JP6939392B2 - パワーモジュール - Google Patents
パワーモジュール Download PDFInfo
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- JP6939392B2 JP6939392B2 JP2017201171A JP2017201171A JP6939392B2 JP 6939392 B2 JP6939392 B2 JP 6939392B2 JP 2017201171 A JP2017201171 A JP 2017201171A JP 2017201171 A JP2017201171 A JP 2017201171A JP 6939392 B2 JP6939392 B2 JP 6939392B2
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- power
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- package
- voltage
- power module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/567—Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
Description
Claims (5)
- パワーチップと、
前記パワーチップを制御する制御チップと、
前記パワーチップに接続されたパワー端子と、
前記制御チップに接続された制御端子と、
前記パワーチップ、前記制御チップ、前記パワー端子及び前記制御端子をモールド樹脂で覆ったパッケージとを備え、
前記パワー端子及び前記制御端子が突出していない前記パッケージの互いに対向する側面にそれぞれフィンを取り付けるための第1及び第2の窪みが設けられ、
前記第1及び第2の窪みは対向せずに互い違いに配置され、
前記パッケージは、互いに対向する第1及び第2の主面を有し、
前記第1及び第2の窪みは前記パッケージを貫通せずに前記第2の主面側に設けられていることを特徴とするパワーモジュール。 - 前記パッケージは前記第1の主面に凸の反りを持つことを特徴とする請求項1に記載のパワーモジュール。
- 前記第1及び第2の窪みが設けられた前記側面では前記パッケージから内部電極が露出していないことを特徴とする請求項1又は2に記載のパワーモジュール。
- 前記パワーチップは、高圧パワーチップと、前記高圧パワーチップよりも印加される電圧が低い低圧パワーチップとを有し、
前記制御チップは、前記高圧パワーチップを制御する高圧制御チップと、前記低圧パワーチップを制御する低圧制御チップとを有し、
前記第1の窪みを前記高圧パワーチップ側に配置し、
前記第2の窪みを前記低圧制御チップ側に配置することを特徴とする請求項1〜3の何れか1項に記載のパワーモジュール。 - 前記パワーチップはワイドバンドギャップ半導体によって形成されていることを特徴とする請求項1〜4の何れか1項に記載のパワーモジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017201171A JP6939392B2 (ja) | 2017-10-17 | 2017-10-17 | パワーモジュール |
US15/953,522 US10796979B2 (en) | 2017-10-17 | 2018-04-16 | Power module |
DE102018211260.6A DE102018211260A1 (de) | 2017-10-17 | 2018-07-09 | Leistungsmodul |
CN201811189176.0A CN109671687B (zh) | 2017-10-17 | 2018-10-12 | 功率模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017201171A JP6939392B2 (ja) | 2017-10-17 | 2017-10-17 | パワーモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019075476A JP2019075476A (ja) | 2019-05-16 |
JP6939392B2 true JP6939392B2 (ja) | 2021-09-22 |
Family
ID=65910062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017201171A Active JP6939392B2 (ja) | 2017-10-17 | 2017-10-17 | パワーモジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US10796979B2 (ja) |
JP (1) | JP6939392B2 (ja) |
CN (1) | CN109671687B (ja) |
DE (1) | DE102018211260A1 (ja) |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6310632A (ja) | 1986-06-30 | 1988-01-18 | Shin Etsu Chem Co Ltd | シリコ−ン組成物 |
JPH05326771A (ja) * | 1992-05-26 | 1993-12-10 | Gurafuiko:Kk | 電子デバイスにおける放熱器の取付け構造 |
EP0619605B1 (en) * | 1993-04-05 | 1996-08-28 | STMicroelectronics S.r.l. | Combination of an electronic semiconductor device and a heat sink |
JP2800744B2 (ja) * | 1995-10-25 | 1998-09-21 | 日本電気株式会社 | 半導体装置のパッケージ |
JPH09199645A (ja) * | 1996-01-17 | 1997-07-31 | Mitsubishi Electric Corp | 半導体装置および半導体モジュール |
JPH09213871A (ja) * | 1996-02-02 | 1997-08-15 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
JP4007741B2 (ja) * | 2000-01-12 | 2007-11-14 | 三菱電機株式会社 | 半導体装置 |
JP2002184919A (ja) * | 2000-12-19 | 2002-06-28 | Sumitomo Metal Electronics Devices Inc | 半導体パッケージ及びその取付方法 |
JP4540884B2 (ja) * | 2001-06-19 | 2010-09-08 | 三菱電機株式会社 | 半導体装置 |
JP2003124437A (ja) * | 2001-10-19 | 2003-04-25 | Mitsubishi Electric Corp | 半導体装置 |
JP4426481B2 (ja) * | 2005-02-25 | 2010-03-03 | 三菱電機株式会社 | 半導体装置 |
JP4760585B2 (ja) * | 2006-07-18 | 2011-08-31 | 三菱電機株式会社 | 電力用半導体装置 |
CN101536624B (zh) * | 2006-10-06 | 2012-09-05 | 株式会社安川电机 | 功率模块安装结构及其具备该结构的马达控制装置 |
JP2008263210A (ja) * | 2008-05-16 | 2008-10-30 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP5345017B2 (ja) * | 2009-08-27 | 2013-11-20 | 三菱電機株式会社 | 電力用半導体装置とその製造方法 |
JP5354058B2 (ja) * | 2012-05-15 | 2013-11-27 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
JP6261309B2 (ja) * | 2013-12-02 | 2018-01-17 | 三菱電機株式会社 | パワーモジュール |
JP6249829B2 (ja) * | 2014-03-10 | 2017-12-20 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP6286039B2 (ja) | 2014-06-26 | 2018-02-28 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュールおよびパワー半導体モジュールの製造方法 |
JP2016136550A (ja) * | 2015-01-23 | 2016-07-28 | 株式会社最上インクス | ヒートシンクのクリップ機構 |
US9879720B2 (en) | 2016-05-05 | 2018-01-30 | General Electric Company | Bearing damper with external support spring systems and methods |
-
2017
- 2017-10-17 JP JP2017201171A patent/JP6939392B2/ja active Active
-
2018
- 2018-04-16 US US15/953,522 patent/US10796979B2/en active Active
- 2018-07-09 DE DE102018211260.6A patent/DE102018211260A1/de active Pending
- 2018-10-12 CN CN201811189176.0A patent/CN109671687B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN109671687B (zh) | 2023-01-13 |
JP2019075476A (ja) | 2019-05-16 |
US10796979B2 (en) | 2020-10-06 |
CN109671687A (zh) | 2019-04-23 |
US20190115283A1 (en) | 2019-04-18 |
DE102018211260A1 (de) | 2019-04-18 |
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