JP4450230B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4450230B2 JP4450230B2 JP2005371815A JP2005371815A JP4450230B2 JP 4450230 B2 JP4450230 B2 JP 4450230B2 JP 2005371815 A JP2005371815 A JP 2005371815A JP 2005371815 A JP2005371815 A JP 2005371815A JP 4450230 B2 JP4450230 B2 JP 4450230B2
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- metal
- semiconductor device
- layers
- insulating substrate
- metal electrodes
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Description
図1は、本発明の第1実施形態に係る半導体装置100の概略平面構成を示す図であり、本半導体装置100におけるモールド樹脂11内の各部の平面配置構成を示す図である。また、図2は、図1中のA−A線に沿った概略断面図である。なお、以下の各断面図においては、すべての部材の断面にハッチングを施すと、各部を識別して見分けにくくなるため、一部のものについては、ハッチングを省略してある。
図3は、本発明の第2実施形態に係る半導体装置200の概略断面構成を示す図である。本半導体装置200は、上記第1実施形態に示される半導体装置100において、リード3c、4cに相当する部分を変形したものであり、その他は同様である。
図4は、本発明の第3実施形態に係る半導体装置300の概略断面構成を示す図である。本半導体装置300は、上記第2実施形態に示される半導体装置200において、導体部材3d、4dと素子側層3b、4bとの接続手段を変更したものであり、その他は同様である。
図5は、本発明の第4実施形態に係る半導体装置400の概略断面構成を示す図であり、図6は、この半導体装置400における第2の金属電極4、第2の絶縁基板6および金属層8の概略上面図である。
図7は、本発明の第5実施形態に係る半導体装置500の概略断面構成を示す図である。また、図8(a)、(b)は、それぞれ本半導体装置500における第2の金属電極4単体の概略平面図、および第2の絶縁基板6に設けられる金属層8単体の概略平面図である。
なお、上記各実施形態では、一対の金属電極3、4の両方を、外面側から内面側へ向かって複数の層3a、3b、4a、4bが熱膨張係数の低い順に積層されてなる積層構造を有するものとしたが、どちらか一方の金属電極3、4のみをこのような積層構造を有するものとし、他方は従来のような単層の金属電極としてもよい。
3…第1の金属電極、3a…第1の金属電極における絶縁基板側層、
3b…第1の金属電極における素子側層、3d、4d…導体部材、
4…第2の金属電極、4a…第2の金属電極における絶縁基板側層、
4b…第2の金属電極における素子側層、5…第1の絶縁基板、
6…第2の絶縁基板、7、8…金属層、14…導電性接合部材、
15…ボンディングワイヤ、16…スリット。
Claims (29)
- 内面が対向するように設けられた放熱性を有する一対の金属電極(3、4)と、
前記両金属電極(3、4)に挟まれるように設けられ前記両金属電極(3、4)の内面に電気的に接続された半導体素子(1、2)と、
前記各金属電極(3、4)の外面に設けられた放熱性を有するセラミック製の絶縁基板(5、6)と、を備える半導体装置において、
前記一対の金属電極(3、4)の少なくとも一方の金属電極(3、4)は、前記外面側から前記内面側へ向かって複数の層(3a、3b、4a、4b)が熱膨張係数の低い順に積層されてなる積層構造を有するものであり、
前記一対の金属電極(3、4)の少なくとも一方の金属電極(3、4)には、スリット(16)が設けられていることを特徴とする半導体装置。 - 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も外面側に位置する層(3a、4a)は、鉄系金属よりなることを特徴とする請求項1に記載の半導体装置。
- 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)のみが、外部と電気的に接続されるようになっていることを特徴とする請求項2に記載の半導体装置。
- 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)は、当該層とは別体の導体部材(3d、4d)に対して導電性接合部材(14)によって接続されており、
この導体部材(3d、4d)を介して外部と電気的に接続されるようになっていることを特徴とする請求項3に記載の半導体装置。 - 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)は、当該層とは別体の導体部材(3d、4d)に対してボンディングワイヤ(15)によって接続されており、
この導体部材(3d、4d)を介して外部と電気的に接続されるようになっていることを特徴とする請求項3に記載の半導体装置。 - 各々の前記絶縁基板(5、6)の少なくとも一方の絶縁基板(5、6)において、前記金属電極(3、4)側とは反対側の面には、前記金属電極(3、4)と電気的に絶縁した状態にて、金属層(7、8)が設けられていることを特徴とする請求項1ないし5のいずれか1つに記載の半導体装置。
- 前記金属層(7、8)が設けられている前記絶縁基板(5、6)において、当該絶縁基板(5、6)を挟んでいる前記金属電極(3、4)と前記金属層(7、8)とでは、前記金属電極(3、4)の方が厚いことを特徴とする請求項6に記載の半導体装置。
- 前記金属層(7、8)が設けられている前記絶縁基板(5、6)において、前記金属層(7、8)は、当該絶縁基板(5、6)よりも平面サイズが小さく当該絶縁基板(5、6)の範囲内に位置したものであることを特徴とする請求項6または7に記載の半導体装置。
- 前記金属層(7、8)にはスリット(16)が設けられていることを特徴とする請求項6ないし8のいずれか1つに記載の半導体装置。
- 内面が対向するように設けられた放熱性を有する一対の金属電極(3、4)と、
前記両金属電極(3、4)に挟まれるように設けられ前記両金属電極(3、4)の内面に電気的に接続された半導体素子(1、2)と、
前記各金属電極(3、4)の外面に設けられた放熱性を有するセラミック製の絶縁基板(5、6)と、を備える半導体装置において、
前記一対の金属電極(3、4)の少なくとも一方の金属電極(3、4)は、前記外面側から前記内面側へ向かって複数の層(3a、3b、4a、4b)が熱膨張係数の低い順に積層されてなる積層構造を有するものであり、
各々の前記絶縁基板(5、6)の少なくとも一方の絶縁基板(5、6)において、前記金属電極(3、4)側とは反対側の面には、前記金属電極(3、4)と電気的に絶縁した状態にて、金属層(7、8)が設けられており、
前記金属層(7、8)にはスリット(16)が設けられていることを特徴とする半導体装置。 - 前記一対の金属電極(3、4)の少なくとも一方の金属電極(3、4)には、スリット(16)が設けられていることを特徴とする請求項10に記載の半導体装置。
- 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も外面側に位置する層(3a、4a)は、鉄系金属よりなることを特徴とする請求項10または11に記載の半導体装置。
- 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)のみが、外部と電気的に接続されるようになっていることを特徴とする請求項12に記載の半導体装置。
- 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)は、当該層とは別体の導体部材(3d、4d)に対して導電性接合部材(14)によって接続されており、
この導体部材(3d、4d)を介して外部と電気的に接続されるようになっていることを特徴とする請求項13に記載の半導体装置。 - 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)は、当該層とは別体の導体部材(3d、4d)に対してボンディングワイヤ(15)によって接続されており、
この導体部材(3d、4d)を介して外部と電気的に接続されるようになっていることを特徴とする請求項13に記載の半導体装置。 - 各々の前記絶縁基板(5、6)の少なくとも一方の絶縁基板(5、6)において、前記金属電極(3、4)側とは反対側の面には、前記金属電極(3、4)と電気的に絶縁した状態にて、金属層(7、8)が設けられていることを特徴とする請求項10ないし15のいずれか1つに記載の半導体装置。
- 前記金属層(7、8)が設けられている前記絶縁基板(5、6)において、当該絶縁基板(5、6)を挟んでいる前記金属電極(3、4)と前記金属層(7、8)とでは、前記金属電極(3、4)の方が厚いことを特徴とする請求項16に記載の半導体装置。
- 前記金属層(7、8)が設けられている前記絶縁基板(5、6)において、前記金属層(7、8)は、当該絶縁基板(5、6)よりも平面サイズが小さく当該絶縁基板(5、6)の範囲内に位置したものであることを特徴とする請求項16または17に記載の半導体装置。
- 前記金属層(7、8)にはスリット(16)が設けられていることを特徴とする請求項16ないし18のいずれか1つに記載の半導体装置。
- 内面が対向するように設けられた放熱性を有する一対の金属電極(3、4)と、
前記両金属電極(3、4)に挟まれるように設けられ前記両金属電極(3、4)の内面に電気的に接続された半導体素子(1、2)と、
前記各金属電極(3、4)の外面に設けられた放熱性を有するセラミック製の絶縁基板(5、6)と、を備える半導体装置において、
前記一対の金属電極(3、4)の少なくとも一方の金属電極(3、4)は、前記外面側から前記内面側へ向かって複数の層(3a、3b、4a、4b)が熱膨張係数の低い順に積層されてなる積層構造を有するものであり、
前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も外面側に位置する層(3a、4a)は、鉄系金属よりなることを特徴とする半導体装置。 - 前記一対の金属電極(3、4)の少なくとも一方の金属電極(3、4)には、スリット(16)が設けられていることを特徴とする請求項20に記載の半導体装置。
- 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)のみが、外部と電気的に接続されるようになっていることを特徴とする請求項20または21に記載の半導体装置。
- 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)は、当該層とは別体の導体部材(3d、4d)に対して導電性接合部材(14)によって接続されており、
この導体部材(3d、4d)を介して外部と電気的に接続されるようになっていることを特徴とする請求項22に記載の半導体装置。 - 前記積層構造を有する金属電極(3、4)のうち当該金属電極(3、4)の最も内面側に位置する層(3b、4b)は、当該層とは別体の導体部材(3d、4d)に対してボンディングワイヤ(15)によって接続されており、
この導体部材(3d、4d)を介して外部と電気的に接続されるようになっていることを特徴とする請求項22に記載の半導体装置。 - 各々の前記絶縁基板(5、6)の少なくとも一方の絶縁基板(5、6)において、前記金属電極(3、4)側とは反対側の面には、前記金属電極(3、4)と電気的に絶縁した状態にて、金属層(7、8)が設けられていることを特徴とする請求項20ないし24のいずれか1つに記載の半導体装置。
- 前記金属層(7、8)が設けられている前記絶縁基板(5、6)において、当該絶縁基板(5、6)を挟んでいる前記金属電極(3、4)と前記金属層(7、8)とでは、前記金属電極(3、4)の方が厚いことを特徴とする請求項25に記載の半導体装置。
- 前記金属層(7、8)が設けられている前記絶縁基板(5、6)において、前記金属層(7、8)は、当該絶縁基板(5、6)よりも平面サイズが小さく当該絶縁基板(5、6)の範囲内に位置したものであることを特徴とする請求項25または26に記載の半導体装置。
- 前記金属層(7、8)にはスリット(16)が設けられていることを特徴とする請求項25ないし27のいずれか1つに記載の半導体装置。
- 前記一対の金属電極(3、4)の両方が、前記積層構造を有するものとなっていることを特徴とする請求項1ないし28のいずれか1つに記載の半導体装置。
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DE102006059501A DE102006059501B4 (de) | 2005-12-26 | 2006-12-15 | Halbleitervorrichtung mit Halbleiterelement, Isolationssubstrat und Metallelektrode |
CNB2006101711612A CN100517696C (zh) | 2005-12-26 | 2006-12-25 | 具有半导体元件、绝缘基板和金属电极的半导体器件 |
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