ATE464656T1 - Halbleiterstruktur mit einem oder mehreren durchgangslöchern - Google Patents

Halbleiterstruktur mit einem oder mehreren durchgangslöchern

Info

Publication number
ATE464656T1
ATE464656T1 AT02787490T AT02787490T ATE464656T1 AT E464656 T1 ATE464656 T1 AT E464656T1 AT 02787490 T AT02787490 T AT 02787490T AT 02787490 T AT02787490 T AT 02787490T AT E464656 T1 ATE464656 T1 AT E464656T1
Authority
AT
Austria
Prior art keywords
holes
semiconductor structure
feed
metallization process
opto
Prior art date
Application number
AT02787490T
Other languages
English (en)
Inventor
Matthias Heschel
Original Assignee
Hymite As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hymite As filed Critical Hymite As
Application granted granted Critical
Publication of ATE464656T1 publication Critical patent/ATE464656T1/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H10W20/023—
    • H10W20/0242—
    • H10W20/0245—
    • H10W20/20—
    • H10W20/2125—
    • H10W20/218—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Element Separation (AREA)
  • Optical Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Weting (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
AT02787490T 2001-10-17 2002-10-15 Halbleiterstruktur mit einem oder mehreren durchgangslöchern ATE464656T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32969901P 2001-10-17 2001-10-17
US10/264,440 US6818464B2 (en) 2001-10-17 2002-10-04 Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
PCT/EP2002/011605 WO2003034490A2 (en) 2001-10-17 2002-10-15 Semiconductor structure with one or more through-holes

Publications (1)

Publication Number Publication Date
ATE464656T1 true ATE464656T1 (de) 2010-04-15

Family

ID=26950546

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02787490T ATE464656T1 (de) 2001-10-17 2002-10-15 Halbleiterstruktur mit einem oder mehreren durchgangslöchern

Country Status (8)

Country Link
US (3) US6818464B2 (de)
EP (1) EP1436837B1 (de)
JP (1) JP4546087B2 (de)
CN (1) CN100377333C (de)
AT (1) ATE464656T1 (de)
AU (1) AU2002351771A1 (de)
DE (1) DE60236007D1 (de)
WO (1) WO2003034490A2 (de)

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US7081412B2 (en) 2006-07-25
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JP4546087B2 (ja) 2010-09-15
WO2003034490A2 (en) 2003-04-24
US20030071283A1 (en) 2003-04-17
CN100377333C (zh) 2008-03-26
DE60236007D1 (de) 2010-05-27
HK1074913A1 (zh) 2005-11-25
CN1605126A (zh) 2005-04-06
EP1436837B1 (de) 2010-04-14
US7057274B2 (en) 2006-06-06
JP2005506701A (ja) 2005-03-03
US6818464B2 (en) 2004-11-16
US20040266038A1 (en) 2004-12-30
EP1436837A2 (de) 2004-07-14
WO2003034490A3 (en) 2004-04-01

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