JPS61173137U - - Google Patents
Info
- Publication number
- JPS61173137U JPS61173137U JP5804885U JP5804885U JPS61173137U JP S61173137 U JPS61173137 U JP S61173137U JP 5804885 U JP5804885 U JP 5804885U JP 5804885 U JP5804885 U JP 5804885U JP S61173137 U JPS61173137 U JP S61173137U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- flat plate
- hard
- elastic
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000000605 extraction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
第１図はこの考案の実施例である半導体装置を
示す断面図である。第２図はこの考案の実施例で
ある半導体装置の絶縁複合リングを示す拡大断面
図である。第３図は従来の半導体装置を示す断面
図である。
図において、１は半導体素子、２はスタツド、
２１は筒体部、２２は筒体端部、２３は本体部、
２４は素子載置面、２５は空間部、２６は開口部
、３は引出電極、３１は棒状部、３２はつば部、
４は絶縁リング、５は平座金、６は皿ばね、７は
樹脂、８はねじ、１０は絶縁複合リング、１１は
弾性リング、１２ａ，１２ｂは硬質リングである
。なお、各図中同一符号は同一または相当部分を
示す。
FIG. 1 is a sectional view showing a semiconductor device which is an embodiment of this invention. FIG. 2 is an enlarged sectional view showing an insulating composite ring of a semiconductor device which is an embodiment of this invention. FIG. 3 is a sectional view showing a conventional semiconductor device. In the figure, 1 is a semiconductor element, 2 is a stud,
21 is a cylindrical body part, 22 is a cylindrical body end part, 23 is a main body part,
24 is an element mounting surface, 25 is a space, 26 is an opening, 3 is an extraction electrode, 31 is a rod-shaped portion, 32 is a collar,
4 is an insulating ring, 5 is a flat washer, 6 is a disc spring, 7 is a resin, 8 is a screw, 10 is an insulating composite ring, 11 is an elastic ring, and 12a and 12b are hard rings. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
と、 前記第１の電極の上面に設けられ、前記第１の
電極の前記空間部に収納される半導体素子と、 前記半導体素子の上面に設けられ、平板部と該
平板部の上面から延びる凸部とからなる第２の電
極とを備え、 前記第２の電極の前記平板部および前記凸部の
一部は前記第１の電極の前記空間部に収納され、 前記第２の電極の前記凸部を囲むように前記第
２の電極の前記平板部の上面に設けられ、前記第
１の電極の前記空間部に収納される複合部材とを
備え、 前記複合部材は第１の硬質部材と第２の硬質部
材と該第１および第２の硬質部材間に設けられる
弾性絶縁部材とからなり、 前記第１の硬質部材と前記弾性絶縁部材と前記
第２の硬質部材とは前記第２の電極の前記凸部の
軸方向に積層されており、 前記第２の電極の前記凸部を囲むように前記複
合部材の上面に設けられ、前記第１の電極の前記
空間部に収納される弾性部材とを備え、 前記弾性部材の外縁部近傍が前記第１の電極の
開口部近傍に接触するようにされ、 前記弾性部材の弾性力により前記複合部材と前
記第２の電極の前記平板部と前記半導体素子と前
記第１の電極とが相互に加圧されるようにし、 前記加圧により前記複合部材の前記弾性絶縁部
材の外周部が前記第１の電極の内壁に、その内周
部が前記第２の電極の前記凸部の外壁に接触する
ように構成された半導体装置。[Claims for Utility Model Registration] A first electrode having an open space inside thereof; and a semiconductor element provided on the upper surface of the first electrode and housed in the space of the first electrode. , a second electrode provided on the upper surface of the semiconductor element and consisting of a flat plate part and a convex part extending from the upper surface of the flat plate part, a part of the flat plate part and the convex part of the second electrode housed in the space of the first electrode, provided on the upper surface of the flat plate part of the second electrode so as to surround the convex part of the second electrode, and arranged in the space of the first electrode. a composite member housed in the first hard member; the composite member includes a first hard member, a second hard member, and an elastic insulating member provided between the first and second hard members; The hard member, the elastic insulating member, and the second hard member are laminated in the axial direction of the convex portion of the second electrode, and the composite member surrounds the convex portion of the second electrode. an elastic member provided on the upper surface of the first electrode and housed in the space of the first electrode, the vicinity of the outer edge of the elastic member being in contact with the vicinity of the opening of the first electrode; The composite member, the flat plate portion of the second electrode, the semiconductor element, and the first electrode are pressurized with each other by the elastic force of the elastic member, and the pressure increases the elasticity of the composite member. A semiconductor device configured such that an outer peripheral portion of the insulating member contacts an inner wall of the first electrode, and an inner peripheral portion of the insulating member contacts an outer wall of the convex portion of the second electrode.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5804885U JPS61173137U (en) | 1985-04-16 | 1985-04-16 | |
| GB08609256A GB2173949B (en) | 1985-04-16 | 1986-04-16 | Semi-conductor device |
| DE19863612813 DE3612813A1 (en) | 1985-04-16 | 1986-04-16 | SEMICONDUCTOR COMPONENT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5804885U JPS61173137U (en) | 1985-04-16 | 1985-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61173137U true JPS61173137U (en) | 1986-10-28 |
Family
ID=30583173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5804885U Pending JPS61173137U (en) | 1985-04-16 | 1985-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61173137U (en) |
-
1985
- 1985-04-16 JP JP5804885U patent/JPS61173137U/ja active Pending
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