GB2173949B - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
GB2173949B
GB2173949B GB08609256A GB8609256A GB2173949B GB 2173949 B GB2173949 B GB 2173949B GB 08609256 A GB08609256 A GB 08609256A GB 8609256 A GB8609256 A GB 8609256A GB 2173949 B GB2173949 B GB 2173949B
Authority
GB
United Kingdom
Prior art keywords
semi
conductor device
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08609256A
Other versions
GB2173949A (en
GB8609256D0 (en
Inventor
Mitsuo Ohdate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5804785U external-priority patent/JPS61173136U/ja
Priority claimed from JP5804885U external-priority patent/JPS61173137U/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB8609256D0 publication Critical patent/GB8609256D0/en
Publication of GB2173949A publication Critical patent/GB2173949A/en
Application granted granted Critical
Publication of GB2173949B publication Critical patent/GB2173949B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
GB08609256A 1985-04-16 1986-04-16 Semi-conductor device Expired GB2173949B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5804785U JPS61173136U (en) 1985-04-16 1985-04-16
JP5804885U JPS61173137U (en) 1985-04-16 1985-04-16

Publications (3)

Publication Number Publication Date
GB8609256D0 GB8609256D0 (en) 1986-05-21
GB2173949A GB2173949A (en) 1986-10-22
GB2173949B true GB2173949B (en) 1988-10-05

Family

ID=26399129

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08609256A Expired GB2173949B (en) 1985-04-16 1986-04-16 Semi-conductor device

Country Status (2)

Country Link
DE (1) DE3612813A1 (en)
GB (1) GB2173949B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642337Y2 (en) * 1984-07-05 1994-11-02 三菱電機株式会社 Semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514147A1 (en) * 1965-07-23 1969-07-17 Licentia Gmbh Rectifier cell with pressure contact
DE1564273A1 (en) * 1966-08-29 1969-07-24 Licentia Gmbh Method for manufacturing a semiconductor rectifier cell
DE2029135C3 (en) * 1969-06-12 1983-02-24 CKD Praha O.P., Praha Arrangement for electrical insulation in a semiconductor component
DE2347182A1 (en) * 1973-09-19 1975-03-27 Siemens Ag Semiconductor building-element with supply electrode and metal-housing - has heat-resistant elastomer annular disc elastic element
DE2825682C2 (en) * 1978-06-12 1984-09-20 Brown, Boveri & Cie Ag, 6800 Mannheim Semiconductor component with insulating housing
DE3221794A1 (en) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim DISC-SHAPED SEMICONDUCTOR CELL FOR PRESSURE-CONTACTABLE POWER SEMICONDUCTOR COMPONENTS

Also Published As

Publication number Publication date
DE3612813A1 (en) 1986-10-23
GB2173949A (en) 1986-10-22
GB8609256D0 (en) 1986-05-21

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19951108

PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960416