 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Lighting device |
US7513164B1 (en) * | 2007-12-18 | 2009-04-07 | Honeywell International Inc. | Single diaphragm ATF differential pressure transducer |
US20100097235A1 (en) * | 2008-10-22 | 2010-04-22 | Cooper Technologies Company | Explosion Proof Non-Contact Check Point to Mount in Explosion Proof Enclosure |
CA2757530A1 (en) * | 2009-04-02 | 2010-10-14 | Basf Se | Thermoelectric module with insulated substrate |
KR101077359B1 (ko) * | 2009-09-23 | 2011-10-26 | 삼성전기주식회사 | 방열회로기판 및 그 제조방법 |
US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
FR3016238A1 (fr) * | 2014-01-03 | 2015-07-10 | Heliotrop | Module photovoltaique a concentration a isolation par couche d'oxyde |
DE102014204116A1 (de) * | 2014-03-06 | 2015-09-10 | Osram Gmbh | LED-Modul mit Substratkörper |
JP2015170770A (ja) * | 2014-03-07 | 2015-09-28 | イビデン株式会社 | プリント配線板 |
US10629513B2 (en) * | 2015-06-04 | 2020-04-21 | Eaton Intelligent Power Limited | Ceramic plated materials for electrical isolation and thermal transfer |
CN110948403A (zh) * | 2019-12-20 | 2020-04-03 | 江西冠亿研磨股份有限公司 | 一种低温烧成陶瓷结合剂砂轮及其制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3847583A (en) * | 1969-08-13 | 1974-11-12 | Jenaer Glaswerk Schott & Gen | Process for the manufacture of multi-component substances |
US4015048A (en) * | 1975-03-03 | 1977-03-29 | Corning Glass Works | Ceramic articles having cordierite coatings |
JPS5382822A (en) * | 1976-12-28 | 1978-07-21 | Ngk Insulators Ltd | Cordierite ceramics |
US4234367A (en) * | 1979-03-23 | 1980-11-18 | International Business Machines Corporation | Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors |
US4251377A (en) * | 1979-08-28 | 1981-02-17 | E. I. Du Pont De Nemours And Company | Separation device of cordierite ceramic and α-alumina |
US4503093A (en) * | 1981-08-19 | 1985-03-05 | Iseli Robert W | Thermally sprayable ceramics |
US4385127A (en) * | 1981-11-23 | 1983-05-24 | Corning Glass Works | Glass-ceramic coatings for use on metal substrates |
US4544974A (en) * | 1983-10-20 | 1985-10-01 | Eastman Kodak Company | Alumina glass composition and magnetic head incorporating same |
CA1300648C (en) * | 1987-04-27 | 1992-05-12 | Francis Willis Martin | Glass-ceramics for electronic packaging |
-
1987
- 1987-05-04 US US07/045,930 patent/US4794048A/en not_active Expired - Lifetime
-
1988
- 1988-04-25 DE DE8888106600T patent/DE3866768D1/de not_active Expired - Lifetime
- 1988-04-25 EP EP88106600A patent/EP0289903B1/de not_active Expired - Lifetime
- 1988-05-03 CA CA000565726A patent/CA1326979C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0289903B1 (de) | 1991-12-11 |
CA1326979C (en) | 1994-02-15 |
US4794048A (en) | 1988-12-27 |
EP0289903A1 (de) | 1988-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |