FR2826181B1 - Dispositif a semiconducteur de puissance supportant une tension elevee - Google Patents
Dispositif a semiconducteur de puissance supportant une tension eleveeInfo
- Publication number
- FR2826181B1 FR2826181B1 FR0206099A FR0206099A FR2826181B1 FR 2826181 B1 FR2826181 B1 FR 2826181B1 FR 0206099 A FR0206099 A FR 0206099A FR 0206099 A FR0206099 A FR 0206099A FR 2826181 B1 FR2826181 B1 FR 2826181B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- high voltage
- power semiconductor
- device supporting
- supporting high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001184756A JP4540884B2 (ja) | 2001-06-19 | 2001-06-19 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2826181A1 FR2826181A1 (fr) | 2002-12-20 |
FR2826181B1 true FR2826181B1 (fr) | 2005-06-24 |
Family
ID=19024464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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FR0206099A Expired - Fee Related FR2826181B1 (fr) | 2001-06-19 | 2002-05-17 | Dispositif a semiconducteur de puissance supportant une tension elevee |
Country Status (4)
Country | Link |
---|---|
US (1) | US6700194B2 (fr) |
JP (1) | JP4540884B2 (fr) |
DE (1) | DE10221891C5 (fr) |
FR (1) | FR2826181B1 (fr) |
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JP4188188B2 (ja) * | 2003-05-21 | 2008-11-26 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
US6933593B2 (en) * | 2003-08-14 | 2005-08-23 | International Rectifier Corporation | Power module having a heat sink |
DE502004002254D1 (de) * | 2003-09-05 | 2007-01-18 | Rohde & Schwarz | Elektronisches Bauelement mit Kühlfläche |
US6940183B1 (en) * | 2004-06-04 | 2005-09-06 | Lu-Chen Hwan | Compound filled in lead IC packaging product |
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CN109564918B (zh) * | 2016-08-10 | 2023-09-29 | 三菱电机株式会社 | 半导体装置 |
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JP4220094B2 (ja) * | 1999-04-05 | 2009-02-04 | 三菱電機株式会社 | パワー半導体モジュール |
WO2000068992A1 (fr) * | 1999-05-11 | 2000-11-16 | Mitsubishi Denki Kabushiki Kaisha | Dispositif a semi-conducteur |
JP3793407B2 (ja) * | 2000-09-19 | 2006-07-05 | 株式会社日立製作所 | 電力変換装置 |
JP2002246515A (ja) * | 2001-02-20 | 2002-08-30 | Mitsubishi Electric Corp | 半導体装置 |
-
2001
- 2001-06-19 JP JP2001184756A patent/JP4540884B2/ja not_active Expired - Lifetime
-
2002
- 2002-03-29 US US10/108,463 patent/US6700194B2/en not_active Expired - Lifetime
- 2002-05-16 DE DE10221891A patent/DE10221891C5/de not_active Expired - Lifetime
- 2002-05-17 FR FR0206099A patent/FR2826181B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10221891B4 (de) | 2009-03-19 |
FR2826181A1 (fr) | 2002-12-20 |
JP2003007966A (ja) | 2003-01-10 |
US20020190374A1 (en) | 2002-12-19 |
DE10221891A1 (de) | 2003-01-09 |
DE10221891C5 (de) | 2011-08-11 |
US6700194B2 (en) | 2004-03-02 |
JP4540884B2 (ja) | 2010-09-08 |
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