GB2214513B - Semi-conductor package - Google Patents

Semi-conductor package

Info

Publication number
GB2214513B
GB2214513B GB8906366A GB8906366A GB2214513B GB 2214513 B GB2214513 B GB 2214513B GB 8906366 A GB8906366 A GB 8906366A GB 8906366 A GB8906366 A GB 8906366A GB 2214513 B GB2214513 B GB 2214513B
Authority
GB
United Kingdom
Prior art keywords
semi
conductor package
conductor
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8906366A
Other versions
GB2214513A (en
GB8906366D0 (en
Inventor
Michael Morris
John Vickers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxley Developments Co Ltd
Original Assignee
Oxley Developments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB858526397A external-priority patent/GB8526397D0/en
Application filed by Oxley Developments Co Ltd filed Critical Oxley Developments Co Ltd
Publication of GB8906366D0 publication Critical patent/GB8906366D0/en
Publication of GB2214513A publication Critical patent/GB2214513A/en
Application granted granted Critical
Publication of GB2214513B publication Critical patent/GB2214513B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
GB8906366A 1985-10-25 1989-03-20 Semi-conductor package Expired - Fee Related GB2214513B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB858526397A GB8526397D0 (en) 1985-10-25 1985-10-25 Metallising paste
GB8625066A GB2182045B (en) 1985-10-25 1986-10-20 Metallising paste

Publications (3)

Publication Number Publication Date
GB8906366D0 GB8906366D0 (en) 1989-05-04
GB2214513A GB2214513A (en) 1989-09-06
GB2214513B true GB2214513B (en) 1990-02-28

Family

ID=26289933

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8906366A Expired - Fee Related GB2214513B (en) 1985-10-25 1989-03-20 Semi-conductor package

Country Status (1)

Country Link
GB (1) GB2214513B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0010282D0 (en) 2000-04-27 2000-06-14 Oxley Dev Co Ltd Electrical connector
CN115073148B (en) * 2022-07-21 2023-08-08 瓷金科技(河南)有限公司 Ceramic packaging base and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB901261A (en) * 1960-07-14 1962-07-18 Purolator Products Inc Sintered porous metal filter
GB1339674A (en) * 1971-03-11 1973-12-05 Bendix Corp Coating for protecting a carbon substrate and method for applying said coating
GB1465908A (en) * 1972-12-14 1977-03-02 Dow Chemical Co Preparation and use of particulate metal
EP0165427A2 (en) * 1984-05-21 1985-12-27 International Business Machines Corporation Semiconductor package substrate and manufacturing process
GB2163168A (en) * 1984-08-16 1986-02-19 Shinetsu Polymer Co Electroconductive adhesive
GB2173199A (en) * 1985-04-02 1986-10-08 G C Dental Ind Corp Dental composite resin composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB901261A (en) * 1960-07-14 1962-07-18 Purolator Products Inc Sintered porous metal filter
GB1339674A (en) * 1971-03-11 1973-12-05 Bendix Corp Coating for protecting a carbon substrate and method for applying said coating
GB1465908A (en) * 1972-12-14 1977-03-02 Dow Chemical Co Preparation and use of particulate metal
EP0165427A2 (en) * 1984-05-21 1985-12-27 International Business Machines Corporation Semiconductor package substrate and manufacturing process
GB2163168A (en) * 1984-08-16 1986-02-19 Shinetsu Polymer Co Electroconductive adhesive
GB2173199A (en) * 1985-04-02 1986-10-08 G C Dental Ind Corp Dental composite resin composition

Also Published As

Publication number Publication date
GB2214513A (en) 1989-09-06
GB8906366D0 (en) 1989-05-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951020