GB2146174B - Hermetic power chip packages - Google Patents

Hermetic power chip packages

Info

Publication number
GB2146174B
GB2146174B GB8420944A GB8420944A GB2146174B GB 2146174 B GB2146174 B GB 2146174B GB 8420944 A GB8420944 A GB 8420944A GB 8420944 A GB8420944 A GB 8420944A GB 2146174 B GB2146174 B GB 2146174B
Authority
GB
United Kingdom
Prior art keywords
power chip
chip packages
hermetic power
hermetic
packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8420944A
Other versions
GB2146174A (en
GB8420944D0 (en
Inventor
Alexander John Yerman
Constantine Alois Neugebauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB8420944D0 publication Critical patent/GB8420944D0/en
Publication of GB2146174A publication Critical patent/GB2146174A/en
Application granted granted Critical
Publication of GB2146174B publication Critical patent/GB2146174B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
GB8420944A 1983-09-06 1984-08-17 Hermetic power chip packages Expired GB2146174B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52929583A 1983-09-06 1983-09-06

Publications (3)

Publication Number Publication Date
GB8420944D0 GB8420944D0 (en) 1984-09-19
GB2146174A GB2146174A (en) 1985-04-11
GB2146174B true GB2146174B (en) 1987-04-23

Family

ID=24109306

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8420944A Expired GB2146174B (en) 1983-09-06 1984-08-17 Hermetic power chip packages

Country Status (4)

Country Link
JP (1) JPS6094742A (en)
CA (1) CA1216960A (en)
DE (1) DE3432449A1 (en)
GB (1) GB2146174B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111146152A (en) * 2019-10-30 2020-05-12 苏师大半导体材料与设备研究院(邳州)有限公司 Semiconductor packaging part

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
US5446316A (en) * 1994-01-06 1995-08-29 Harris Corporation Hermetic package for a high power semiconductor device
FR2793350B1 (en) * 1999-05-03 2003-08-15 St Microelectronics Sa PROTECTION OF A SEMICONDUCTOR CHIP
US7138708B2 (en) 1999-09-24 2006-11-21 Robert Bosch Gmbh Electronic system for fixing power and signal semiconductor chips
DE10156626A1 (en) * 2001-11-17 2003-06-05 Bosch Gmbh Robert Electronic arrangement
DE19950026B4 (en) * 1999-10-09 2010-11-11 Robert Bosch Gmbh The power semiconductor module
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
JP4479121B2 (en) 2001-04-25 2010-06-09 株式会社デンソー Manufacturing method of semiconductor device
US8018056B2 (en) * 2005-12-21 2011-09-13 International Rectifier Corporation Package for high power density devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1251874B (en) * 1960-10-17
DE1815799C3 (en) * 1968-12-19 1979-09-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Arrangement of a semiconductor component housing
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
DE2213915A1 (en) * 1972-03-22 1973-10-04 Siemens Ag HOUSING FOR SEMI-CONDUCTOR SYSTEMS
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
CH660258A5 (en) * 1983-01-20 1987-03-31 Landis & Gyr Ag CERAMIC HOUSING FOR A HYBRID CIRCUIT.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111146152A (en) * 2019-10-30 2020-05-12 苏师大半导体材料与设备研究院(邳州)有限公司 Semiconductor packaging part

Also Published As

Publication number Publication date
CA1216960A (en) 1987-01-20
JPS6094742A (en) 1985-05-27
JPH0118583B2 (en) 1989-04-06
GB2146174A (en) 1985-04-11
DE3432449C2 (en) 1991-08-22
DE3432449A1 (en) 1985-04-04
GB8420944D0 (en) 1984-09-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030817