IL135139A0
(en)
|
1997-09-19 |
2001-05-20 |
Nikon Corp |
Stage apparatus, scanning type exposure apparatus, and device produced with the same
|
WO1999027568A1
(fr)
*
|
1997-11-21 |
1999-06-03 |
Nikon Corporation |
Graveur de motifs a projection et procede de sensibilisation a projection
|
TW448487B
(en)
|
1997-11-22 |
2001-08-01 |
Nippon Kogaku Kk |
Exposure apparatus, exposure method and manufacturing method of device
|
US6897963B1
(en)
|
1997-12-18 |
2005-05-24 |
Nikon Corporation |
Stage device and exposure apparatus
|
US6370487B1
(en)
*
|
1998-04-23 |
2002-04-09 |
Micron Technology, Inc. |
Remote semiconductor microscopy
|
JP4365908B2
(ja)
|
1998-09-04 |
2009-11-18 |
キヤノン株式会社 |
面位置検出装置、露光装置およびデバイス製造方法
|
JP4134406B2
(ja)
|
1998-12-04 |
2008-08-20 |
株式会社ニコン |
平面モータ装置及び露光装置
|
DE69943311D1
(de)
|
1998-12-24 |
2011-05-12 |
Canon Kk |
Trägerplattesteuerungsvorrichtung, Belichtungsapparat und Verfahren zur Herstellung einer Halbleitervorrichtung
|
TW490596B
(en)
|
1999-03-08 |
2002-06-11 |
Asm Lithography Bv |
Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
|
US6924884B2
(en)
|
1999-03-08 |
2005-08-02 |
Asml Netherlands B.V. |
Off-axis leveling in lithographic projection apparatus
|
US7116401B2
(en)
|
1999-03-08 |
2006-10-03 |
Asml Netherlands B.V. |
Lithographic projection apparatus using catoptrics in an optical sensor system, optical arrangement, method of measuring, and device manufacturing method
|
US7023521B2
(en)
*
|
1999-04-13 |
2006-04-04 |
Nikon Corporation |
Exposure apparatus, exposure method and process for producing device
|
WO2001023933A1
(fr)
|
1999-09-29 |
2001-04-05 |
Nikon Corporation |
Systeme optique de projection
|
EP1139138A4
(en)
|
1999-09-29 |
2006-03-08 |
Nikon Corp |
PROJECTION EXPOSURE PROCESS, DEVICE AND OPTICAL PROJECTION SYSTEM
|
EP1093021A3
(en)
|
1999-10-15 |
2004-06-30 |
Nikon Corporation |
Projection optical system as well as equipment and methods making use of said system
|
AU3271801A
(en)
*
|
1999-11-30 |
2001-06-12 |
Silicon Valley Group, Inc. |
Dual-stage lithography apparatus and method
|
JP2001160530A
(ja)
|
1999-12-01 |
2001-06-12 |
Nikon Corp |
ステージ装置及び露光装置
|
EP1111471B1
(en)
*
|
1999-12-21 |
2005-11-23 |
ASML Netherlands B.V. |
Lithographic projection apparatus with collision preventing device
|
TW538256B
(en)
|
2000-01-14 |
2003-06-21 |
Zeiss Stiftung |
Microlithographic reduction projection catadioptric objective
|
US6690450B2
(en)
|
2000-01-31 |
2004-02-10 |
Nikon Corporation |
Exposure method, exposure apparatus, method for producing exposure apparatus, and method for producing device
|
JP2001308003A
(ja)
|
2000-02-15 |
2001-11-02 |
Nikon Corp |
露光方法及び装置、並びにデバイス製造方法
|
US7301605B2
(en)
|
2000-03-03 |
2007-11-27 |
Nikon Corporation |
Projection exposure apparatus and method, catadioptric optical system and manufacturing method of devices
|
JP2001257143A
(ja)
|
2000-03-09 |
2001-09-21 |
Nikon Corp |
ステージ装置及び露光装置、並びにデバイス製造方法
|
JP2001332490A
(ja)
*
|
2000-03-14 |
2001-11-30 |
Nikon Corp |
位置合わせ方法、露光方法、露光装置、及びデバイス製造方法
|
JP2001345250A
(ja)
*
|
2000-06-01 |
2001-12-14 |
Canon Inc |
位置合せ方法、位置合せ装置、プロファイラ、露光装置、半導体デバイス製造方法、半導体製造工場、および露光装置の保守方法
|
US7289212B2
(en)
|
2000-08-24 |
2007-10-30 |
Asml Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufacturing thereby
|
TW527526B
(en)
|
2000-08-24 |
2003-04-11 |
Asml Netherlands Bv |
Lithographic apparatus, device manufacturing method, and device manufactured thereby
|
US7561270B2
(en)
|
2000-08-24 |
2009-07-14 |
Asml Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufactured thereby
|
EP1182509B1
(en)
*
|
2000-08-24 |
2009-04-08 |
ASML Netherlands B.V. |
Lithographic apparatus, calibration method thereof and device manufacturing method
|
WO2002019401A1
(fr)
*
|
2000-08-29 |
2002-03-07 |
Nikon Corporation |
Procede et dispositif d'exposition
|
US6708131B1
(en)
*
|
2000-08-30 |
2004-03-16 |
Micron Technology, Inc. |
Wafer alignment system
|
TW497013B
(en)
*
|
2000-09-07 |
2002-08-01 |
Asm Lithography Bv |
Method for calibrating a lithographic projection apparatus and apparatus capable of applying such a method
|
EP1186959B1
(en)
*
|
2000-09-07 |
2009-06-17 |
ASML Netherlands B.V. |
Method for calibrating a lithographic projection apparatus
|
JP2002231622A
(ja)
|
2000-11-29 |
2002-08-16 |
Nikon Corp |
ステージ装置及び露光装置
|
US6591160B2
(en)
*
|
2000-12-04 |
2003-07-08 |
Asyst Technologies, Inc. |
Self teaching robot
|
EP1265271A4
(en)
*
|
2000-12-06 |
2006-03-15 |
Nikon Corp |
DEVICE AND METHOD FOR X-RAY PROJECTION EXPOSURE AND SEMICONDUCTOR DEVICE
|
JP2002289515A
(ja)
*
|
2000-12-28 |
2002-10-04 |
Nikon Corp |
製品の製造方法、露光装置の製造方法、露光装置、及びデバイス製造方法
|
US6628372B2
(en)
*
|
2001-02-16 |
2003-09-30 |
Mccullough Andrew W. |
Use of multiple reticles in lithographic printing tools
|
JP2002323652A
(ja)
|
2001-02-23 |
2002-11-08 |
Nikon Corp |
投影光学系,該投影光学系を備えた投影露光装置および投影露光方法
|
JP2002280283A
(ja)
*
|
2001-03-16 |
2002-09-27 |
Canon Inc |
基板処理装置
|
JP2002287023A
(ja)
|
2001-03-27 |
2002-10-03 |
Nikon Corp |
投影光学系、該投影光学系を備えた投影露光装置及び投影露光方法
|
JP2002305140A
(ja)
*
|
2001-04-06 |
2002-10-18 |
Nikon Corp |
露光装置及び基板処理システム
|
US6859260B2
(en)
*
|
2001-04-25 |
2005-02-22 |
Asml Holding N.V. |
Method and system for improving focus accuracy in a lithography system
|
JP2002353112A
(ja)
*
|
2001-05-25 |
2002-12-06 |
Riipuru:Kk |
電子ビーム近接露光装置における電子ビームの傾き測定方法及び傾き較正方法並びに電子ビーム近接露光装置
|
JP2002350128A
(ja)
*
|
2001-05-30 |
2002-12-04 |
Canon Inc |
立体形状計測装置並びに立体形状計測方法および位置合わせ方法
|
US6788385B2
(en)
*
|
2001-06-21 |
2004-09-07 |
Nikon Corporation |
Stage device, exposure apparatus and method
|
WO2003010802A1
(fr)
*
|
2001-07-26 |
2003-02-06 |
Nikon Corporation |
Appareil a etage, systeme et procede d'exposition et procede de production de dispositif
|
US6678038B2
(en)
|
2001-08-03 |
2004-01-13 |
Nikon Corporation |
Apparatus and methods for detecting tool-induced shift in microlithography apparatus
|
US6674512B2
(en)
|
2001-08-07 |
2004-01-06 |
Nikon Corporation |
Interferometer system for a semiconductor exposure system
|
JP2003086492A
(ja)
*
|
2001-09-12 |
2003-03-20 |
Canon Inc |
露光装置及びその制御方法並びにデバイスの製造方法
|
US6785005B2
(en)
|
2001-09-21 |
2004-08-31 |
Nikon Corporation |
Switching type dual wafer stage
|
TWI225665B
(en)
*
|
2001-10-17 |
2004-12-21 |
Canon Kk |
Apparatus control system, apparatus control method, semiconductor exposure apparatus, semiconductor exposure apparatus control method and semiconductor device manufacturing method
|
US6813003B2
(en)
*
|
2002-06-11 |
2004-11-02 |
Mark Oskotsky |
Advanced illumination system for use in microlithography
|
US6665054B2
(en)
*
|
2001-10-22 |
2003-12-16 |
Nikon Corporation |
Two stage method
|
FR2832546B1
(fr)
*
|
2001-11-20 |
2008-04-04 |
Centre Nat Rech Scient |
Dispositif de reglage d'un appareil de generation d'un faisceau de particules chargees
|
CN101447438B
(zh)
*
|
2001-12-14 |
2010-12-01 |
瑞萨电子株式会社 |
半导体器件的制造方法
|
TWI295070B
(en)
|
2001-12-21 |
2008-03-21 |
Asml Netherlands Bv |
Semiconductor device manufacturing method,semiconductor device manufactured thereby and lithographic apparatus therefor
|
TW516099B
(en)
*
|
2001-12-28 |
2003-01-01 |
Nanya Technology Corp |
Exposure method and system with self-feedback correction
|
US6777143B2
(en)
*
|
2002-01-28 |
2004-08-17 |
Taiwan Semiconductor Manufacturing Company |
Multiple mask step and scan aligner
|
EP1353229A1
(en)
*
|
2002-04-09 |
2003-10-15 |
ASML Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufactured thereby
|
EP1353233A3
(en)
*
|
2002-04-09 |
2007-10-03 |
ASML Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
WO2003085708A1
(fr)
*
|
2002-04-09 |
2003-10-16 |
Nikon Corporation |
Procede d'exposition, dispositif d'exposition et procede de fabrication dudit dispositif
|
US6924896B2
(en)
*
|
2002-04-11 |
2005-08-02 |
Zygo Corporation |
Interferometry system error compensation in twin stage lithography tools
|
JP3966211B2
(ja)
*
|
2002-05-08 |
2007-08-29 |
株式会社ニコン |
露光方法、露光装置及びデバイス製造方法
|
US6757110B2
(en)
|
2002-05-29 |
2004-06-29 |
Asml Holding N.V. |
Catadioptric lithography system and method with reticle stage orthogonal to wafer stage
|
CN1327295C
(zh)
|
2002-06-13 |
2007-07-18 |
Asml荷兰有限公司 |
光刻装置、器件的制造方法和由此制得的器件
|
JP4546019B2
(ja)
*
|
2002-07-03 |
2010-09-15 |
株式会社日立製作所 |
露光装置
|
EP1383007A1
(en)
*
|
2002-07-16 |
2004-01-21 |
ASML Netherlands B.V. |
Lithographic apparatus, and device manufacturing method
|
JP3862639B2
(ja)
*
|
2002-08-30 |
2006-12-27 |
キヤノン株式会社 |
露光装置
|
US6841956B2
(en)
*
|
2002-09-17 |
2005-01-11 |
Nikon Corporation |
Actuator to correct for off center-of-gravity line of force
|
TWI246114B
(en)
*
|
2002-09-24 |
2005-12-21 |
Asml Netherlands Bv |
Lithographic apparatus, device manufacturing method, and device manufactured thereby
|
US20040081446A1
(en)
*
|
2002-10-28 |
2004-04-29 |
Eastman Kodak Company |
Electronic imaging system with row-wise or column-wise image sensor reset synchronized to a mechanical shutter
|
TW200412617A
(en)
*
|
2002-12-03 |
2004-07-16 |
Nikon Corp |
Optical illumination device, method for adjusting optical illumination device, exposure device and exposure method
|
EP1586386A4
(en)
|
2002-12-03 |
2010-04-21 |
Nikon Corp |
METHOD AND DEVICE FOR REMOVING CONTAMINATION AND EXPOSURE METHOD AND DEVICE
|
WO2004053954A1
(ja)
*
|
2002-12-10 |
2004-06-24 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
US7242455B2
(en)
*
|
2002-12-10 |
2007-07-10 |
Nikon Corporation |
Exposure apparatus and method for producing device
|
SG157962A1
(en)
*
|
2002-12-10 |
2010-01-29 |
Nikon Corp |
Exposure apparatus and method for producing device
|
WO2004053952A1
(ja)
*
|
2002-12-10 |
2004-06-24 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
DE10261775A1
(de)
|
2002-12-20 |
2004-07-01 |
Carl Zeiss Smt Ag |
Vorrichtung zur optischen Vermessung eines Abbildungssystems
|
US6744058B1
(en)
*
|
2002-12-20 |
2004-06-01 |
Taiwan Semiconductor Manufacturing Co., Ltd |
Geometric compensation method for charged particle beam irradiation
|
US7265881B2
(en)
*
|
2002-12-20 |
2007-09-04 |
Hewlett-Packard Development Company, L.P. |
Method and apparatus for measuring assembly and alignment errors in sensor assemblies
|
SG125101A1
(en)
*
|
2003-01-14 |
2006-09-29 |
Asml Netherlands Bv |
Level sensor for lithographic apparatus
|
EP1439428A3
(en)
*
|
2003-01-14 |
2009-05-13 |
ASML Netherlands B.V. |
Level sensor for lithographic apparatus
|
WO2004068414A1
(ja)
*
|
2003-01-27 |
2004-08-12 |
Fujitsu Limited |
注目物体の出現位置表示装置
|
JP3689698B2
(ja)
|
2003-01-31 |
2005-08-31 |
キヤノン株式会社 |
投影露光装置、投影露光方法および被露光部材の製造方法
|
JP4101076B2
(ja)
*
|
2003-02-06 |
2008-06-11 |
キヤノン株式会社 |
位置検出方法及び装置
|
JP4652667B2
(ja)
*
|
2003-02-13 |
2011-03-16 |
キヤノン株式会社 |
面位置計測方法及び走査型露光装置
|
JPWO2004075268A1
(ja)
|
2003-02-19 |
2006-06-01 |
株式会社ニコン |
移動方法、露光方法及び露光装置、並びにデバイス製造方法
|
KR101442361B1
(ko)
|
2003-02-26 |
2014-09-23 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
JP4001559B2
(ja)
*
|
2003-03-04 |
2007-10-31 |
東京エレクトロン株式会社 |
インライン接続設定方法および装置
|
SG123601A1
(en)
*
|
2003-03-10 |
2006-07-26 |
Asml Netherlands Bv |
Focus spot monitoring in a lithographic projectionapparatus
|
KR101503992B1
(ko)
|
2003-04-09 |
2015-03-18 |
가부시키가이샤 니콘 |
노광 방법 및 장치, 그리고 디바이스 제조 방법
|
WO2004093159A2
(en)
*
|
2003-04-09 |
2004-10-28 |
Nikon Corporation |
Immersion lithography fluid control system
|
SG2014015176A
(en)
|
2003-04-10 |
2015-06-29 |
Nippon Kogaku Kk |
Environmental system including vacuum scavange for an immersion lithography apparatus
|
KR101431938B1
(ko)
*
|
2003-04-10 |
2014-08-19 |
가부시키가이샤 니콘 |
액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
|
EP2172809B1
(en)
|
2003-04-11 |
2018-11-07 |
Nikon Corporation |
Cleanup method for optics in an immersion lithography apparatus, and corresponding immersion lithography apparatus
|
KR101159564B1
(ko)
|
2003-04-11 |
2012-06-25 |
가부시키가이샤 니콘 |
액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침액체를 유지하는 장치 및 방법
|
JP4315420B2
(ja)
*
|
2003-04-18 |
2009-08-19 |
キヤノン株式会社 |
露光装置及び露光方法
|
TWI237307B
(en)
*
|
2003-05-01 |
2005-08-01 |
Nikon Corp |
Optical projection system, light exposing apparatus and light exposing method
|
WO2004102646A1
(ja)
*
|
2003-05-15 |
2004-11-25 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
TWI612556B
(zh)
*
|
2003-05-23 |
2018-01-21 |
Nikon Corp |
曝光裝置、曝光方法及元件製造方法
|
TWI470671B
(zh)
|
2003-05-23 |
2015-01-21 |
尼康股份有限公司 |
Exposure method and exposure apparatus, and device manufacturing method
|
KR20110110320A
(ko)
|
2003-05-28 |
2011-10-06 |
가부시키가이샤 니콘 |
노광 방법, 노광 장치, 및 디바이스 제조 방법
|
US6781674B1
(en)
*
|
2003-05-29 |
2004-08-24 |
Asml Holding N.V. |
System and method to increase throughput in a dual substrate stage double exposure lithography system
|
JP4376116B2
(ja)
*
|
2003-06-03 |
2009-12-02 |
東京エレクトロン株式会社 |
基板受け渡し位置の調整方法
|
US7598507B2
(en)
*
|
2003-06-11 |
2009-10-06 |
Texas Instruments Incorporated |
Adjustable lithography blocking device and method
|
KR101290021B1
(ko)
*
|
2003-06-13 |
2013-07-30 |
가부시키가이샤 니콘 |
노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
|
KR101476087B1
(ko)
*
|
2003-06-19 |
2014-12-23 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조방법
|
TWI246848B
(en)
*
|
2003-07-03 |
2006-01-01 |
Fuji Photo Film Co Ltd |
Image formation device
|
CN102854755A
(zh)
*
|
2003-07-09 |
2013-01-02 |
株式会社尼康 |
曝光装置
|
EP2264531B1
(en)
|
2003-07-09 |
2013-01-16 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
KR101296501B1
(ko)
|
2003-07-09 |
2013-08-13 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
KR20060026883A
(ko)
*
|
2003-07-09 |
2006-03-24 |
가부시키가이샤 니콘 |
결합장치, 노광장치 및 디바이스 제조방법
|
CN102043350B
(zh)
|
2003-07-28 |
2014-01-29 |
株式会社尼康 |
曝光装置、器件制造方法、及曝光装置的控制方法
|
EP1503244A1
(en)
|
2003-07-28 |
2005-02-02 |
ASML Netherlands B.V. |
Lithographic projection apparatus and device manufacturing method
|
US6952255B2
(en)
*
|
2003-08-06 |
2005-10-04 |
Lam Research Corporation |
System and method for integrated multi-use optical alignment
|
KR101205263B1
(ko)
*
|
2003-08-07 |
2012-11-27 |
가부시키가이샤 니콘 |
노광 방법 및 노광 장치, 스테이지 장치, 그리고 디바이스 제조 방법
|
KR101259095B1
(ko)
|
2003-08-21 |
2013-04-30 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
KR101242886B1
(ko)
|
2003-08-29 |
2013-03-12 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
KR101238114B1
(ko)
|
2003-09-03 |
2013-02-27 |
가부시키가이샤 니콘 |
액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
|
JP3870182B2
(ja)
*
|
2003-09-09 |
2007-01-17 |
キヤノン株式会社 |
露光装置及びデバイス製造方法
|
WO2005029559A1
(ja)
*
|
2003-09-19 |
2005-03-31 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
US8208198B2
(en)
|
2004-01-14 |
2012-06-26 |
Carl Zeiss Smt Gmbh |
Catadioptric projection objective
|
KR101238134B1
(ko)
*
|
2003-09-26 |
2013-02-28 |
가부시키가이샤 니콘 |
투영노광장치 및 투영노광장치의 세정방법, 메인터넌스 방법 그리고 디바이스의 제조방법
|
JP4289961B2
(ja)
*
|
2003-09-26 |
2009-07-01 |
キヤノン株式会社 |
位置決め装置
|
WO2005031823A1
(ja)
*
|
2003-09-29 |
2005-04-07 |
Nikon Corporation |
液浸型レンズ系及び投影露光装置、並びにデバイス製造方法
|
KR101443001B1
(ko)
*
|
2003-09-29 |
2014-09-22 |
가부시키가이샤 니콘 |
투영 노광 장치, 투영 노광 방법 및 디바이스 제조 방법
|
KR101421398B1
(ko)
|
2003-09-29 |
2014-07-18 |
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노광장치, 노광방법 및 디바이스 제조방법
|
JP4319188B2
(ja)
|
2003-10-08 |
2009-08-26 |
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|
TW201738932A
(zh)
|
2003-10-09 |
2017-11-01 |
Nippon Kogaku Kk |
曝光裝置及曝光方法、元件製造方法
|
EP1860506B1
(en)
*
|
2003-10-16 |
2009-04-08 |
ASML Netherlands B.V. |
Device manufacturing method
|
EP1679738A4
(en)
|
2003-10-28 |
2008-08-06 |
Nikon Corp |
EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
|
TWI474132B
(zh)
|
2003-10-28 |
2015-02-21 |
尼康股份有限公司 |
照明光學裝置、投影曝光裝置、曝光方法以及元件製造方法
|
EP3392713A1
(en)
|
2003-10-31 |
2018-10-24 |
Nikon Corporation |
Immersion exposure apparatus and method
|
KR20060109430A
(ko)
*
|
2003-11-17 |
2006-10-20 |
가부시키가이샤 니콘 |
스테이지 구동 방법, 스테이지 장치, 및 노광장치
|
TWI519819B
(zh)
*
|
2003-11-20 |
2016-02-01 |
尼康股份有限公司 |
光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
|
EP1699072B1
(en)
|
2003-12-03 |
2016-08-31 |
Nikon Corporation |
Exposure apparatus and exposure method
|
US7466489B2
(en)
|
2003-12-15 |
2008-12-16 |
Susanne Beder |
Projection objective having a high aperture and a planar end surface
|
JP5102492B2
(ja)
|
2003-12-19 |
2012-12-19 |
カール・ツァイス・エスエムティー・ゲーエムベーハー |
結晶素子を有するマイクロリソグラフィー投影用対物レンズ
|
KR100567622B1
(ko)
*
|
2003-12-29 |
2006-04-04 |
삼성전자주식회사 |
반도체 소자의 패턴 선폭 측정 방법 및 장치
|
KR101748504B1
(ko)
|
2004-01-05 |
2017-06-16 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
EP1705694A4
(en)
*
|
2004-01-06 |
2007-10-31 |
Nikon Corp |
EXPOSURE METHOD AND DEVICE AND COMPONENTS MANUFACTURING METHOD
|
US20080151364A1
(en)
|
2004-01-14 |
2008-06-26 |
Carl Zeiss Smt Ag |
Catadioptric projection objective
|
US7072024B2
(en)
|
2004-01-20 |
2006-07-04 |
Nikon Corporation |
Lithographic projection method and apparatus
|
DE602005019689D1
(de)
*
|
2004-01-20 |
2010-04-15 |
Zeiss Carl Smt Ag |
Belichtungsvorrichtung und messeinrichtung für eine projektionslinse
|
US7053980B2
(en)
*
|
2004-01-23 |
2006-05-30 |
Asml Netherlands B.V. |
Lithographic alignment system
|
US7697110B2
(en)
*
|
2004-01-26 |
2010-04-13 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
TWI395068B
(zh)
*
|
2004-01-27 |
2013-05-01 |
尼康股份有限公司 |
光學系統、曝光裝置以及曝光方法
|
US7589822B2
(en)
*
|
2004-02-02 |
2009-09-15 |
Nikon Corporation |
Stage drive method and stage unit, exposure apparatus, and device manufacturing method
|
US7990516B2
(en)
|
2004-02-03 |
2011-08-02 |
Nikon Corporation |
Immersion exposure apparatus and device manufacturing method with liquid detection apparatus
|
KR20190011830A
(ko)
|
2004-02-04 |
2019-02-07 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
WO2005076325A1
(ja)
*
|
2004-02-04 |
2005-08-18 |
Nikon Corporation |
露光装置及び方法、位置制御方法並びにデバイス製造方法
|
TWI609410B
(zh)
|
2004-02-06 |
2017-12-21 |
尼康股份有限公司 |
光學照明裝置、曝光裝置、曝光方法以及元件製造方法
|
KR101166007B1
(ko)
*
|
2004-02-10 |
2012-07-17 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법, 메인터넌스 방법 및노광 방법
|
JP4572896B2
(ja)
*
|
2004-02-19 |
2010-11-04 |
株式会社ニコン |
露光装置及びデバイスの製造方法
|
US20070030467A1
(en)
*
|
2004-02-19 |
2007-02-08 |
Nikon Corporation |
Exposure apparatus, exposure method, and device fabricating method
|
US8023100B2
(en)
*
|
2004-02-20 |
2011-09-20 |
Nikon Corporation |
Exposure apparatus, supply method and recovery method, exposure method, and device producing method
|
DE102004013886A1
(de)
|
2004-03-16 |
2005-10-06 |
Carl Zeiss Smt Ag |
Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem
|
KR20180042456A
(ko)
*
|
2004-03-25 |
2018-04-25 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
US7615424B2
(en)
*
|
2004-03-25 |
2009-11-10 |
Semiconductor Energy Laboratory Co., Ltd. |
Laser irradiation apparatus and method for manufacturing semiconductor device using the laser irradiation apparatus
|
US7242475B2
(en)
*
|
2004-03-25 |
2007-07-10 |
Asml Netherlands B.V. |
Method of determining aberration of a projection system of a lithographic apparatus
|
US7034917B2
(en)
*
|
2004-04-01 |
2006-04-25 |
Asml Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufactured thereby
|
WO2005098504A1
(en)
|
2004-04-08 |
2005-10-20 |
Carl Zeiss Smt Ag |
Imaging system with mirror group
|
JP2005303196A
(ja)
*
|
2004-04-15 |
2005-10-27 |
Canon Inc |
位置決め装置、露光装置、半導体デバイスの製造方法
|
EP1753016B1
(en)
*
|
2004-04-19 |
2012-06-20 |
Nikon Corporation |
Exposure apparatus and device producing method
|
EP1747499A2
(en)
|
2004-05-04 |
2007-01-31 |
Nikon Corporation |
Apparatus and method for providing fluid for immersion lithography
|
JP5769356B2
(ja)
|
2004-05-17 |
2015-08-26 |
カール・ツァイス・エスエムティー・ゲーエムベーハー |
中間像を有するカタジオプトリック投影対物レンズ
|
US7486381B2
(en)
*
|
2004-05-21 |
2009-02-03 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
US7385671B2
(en)
*
|
2004-05-28 |
2008-06-10 |
Azores Corporation |
High speed lithography machine and method
|
WO2005119742A1
(ja)
*
|
2004-06-04 |
2005-12-15 |
Nikon Corporation |
露光装置、露光方法及びデバイス製造方法
|
CN101833247B
(zh)
|
2004-06-04 |
2013-11-06 |
卡尔蔡司Smt有限责任公司 |
微光刻投影曝光系统的投影物镜的光学测量的测量系统
|
EP3203498A1
(en)
|
2004-06-09 |
2017-08-09 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
US8705008B2
(en)
|
2004-06-09 |
2014-04-22 |
Nikon Corporation |
Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
|
US8508713B2
(en)
*
|
2004-06-10 |
2013-08-13 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
EP3067750B1
(en)
|
2004-06-10 |
2019-01-30 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
US8717533B2
(en)
*
|
2004-06-10 |
2014-05-06 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
US8373843B2
(en)
*
|
2004-06-10 |
2013-02-12 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
WO2005122221A1
(ja)
|
2004-06-10 |
2005-12-22 |
Nikon Corporation |
露光装置、露光方法及びデバイス製造方法
|
WO2006007167A2
(en)
*
|
2004-06-17 |
2006-01-19 |
Nikon Corporation |
Magnetic levitation lithography apparatus and method
|
JP4711437B2
(ja)
*
|
2004-06-23 |
2011-06-29 |
株式会社ニコン |
投影光学系、露光装置および露光方法
|
WO2006001282A1
(ja)
*
|
2004-06-25 |
2006-01-05 |
Nikon Corporation |
位置決め装置、位置決め方法、露光装置、露光方法、及びデバイスの製造方法
|
US7463330B2
(en)
|
2004-07-07 |
2008-12-09 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
DE602005016429D1
(de)
|
2004-07-12 |
2009-10-15 |
Nippon Kogaku Kk |
Hren
|
WO2006006730A1
(ja)
*
|
2004-07-15 |
2006-01-19 |
Nikon Corporation |
平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法
|
WO2006009169A1
(ja)
*
|
2004-07-21 |
2006-01-26 |
Nikon Corporation |
露光方法及びデバイス製造方法
|
WO2006009254A1
(ja)
*
|
2004-07-23 |
2006-01-26 |
Nikon Corporation |
支持装置、ステージ装置、露光装置、及びデバイスの製造方法
|
US7256871B2
(en)
*
|
2004-07-27 |
2007-08-14 |
Asml Netherlands B.V. |
Lithographic apparatus and method for calibrating the same
|
JP2006113533A
(ja)
|
2004-08-03 |
2006-04-27 |
Nikon Corp |
投影光学系、露光装置、および露光方法
|
EP3048485B1
(en)
|
2004-08-03 |
2017-09-27 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
TW200615716A
(en)
*
|
2004-08-05 |
2006-05-16 |
Nikon Corp |
Stage device and exposure device
|
EP1801853A4
(en)
|
2004-08-18 |
2008-06-04 |
Nikon Corp |
EXPOSURE DEVICE AND COMPONENT MANUFACTURING METHOD
|
US7701550B2
(en)
|
2004-08-19 |
2010-04-20 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
JP4780412B2
(ja)
*
|
2004-09-13 |
2011-09-28 |
株式会社ニコン |
投影光学系、投影光学系の製造方法、露光装置及び露光方法
|
US8675174B2
(en)
|
2004-09-17 |
2014-03-18 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
WO2006038563A1
(ja)
|
2004-10-01 |
2006-04-13 |
Nikon Corporation |
リニアモータ、ステージ装置、及び露光装置
|
US20090213357A1
(en)
*
|
2004-10-08 |
2009-08-27 |
Dai Arai |
Exposure apparatus and device manufacturing method
|
EP1806773A4
(en)
*
|
2004-10-13 |
2008-12-31 |
Nikon Corp |
EXPOSURE DEVICE, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
|
US7852456B2
(en)
*
|
2004-10-13 |
2010-12-14 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
EP3046135B1
(en)
*
|
2004-10-15 |
2017-09-20 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
CN100582509C
(zh)
*
|
2004-10-18 |
2010-01-20 |
株式会社尼康 |
轴承装置、载台装置及曝光装置
|
KR101285951B1
(ko)
|
2004-10-26 |
2013-07-12 |
가부시키가이샤 니콘 |
기판 처리 방법, 노광 장치 및 디바이스 제조 방법
|
TWI416265B
(zh)
*
|
2004-11-01 |
2013-11-21 |
尼康股份有限公司 |
A method of manufacturing an exposure apparatus and an element
|
US7749250B2
(en)
*
|
2006-02-03 |
2010-07-06 |
Biomet Sports Medicine, Llc |
Soft tissue repair assembly and associated method
|
KR101166008B1
(ko)
*
|
2004-11-19 |
2012-07-18 |
가부시키가이샤 니콘 |
메인터넌스 방법, 노광 방법, 노광 장치 및 디바이스 제조방법
|
JP2006156554A
(ja)
*
|
2004-11-26 |
2006-06-15 |
Canon Inc |
ステージ装置およびそれを用いた露光装置、デバイス製造方法
|
JP4905135B2
(ja)
|
2004-12-01 |
2012-03-28 |
株式会社ニコン |
ステージ装置及び露光装置
|
WO2006062065A1
(ja)
|
2004-12-06 |
2006-06-15 |
Nikon Corporation |
メンテナンス方法、メンテナンス機器、露光装置、及びデバイス製造方法
|
KR20070100865A
(ko)
*
|
2004-12-06 |
2007-10-12 |
가부시키가이샤 니콘 |
기판 처리 방법, 노광 방법, 노광 장치 및 디바이스 제조방법
|
US7397533B2
(en)
*
|
2004-12-07 |
2008-07-08 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
JP4752473B2
(ja)
|
2004-12-09 |
2011-08-17 |
株式会社ニコン |
露光装置、露光方法及びデバイス製造方法
|
KR101585310B1
(ko)
|
2004-12-15 |
2016-01-14 |
가부시키가이샤 니콘 |
기판 유지 장치, 노광 장치 및 디바이스 제조방법
|
US7394080B2
(en)
*
|
2004-12-23 |
2008-07-01 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Mask superposition for multiple exposures
|
TWI423301B
(zh)
*
|
2005-01-21 |
2014-01-11 |
尼康股份有限公司 |
照明光學裝置、曝光裝置、曝光方法以及元件製造方法
|
KR20160135859A
(ko)
*
|
2005-01-31 |
2016-11-28 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
US8692973B2
(en)
*
|
2005-01-31 |
2014-04-08 |
Nikon Corporation |
Exposure apparatus and method for producing device
|
CN100361112C
(zh)
*
|
2005-02-05 |
2008-01-09 |
上海微电子装备有限公司 |
步进扫描投影光刻机同步总线控制方法
|
US20070258068A1
(en)
*
|
2005-02-17 |
2007-11-08 |
Hiroto Horikawa |
Exposure Apparatus, Exposure Method, and Device Fabricating Method
|
TWI424260B
(zh)
|
2005-03-18 |
2014-01-21 |
尼康股份有限公司 |
A board member, a substrate holding device, an exposure apparatus and an exposure method, and a device manufacturing method
|
EP1879217A4
(en)
*
|
2005-03-18 |
2010-06-09 |
Nikon Corp |
EXPOSURE METHOD, EXPOSURE APPARATUS, DEVICE MANUFACTURING METHOD, AND EXPOSURE APPARATUS EVALUATION METHOD
|
JP4605219B2
(ja)
*
|
2005-03-30 |
2011-01-05 |
株式会社ニコン |
露光条件の決定方法、露光方法及び露光装置、並びにデバイス製造方法
|
WO2006106833A1
(ja)
*
|
2005-03-30 |
2006-10-12 |
Nikon Corporation |
露光装置及び露光方法、並びにデバイス製造方法
|
US20070132976A1
(en)
*
|
2005-03-31 |
2007-06-14 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
TW200644079A
(en)
*
|
2005-03-31 |
2006-12-16 |
Nikon Corp |
Exposure apparatus, exposure method, and device production method
|
JP4888388B2
(ja)
*
|
2005-03-31 |
2012-02-29 |
株式会社ニコン |
露光方法、露光装置、及びデバイス製造方法
|
USRE43576E1
(en)
|
2005-04-08 |
2012-08-14 |
Asml Netherlands B.V. |
Dual stage lithographic apparatus and device manufacturing method
|
US7161659B2
(en)
*
|
2005-04-08 |
2007-01-09 |
Asml Netherlands B.V. |
Dual stage lithographic apparatus and device manufacturing method
|
US7515281B2
(en)
*
|
2005-04-08 |
2009-04-07 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
WO2006112436A1
(ja)
|
2005-04-18 |
2006-10-26 |
Nikon Corporation |
露光装置及び露光方法、並びにデバイス製造方法
|
JP5125505B2
(ja)
|
2005-04-25 |
2013-01-23 |
株式会社ニコン |
露光方法及び露光装置、並びにデバイス製造方法
|
CN100555568C
(zh)
|
2005-04-28 |
2009-10-28 |
株式会社尼康 |
曝光方法及曝光装置、以及元件制造方法
|
WO2006118189A1
(ja)
*
|
2005-04-28 |
2006-11-09 |
Nikon Corporation |
露光方法及び露光装置、並びにデバイス製造方法
|
JP5449672B2
(ja)
|
2005-05-12 |
2014-03-19 |
株式会社ニコン |
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|
KR20080007383A
(ko)
*
|
2005-05-24 |
2008-01-18 |
가부시키가이샤 니콘 |
노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
|
JP4410216B2
(ja)
*
|
2005-05-24 |
2010-02-03 |
エーエスエムエル ネザーランズ ビー.ブイ. |
2ステージ・リソグラフィ装置及びデバイス製造方法
|
US7512452B2
(en)
*
|
2005-06-13 |
2009-03-31 |
Mauro George E |
Positioning system for eliminating lost motion effect
|
WO2006137410A1
(ja)
|
2005-06-21 |
2006-12-28 |
Nikon Corporation |
露光装置及び露光方法、メンテナンス方法、並びにデバイス製造方法
|
US20070085989A1
(en)
*
|
2005-06-21 |
2007-04-19 |
Nikon Corporation |
Exposure apparatus and exposure method, maintenance method, and device manufacturing method
|
US7924416B2
(en)
*
|
2005-06-22 |
2011-04-12 |
Nikon Corporation |
Measurement apparatus, exposure apparatus, and device manufacturing method
|
US20090033896A1
(en)
*
|
2005-06-28 |
2009-02-05 |
Hiroyuki Nagasaka |
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|
US8693006B2
(en)
*
|
2005-06-28 |
2014-04-08 |
Nikon Corporation |
Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method
|
KR20080015778A
(ko)
*
|
2005-06-29 |
2008-02-20 |
가부시키가이샤 니콘 |
노광 장치, 기판 처리 방법, 및 디바이스 제조 방법
|
EP1901338A4
(en)
*
|
2005-06-30 |
2011-06-29 |
Nikon Corp |
EXPOSURE APPARATUS AND METHOD, METHOD OF SERVICING THE EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
|
CN103728848B
(zh)
*
|
2005-07-08 |
2017-06-30 |
株式会社尼康 |
位置检测装置、曝光装置及曝光方法
|
KR20080031376A
(ko)
|
2005-07-11 |
2008-04-08 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
KR100919173B1
(ko)
*
|
2005-07-26 |
2009-09-28 |
후지쯔 마이크로일렉트로닉스 가부시키가이샤 |
위치 맞춤 방법
|
JP5309565B2
(ja)
*
|
2005-08-05 |
2013-10-09 |
株式会社ニコン |
ステージ装置、露光装置、方法、露光方法、及びデバイス製造方法
|
KR101449055B1
(ko)
|
2005-08-23 |
2014-10-08 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법, 및 디바이스 제조 방법
|
TWI450044B
(zh)
|
2005-08-31 |
2014-08-21 |
尼康股份有限公司 |
An optical element, an exposure apparatus using the same, an exposure method, and a manufacturing method of the micro-element
|
US8111374B2
(en)
*
|
2005-09-09 |
2012-02-07 |
Nikon Corporation |
Analysis method, exposure method, and device manufacturing method
|
WO2007029829A1
(ja)
*
|
2005-09-09 |
2007-03-15 |
Nikon Corporation |
露光装置及び露光方法、並びにデバイス製造方法
|
US20070070323A1
(en)
*
|
2005-09-21 |
2007-03-29 |
Nikon Corporation |
Exposure apparatus, exposure method, and device fabricating method
|
JPWO2007034838A1
(ja)
|
2005-09-21 |
2009-03-26 |
株式会社ニコン |
露光装置及び露光方法、並びにデバイス製造方法
|
US7948675B2
(en)
*
|
2005-10-11 |
2011-05-24 |
Nikon Corporation |
Surface-corrected multilayer-film mirrors with protected reflective surfaces, exposure systems comprising same, and associated methods
|
US20070095739A1
(en)
*
|
2005-10-24 |
2007-05-03 |
Nikon Corporation |
Utility transfer apparatus, stage apparatus, exposure apparatus, and device manufacturing method
|
US8681314B2
(en)
*
|
2005-10-24 |
2014-03-25 |
Nikon Corporation |
Stage device and coordinate correction method for the same, exposure apparatus, and device manufacturing method
|
US20070127135A1
(en)
*
|
2005-11-01 |
2007-06-07 |
Nikon Corporation |
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|
JPWO2007052659A1
(ja)
|
2005-11-01 |
2009-04-30 |
株式会社ニコン |
露光装置、露光方法、及びデバイス製造方法
|
US20070127002A1
(en)
*
|
2005-11-09 |
2007-06-07 |
Nikon Corporation |
Exposure apparatus and method, and device manufacturing method
|
WO2007055237A1
(ja)
*
|
2005-11-09 |
2007-05-18 |
Nikon Corporation |
露光装置及び露光方法、並びにデバイス製造方法
|
WO2007055199A1
(ja)
|
2005-11-09 |
2007-05-18 |
Nikon Corporation |
露光装置及び方法、並びにデバイス製造方法
|
KR20080068013A
(ko)
*
|
2005-11-14 |
2008-07-22 |
가부시키가이샤 니콘 |
액체 회수 부재, 노광 장치, 노광 방법, 및 디바이스 제조방법
|
JPWO2007058188A1
(ja)
*
|
2005-11-15 |
2009-04-30 |
株式会社ニコン |
露光装置及び露光方法、並びにデバイス製造方法
|
TW200721260A
(en)
|
2005-11-16 |
2007-06-01 |
Nikon Corp |
Substrate processing method, photomask manufacturing method, photomask and device manufacturing method
|
US7803516B2
(en)
*
|
2005-11-21 |
2010-09-28 |
Nikon Corporation |
Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
|
JP2007165869A
(ja)
|
2005-11-21 |
2007-06-28 |
Nikon Corp |
露光方法及びそれを用いたデバイス製造方法、露光装置、並びに基板処理方法及び装置
|
KR20080071555A
(ko)
|
2005-12-06 |
2008-08-04 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법, 투영 광학계 및 디바이스 제조방법
|
KR100768849B1
(ko)
*
|
2005-12-06 |
2007-10-22 |
엘지전자 주식회사 |
계통 연계형 연료전지 시스템의 전원공급장치 및 방법
|
US7782442B2
(en)
*
|
2005-12-06 |
2010-08-24 |
Nikon Corporation |
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|
JP5194799B2
(ja)
*
|
2005-12-06 |
2013-05-08 |
株式会社ニコン |
露光方法、露光装置、及びデバイス製造方法
|
EP2768016B1
(en)
*
|
2005-12-08 |
2017-10-25 |
Nikon Corporation |
Exposure apparatus and method
|
US8411271B2
(en)
*
|
2005-12-28 |
2013-04-02 |
Nikon Corporation |
Pattern forming method, pattern forming apparatus, and device manufacturing method
|
JP5182557B2
(ja)
|
2005-12-28 |
2013-04-17 |
株式会社ニコン |
パターン形成方法及びパターン形成装置、並びにデバイス製造方法
|
US7932994B2
(en)
|
2005-12-28 |
2011-04-26 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
US8953148B2
(en)
*
|
2005-12-28 |
2015-02-10 |
Nikon Corporation |
Exposure apparatus and making method thereof
|
KR101296546B1
(ko)
*
|
2005-12-28 |
2013-08-13 |
가부시키가이샤 니콘 |
패턴 형성 방법 및 패턴 형성 장치, 노광 방법 및 노광장치, 그리고 디바이스 제조 방법
|
US7839485B2
(en)
|
2006-01-19 |
2010-11-23 |
Nikon Corporation |
Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
|
KR100741110B1
(ko)
*
|
2006-02-15 |
2007-07-19 |
삼성에스디아이 주식회사 |
광 파이버 및 플라즈마 디스플레이 패널의 전극 형성 방법
|
JPWO2007094470A1
(ja)
|
2006-02-16 |
2009-07-09 |
株式会社ニコン |
露光装置、露光方法及びデバイス製造方法
|
WO2007094407A1
(ja)
|
2006-02-16 |
2007-08-23 |
Nikon Corporation |
露光装置、露光方法及びデバイス製造方法
|
EP1986224A4
(en)
|
2006-02-16 |
2012-01-25 |
Nikon Corp |
EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
|
EP1986223A4
(en)
*
|
2006-02-16 |
2010-08-25 |
Nikon Corp |
EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
|
US8134681B2
(en)
*
|
2006-02-17 |
2012-03-13 |
Nikon Corporation |
Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
|
EP2003680B1
(en)
|
2006-02-21 |
2013-05-29 |
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|
KR101356270B1
(ko)
|
2006-02-21 |
2014-01-28 |
가부시키가이샤 니콘 |
패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법
|
CN102866591B
(zh)
|
2006-02-21 |
2015-08-19 |
株式会社尼康 |
曝光装置及方法、以及元件制造方法
|
JPWO2007100081A1
(ja)
|
2006-03-03 |
2009-07-23 |
株式会社ニコン |
露光方法及び装置、並びにデバイス製造方法
|
WO2007100087A1
(ja)
*
|
2006-03-03 |
2007-09-07 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
JP5077770B2
(ja)
|
2006-03-07 |
2012-11-21 |
株式会社ニコン |
デバイス製造方法、デバイス製造システム及び測定検査装置
|
EP1995768A4
(en)
*
|
2006-03-13 |
2013-02-06 |
Nikon Corp |
EXPOSURE DEVICE, MAINTENANCE METHOD, EXPOSURE METHOD AND DEVICE MANUFACTURING METHOD
|
US20070242254A1
(en)
*
|
2006-03-17 |
2007-10-18 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
US8982322B2
(en)
*
|
2006-03-17 |
2015-03-17 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
WO2007109682A2
(en)
*
|
2006-03-20 |
2007-09-27 |
Duetto Integrated Systems, Inc. |
Improved system and method for manufacturing laminated circuit boards
|
CN100590173C
(zh)
*
|
2006-03-24 |
2010-02-17 |
北京有色金属研究总院 |
一种荧光粉及其制造方法和所制成的电光源
|
WO2007113933A1
(ja)
*
|
2006-04-05 |
2007-10-11 |
Sharp Kabushiki Kaisha |
露光方法および露光装置
|
TW200746259A
(en)
|
2006-04-27 |
2007-12-16 |
Nikon Corp |
Measuring and/or inspecting method, measuring and/or inspecting apparatus, exposure method, device manufacturing method, and device manufacturing apparatus
|
DE102006021797A1
(de)
|
2006-05-09 |
2007-11-15 |
Carl Zeiss Smt Ag |
Optische Abbildungseinrichtung mit thermischer Dämpfung
|
US7483120B2
(en)
*
|
2006-05-09 |
2009-01-27 |
Asml Netherlands B.V. |
Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
|
US20070267995A1
(en)
*
|
2006-05-18 |
2007-11-22 |
Nikon Corporation |
Six Degree-of-Freedom Stage Apparatus
|
US20080024749A1
(en)
*
|
2006-05-18 |
2008-01-31 |
Nikon Corporation |
Low mass six degree of freedom stage for lithography tools
|
US7728462B2
(en)
*
|
2006-05-18 |
2010-06-01 |
Nikon Corporation |
Monolithic stage devices providing motion in six degrees of freedom
|
CN102298274A
(zh)
*
|
2006-05-18 |
2011-12-28 |
株式会社尼康 |
曝光方法及装置、维护方法、以及组件制造方法
|
CN101385125B
(zh)
|
2006-05-22 |
2011-04-13 |
株式会社尼康 |
曝光方法及装置、维修方法、以及组件制造方法
|
SG172613A1
(en)
*
|
2006-05-23 |
2011-07-28 |
Nikon Corp |
Maintenance method, exposure method and apparatus, and device manufacturing method
|
WO2007139017A1
(ja)
*
|
2006-05-29 |
2007-12-06 |
Nikon Corporation |
液体回収部材、基板保持部材、露光装置、及びデバイス製造方法
|
KR20090023545A
(ko)
|
2006-05-31 |
2009-03-05 |
가부시키가이샤 니콘 |
노광 장치 및 노광 방법
|
US7795601B2
(en)
|
2006-06-01 |
2010-09-14 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method and apparatus to improve lithography throughput
|
KR20090026116A
(ko)
|
2006-06-09 |
2009-03-11 |
가부시키가이샤 니콘 |
패턴 형성 방법 및 패턴 형성 장치, 노광 방법 및 노광 장치 및 디바이스 제조 방법
|
JPWO2007142351A1
(ja)
|
2006-06-09 |
2009-10-29 |
株式会社ニコン |
移動体装置、露光装置及び露光方法、並びにデバイス製造方法
|
WO2008001871A1
(fr)
|
2006-06-30 |
2008-01-03 |
Nikon Corporation |
Procédé de maintenance, procédé d'exposition et procédé de fabrication d'appareil et de dispositif
|
US20080073563A1
(en)
|
2006-07-01 |
2008-03-27 |
Nikon Corporation |
Exposure apparatus that includes a phase change circulation system for movers
|
JP2008021748A
(ja)
*
|
2006-07-11 |
2008-01-31 |
Canon Inc |
露光装置
|
JP5339056B2
(ja)
*
|
2006-07-14 |
2013-11-13 |
株式会社ニコン |
露光装置及びデバイス製造方法
|
DE102006034906A1
(de)
|
2006-07-28 |
2008-01-31 |
Carl Zeiss Microimaging Gmbh |
Laser-Scanning-Mikroskop und Verfahren zu seinem Betrieb
|
KR101523388B1
(ko)
*
|
2006-08-30 |
2015-05-27 |
가부시키가이샤 니콘 |
노광 장치, 디바이스 제조 방법, 클리닝 방법 및 클리닝용 부재
|
KR101529845B1
(ko)
*
|
2006-08-31 |
2015-06-17 |
가부시키가이샤 니콘 |
이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
|
TWI655517B
(zh)
|
2006-08-31 |
2019-04-01 |
日商尼康股份有限公司 |
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|
KR101565277B1
(ko)
*
|
2006-08-31 |
2015-11-02 |
가부시키가이샤 니콘 |
이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
|
TWI574304B
(zh)
|
2006-09-01 |
2017-03-11 |
尼康股份有限公司 |
Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, component manufacturing method, and correcting method
|
KR101604564B1
(ko)
|
2006-09-01 |
2016-03-17 |
가부시키가이샤 니콘 |
이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
|
KR101419195B1
(ko)
|
2006-09-08 |
2014-07-15 |
가부시키가이샤 니콘 |
마스크, 노광 장치 및 디바이스 제조 방법
|
WO2008029884A1
(fr)
*
|
2006-09-08 |
2008-03-13 |
Nikon Corporation |
Dispositif et procédé de nettoyage, et procédé de fabrication du dispositif
|
US7872730B2
(en)
*
|
2006-09-15 |
2011-01-18 |
Nikon Corporation |
Immersion exposure apparatus and immersion exposure method, and device manufacturing method
|
WO2008044612A1
(en)
|
2006-09-29 |
2008-04-17 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
JP4999415B2
(ja)
*
|
2006-09-29 |
2012-08-15 |
東京エレクトロン株式会社 |
基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
|
JP5105197B2
(ja)
*
|
2006-09-29 |
2012-12-19 |
株式会社ニコン |
移動体システム、露光装置及び露光方法、並びにデバイス製造方法
|
US20080100909A1
(en)
*
|
2006-10-30 |
2008-05-01 |
Nikon Corporation |
Optical element, liquid immersion exposure apparatus, liquid immersion exposure method, and method for producing microdevice
|
WO2008053918A1
(fr)
*
|
2006-10-31 |
2008-05-08 |
Nikon Corporation |
Appareil de maintien de liquide, procédé de maintien de liquide, appareil d'exposition, procédé d'exposition et procédé de fabrication du dispositif
|
JP5151989B2
(ja)
*
|
2006-11-09 |
2013-02-27 |
株式会社ニコン |
保持装置、位置検出装置及び露光装置、並びにデバイス製造方法
|
US20080156356A1
(en)
|
2006-12-05 |
2008-07-03 |
Nikon Corporation |
Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
|
US20080212047A1
(en)
*
|
2006-12-28 |
2008-09-04 |
Nikon Corporation |
Exposure apparatus, exposing method, and device fabricating method
|
US8004651B2
(en)
*
|
2007-01-23 |
2011-08-23 |
Nikon Corporation |
Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
|
WO2008090975A1
(ja)
*
|
2007-01-26 |
2008-07-31 |
Nikon Corporation |
支持構造体及び露光装置
|
US9529275B2
(en)
*
|
2007-02-21 |
2016-12-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Lithography scanner throughput
|
US20080204687A1
(en)
*
|
2007-02-23 |
2008-08-28 |
Nikon Corporation |
Exposing method, exposure apparatus, device fabricating method, and substrate for immersion exposure
|
TWI454839B
(zh)
*
|
2007-03-01 |
2014-10-01 |
尼康股份有限公司 |
A film frame apparatus, a mask, an exposure method, and an exposure apparatus, and a method of manufacturing the element
|
US20080225261A1
(en)
*
|
2007-03-13 |
2008-09-18 |
Noriyuki Hirayanagi |
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|
US8237911B2
(en)
|
2007-03-15 |
2012-08-07 |
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Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
|
US20080225248A1
(en)
*
|
2007-03-15 |
2008-09-18 |
Nikon Corporation |
Apparatus, systems and methods for removing liquid from workpiece during workpiece processing
|
US7830046B2
(en)
*
|
2007-03-16 |
2010-11-09 |
Nikon Corporation |
Damper for a stage assembly
|
US8497980B2
(en)
*
|
2007-03-19 |
2013-07-30 |
Nikon Corporation |
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|
US8134685B2
(en)
|
2007-03-23 |
2012-03-13 |
Nikon Corporation |
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|
US20080246941A1
(en)
*
|
2007-04-06 |
2008-10-09 |
Katsura Otaki |
Wavefront aberration measuring device, projection exposure apparatus, method for manufacturing projection optical system, and method for manufacturing device
|
US8194322B2
(en)
*
|
2007-04-23 |
2012-06-05 |
Nikon Corporation |
Multilayer-film reflective mirror, exposure apparatus, device manufacturing method, and manufacturing method of multilayer-film reflective mirror
|
US20080266651A1
(en)
*
|
2007-04-24 |
2008-10-30 |
Katsuhiko Murakami |
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|
TW201107639A
(en)
*
|
2007-04-27 |
2011-03-01 |
Edwards Japan Ltd |
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|
CN101086627B
(zh)
*
|
2007-04-29 |
2010-10-06 |
上海微电子装备有限公司 |
凸点光刻机的曝光方法
|
US7623941B2
(en)
*
|
2007-05-09 |
2009-11-24 |
Great Computer Corporation |
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|
US8300207B2
(en)
|
2007-05-17 |
2012-10-30 |
Nikon Corporation |
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|
US20080285004A1
(en)
*
|
2007-05-18 |
2008-11-20 |
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|
US20090122282A1
(en)
*
|
2007-05-21 |
2009-05-14 |
Nikon Corporation |
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|
WO2008146819A1
(ja)
*
|
2007-05-28 |
2008-12-04 |
Nikon Corporation |
露光装置、デバイス製造方法、洗浄装置、及びクリーニング方法並びに露光方法
|
US8164736B2
(en)
*
|
2007-05-29 |
2012-04-24 |
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|
US8098362B2
(en)
*
|
2007-05-30 |
2012-01-17 |
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|
WO2008149853A1
(ja)
*
|
2007-06-04 |
2008-12-11 |
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|
JP4968335B2
(ja)
*
|
2007-06-11 |
2012-07-04 |
株式会社ニコン |
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|
JP2009021555A
(ja)
*
|
2007-06-12 |
2009-01-29 |
Canon Inc |
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|
KR100865554B1
(ko)
*
|
2007-06-27 |
2008-10-29 |
주식회사 하이닉스반도체 |
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|
JP5006122B2
(ja)
|
2007-06-29 |
2012-08-22 |
株式会社Sokudo |
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|
US8264669B2
(en)
*
|
2007-07-24 |
2012-09-11 |
Nikon Corporation |
Movable body drive method, pattern formation method, exposure method, and device manufacturing method for maintaining position coordinate before and after switching encoder head
|
US8194232B2
(en)
*
|
2007-07-24 |
2012-06-05 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
|
TWI534408B
(zh)
|
2007-07-24 |
2016-05-21 |
尼康股份有限公司 |
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|
US8547527B2
(en)
*
|
2007-07-24 |
2013-10-01 |
Nikon Corporation |
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|
US9025126B2
(en)
*
|
2007-07-31 |
2015-05-05 |
Nikon Corporation |
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|
US8023106B2
(en)
*
|
2007-08-24 |
2011-09-20 |
Nikon Corporation |
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|
US8237919B2
(en)
*
|
2007-08-24 |
2012-08-07 |
Nikon Corporation |
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|
US20090051895A1
(en)
*
|
2007-08-24 |
2009-02-26 |
Nikon Corporation |
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|
US8218129B2
(en)
*
|
2007-08-24 |
2012-07-10 |
Nikon Corporation |
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|
US8867022B2
(en)
*
|
2007-08-24 |
2014-10-21 |
Nikon Corporation |
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|
US9304412B2
(en)
*
|
2007-08-24 |
2016-04-05 |
Nikon Corporation |
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|
WO2009028494A1
(ja)
|
2007-08-28 |
2009-03-05 |
Nikon Corporation |
位置検出装置、位置検出方法、露光装置、およびデバイス製造方法
|
JPWO2009031654A1
(ja)
*
|
2007-09-07 |
2010-12-16 |
国立大学法人横浜国立大学 |
駆動制御方法、駆動制御装置、ステージ制御方法、ステージ制御装置、露光方法、露光装置及び計測装置
|
TW200912560A
(en)
*
|
2007-09-07 |
2009-03-16 |
Nikon Corp |
Suspending apparatus and exposure apparatus
|
US8451427B2
(en)
|
2007-09-14 |
2013-05-28 |
Nikon Corporation |
Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
|
US8421994B2
(en)
*
|
2007-09-27 |
2013-04-16 |
Nikon Corporation |
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|
TW200916696A
(en)
*
|
2007-10-11 |
2009-04-16 |
Hannspree Inc |
Flat-panel display with illumination function
|
JP5267029B2
(ja)
|
2007-10-12 |
2013-08-21 |
株式会社ニコン |
照明光学装置、露光装置及びデバイスの製造方法
|
KR101562073B1
(ko)
|
2007-10-16 |
2015-10-21 |
가부시키가이샤 니콘 |
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|
SG10201602750RA
(en)
|
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2016-05-30 |
Nikon Corp |
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|
JP2009099873A
(ja)
*
|
2007-10-18 |
2009-05-07 |
Canon Inc |
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|
US8379187B2
(en)
|
2007-10-24 |
2013-02-19 |
Nikon Corporation |
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|
US20090201484A1
(en)
*
|
2007-10-29 |
2009-08-13 |
Nikon Corporation |
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|
US9116346B2
(en)
|
2007-11-06 |
2015-08-25 |
Nikon Corporation |
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|
US9013681B2
(en)
*
|
2007-11-06 |
2015-04-21 |
Nikon Corporation |
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|
US9256140B2
(en)
*
|
2007-11-07 |
2016-02-09 |
Nikon Corporation |
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|
US8665455B2
(en)
*
|
2007-11-08 |
2014-03-04 |
Nikon Corporation |
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|
US8422015B2
(en)
|
2007-11-09 |
2013-04-16 |
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|
KR100922004B1
(ko)
*
|
2007-11-23 |
2009-10-14 |
세메스 주식회사 |
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|
JP5160204B2
(ja)
*
|
2007-11-30 |
2013-03-13 |
株式会社Sokudo |
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|
JP5128918B2
(ja)
|
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2013-01-23 |
株式会社Sokudo |
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|
US20090147228A1
(en)
*
|
2007-12-11 |
2009-06-11 |
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|
JP5403263B2
(ja)
*
|
2007-12-11 |
2014-01-29 |
株式会社ニコン |
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|
US8711327B2
(en)
*
|
2007-12-14 |
2014-04-29 |
Nikon Corporation |
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|
KR20100102580A
(ko)
*
|
2007-12-17 |
2010-09-24 |
가부시키가이샤 니콘 |
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|
US8964166B2
(en)
*
|
2007-12-17 |
2015-02-24 |
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|
US20090153824A1
(en)
*
|
2007-12-17 |
2009-06-18 |
Kla-Tencor Corporation |
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|
US20090174873A1
(en)
*
|
2007-12-17 |
2009-07-09 |
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|
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(ko)
|
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2014-12-30 |
가부시키가이샤 니콘 |
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|
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(ja)
|
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2012-08-15 |
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|
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(ja)
|
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2013-04-10 |
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|
US8451425B2
(en)
*
|
2007-12-28 |
2013-05-28 |
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|
US8269945B2
(en)
|
2007-12-28 |
2012-09-18 |
Nikon Corporation |
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|
WO2009088003A1
(ja)
*
|
2008-01-10 |
2009-07-16 |
Nikon Corporation |
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|
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(ja)
|
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2013-12-18 |
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|
JP5344180B2
(ja)
*
|
2008-02-08 |
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株式会社ニコン |
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|
JP2009200122A
(ja)
*
|
2008-02-19 |
2009-09-03 |
Canon Inc |
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|
US20090218743A1
(en)
*
|
2008-02-29 |
2009-09-03 |
Nikon Corporation |
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|
US20100039628A1
(en)
*
|
2008-03-19 |
2010-02-18 |
Nikon Corporation |
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|
US8233139B2
(en)
*
|
2008-03-27 |
2012-07-31 |
Nikon Corporation |
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|
JPWO2009125867A1
(ja)
*
|
2008-04-11 |
2011-08-04 |
株式会社ニコン |
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|
US8654306B2
(en)
*
|
2008-04-14 |
2014-02-18 |
Nikon Corporation |
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|
JP5472101B2
(ja)
*
|
2008-04-30 |
2014-04-16 |
株式会社ニコン |
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|
US8228482B2
(en)
*
|
2008-05-13 |
2012-07-24 |
Nikon Corporation |
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|
US8786829B2
(en)
*
|
2008-05-13 |
2014-07-22 |
Nikon Corporation |
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|
US8817236B2
(en)
|
2008-05-13 |
2014-08-26 |
Nikon Corporation |
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|
JP5360057B2
(ja)
|
2008-05-28 |
2013-12-04 |
株式会社ニコン |
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|
EP2128703A1
(en)
|
2008-05-28 |
2009-12-02 |
ASML Netherlands BV |
Lithographic Apparatus and a Method of Operating the Apparatus
|
EP2131243B1
(en)
*
|
2008-06-02 |
2015-07-01 |
ASML Netherlands B.V. |
Lithographic apparatus and method for calibrating a stage position
|
JP2009302154A
(ja)
*
|
2008-06-10 |
2009-12-24 |
Canon Inc |
露光装置及びデバイス製造方法
|
TW201003053A
(en)
*
|
2008-07-10 |
2010-01-16 |
Nikon Corp |
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|
WO2010013331A1
(ja)
*
|
2008-07-30 |
2010-02-04 |
パイオニア株式会社 |
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|
TW201009895A
(en)
*
|
2008-08-11 |
2010-03-01 |
Nikon Corp |
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|
US20100053588A1
(en)
*
|
2008-08-29 |
2010-03-04 |
Nikon Corporation |
Substrate Stage movement patterns for high throughput While Imaging a Reticle to a pair of Imaging Locations
|
US8435723B2
(en)
*
|
2008-09-11 |
2013-05-07 |
Nikon Corporation |
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|
US8384875B2
(en)
*
|
2008-09-29 |
2013-02-26 |
Nikon Corporation |
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|
US20100302526A1
(en)
*
|
2008-11-13 |
2010-12-02 |
Nikon Corporation |
Drive control method for moving body, exposure method, robot control method, drive control apparatus, exposure apparatus and robot apparatus
|
US8773635B2
(en)
|
2008-12-19 |
2014-07-08 |
Nikon Corporation |
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|
US8902402B2
(en)
|
2008-12-19 |
2014-12-02 |
Nikon Corporation |
Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
|
US8760629B2
(en)
|
2008-12-19 |
2014-06-24 |
Nikon Corporation |
Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
|
US8599359B2
(en)
|
2008-12-19 |
2013-12-03 |
Nikon Corporation |
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|
US8896806B2
(en)
|
2008-12-29 |
2014-11-25 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
GB0900191D0
(en)
*
|
2009-01-07 |
2009-02-11 |
Ge Healthcare Uk Ltd |
Microscopy
|
US20100196832A1
(en)
*
|
2009-01-30 |
2010-08-05 |
Nikon Corporation |
Exposure apparatus, exposing method, liquid immersion member and device fabricating method
|
WO2010103822A1
(ja)
|
2009-03-10 |
2010-09-16 |
株式会社ニコン |
露光装置、露光方法、及びデバイス製造方法
|
US8143602B2
(en)
*
|
2009-03-25 |
2012-03-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
High-volume manufacturing massive e-beam maskless lithography system
|
US8953143B2
(en)
*
|
2009-04-24 |
2015-02-10 |
Nikon Corporation |
Liquid immersion member
|
US8202671B2
(en)
|
2009-04-28 |
2012-06-19 |
Nikon Corporation |
Protective apparatus, mask, mask forming apparatus, mask forming method, exposure apparatus, device fabricating method, and foreign matter detecting apparatus
|
WO2010125813A1
(ja)
*
|
2009-04-30 |
2010-11-04 |
株式会社ニコン |
露光方法及びデバイス製造方法、並びに重ね合わせ誤差計測方法
|
US20110085152A1
(en)
*
|
2009-05-07 |
2011-04-14 |
Hideaki Nishino |
Vibration control apparatus, vibration control method, exposure apparatus, and device manufacturing method
|
US8395758B2
(en)
*
|
2009-05-15 |
2013-03-12 |
Nikon Corporation |
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|
US20100323303A1
(en)
*
|
2009-05-15 |
2010-12-23 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, and device fabricating method
|
US8792084B2
(en)
|
2009-05-20 |
2014-07-29 |
Nikon Corporation |
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|
US8970820B2
(en)
|
2009-05-20 |
2015-03-03 |
Nikon Corporation |
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|
US8553204B2
(en)
|
2009-05-20 |
2013-10-08 |
Nikon Corporation |
Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
|
US9312159B2
(en)
*
|
2009-06-09 |
2016-04-12 |
Nikon Corporation |
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|
WO2011016255A1
(ja)
*
|
2009-08-07 |
2011-02-10 |
株式会社ニコン |
露光装置及び露光方法、並びにデバイス製造方法
|
KR101670640B1
(ko)
|
2009-08-07 |
2016-10-28 |
가부시키가이샤 니콘 |
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|
US20110037962A1
(en)
*
|
2009-08-17 |
2011-02-17 |
Nikon Corporation |
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|
US8488109B2
(en)
|
2009-08-25 |
2013-07-16 |
Nikon Corporation |
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|
US8493547B2
(en)
*
|
2009-08-25 |
2013-07-23 |
Nikon Corporation |
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|
US8514395B2
(en)
|
2009-08-25 |
2013-08-20 |
Nikon Corporation |
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|
US20110096306A1
(en)
|
2009-09-28 |
2011-04-28 |
Nikon Corporation |
Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
|
US20110199591A1
(en)
*
|
2009-10-14 |
2011-08-18 |
Nikon Corporation |
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|
WO2011052703A1
(en)
|
2009-10-30 |
2011-05-05 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
CN102597873B
(zh)
*
|
2009-11-05 |
2014-12-17 |
株式会社尼康 |
焦点测试光罩、焦点测量方法、曝光装置、及曝光方法
|
TWI603155B
(zh)
|
2009-11-09 |
2017-10-21 |
尼康股份有限公司 |
曝光裝置、曝光方法、曝光裝置之維修方法、曝光裝置之調整方法、以及元件製造方法
|
US20110134400A1
(en)
*
|
2009-12-04 |
2011-06-09 |
Nikon Corporation |
Exposure apparatus, liquid immersion member, and device manufacturing method
|
JP5282979B2
(ja)
*
|
2009-12-22 |
2013-09-04 |
株式会社ブイ・テクノロジー |
露光装置
|
CN103135365A
(zh)
|
2009-12-28 |
2013-06-05 |
株式会社尼康 |
液浸构件、液浸构件的制造方法、曝光装置、及元件制造方法
|
US8488106B2
(en)
*
|
2009-12-28 |
2013-07-16 |
Nikon Corporation |
Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
|
CN102714141B
(zh)
|
2010-01-08 |
2016-03-23 |
株式会社尼康 |
液浸构件、曝光装置、曝光方法及元件制造方法
|
US8841065B2
(en)
|
2010-02-12 |
2014-09-23 |
Nikon Corporation |
Manufacturing method of exposure apparatus and device manufacturing method
|
SG183108A1
(en)
|
2010-02-19 |
2012-09-27 |
Asml Netherlands Bv |
Lithographic apparatus and device manufacturing method
|
JP5842808B2
(ja)
|
2010-02-20 |
2016-01-13 |
株式会社ニコン |
瞳強度分布を調整する方法
|
US20110205519A1
(en)
*
|
2010-02-25 |
2011-08-25 |
Nikon Corporation |
Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
|
US20110222031A1
(en)
|
2010-03-12 |
2011-09-15 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
JP5583436B2
(ja)
*
|
2010-03-15 |
2014-09-03 |
住友重機械工業株式会社 |
ラインスキャニング装置
|
US20120013864A1
(en)
|
2010-07-14 |
2012-01-19 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US20120013863A1
(en)
|
2010-07-14 |
2012-01-19 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US8937703B2
(en)
|
2010-07-14 |
2015-01-20 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US20120012191A1
(en)
|
2010-07-16 |
2012-01-19 |
Nikon Corporation |
Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US20120019804A1
(en)
|
2010-07-23 |
2012-01-26 |
Nikon Corporation |
Cleaning method, cleaning apparatus, device fabricating method, program, and storage medium
|
US20120019802A1
(en)
|
2010-07-23 |
2012-01-26 |
Nikon Corporation |
Cleaning method, immersion exposure apparatus, device fabricating method, program, and storage medium
|
US20120019803A1
(en)
|
2010-07-23 |
2012-01-26 |
Nikon Corporation |
Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program, and storage medium
|
KR101674248B1
(ko)
*
|
2010-09-13 |
2016-11-08 |
가부시키가이샤 오크세이사쿠쇼 |
투영 노광 장치
|
CN102487030B
(zh)
*
|
2010-12-06 |
2013-12-18 |
上海微电子装备有限公司 |
双工件台夹持机构
|
US20120188521A1
(en)
|
2010-12-27 |
2012-07-26 |
Nikon Corporation |
Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium
|
US20120162619A1
(en)
|
2010-12-27 |
2012-06-28 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
|
JPWO2012115002A1
(ja)
|
2011-02-22 |
2014-07-07 |
株式会社ニコン |
保持装置、露光装置、及びデバイスの製造方法
|
CN102141739B
(zh)
*
|
2011-04-01 |
2013-01-16 |
清华大学 |
光刻机硅片台双台交换系统
|
US20130016329A1
(en)
|
2011-07-12 |
2013-01-17 |
Nikon Corporation |
Exposure apparatus, exposure method, measurement method, and device manufacturing method
|
US9329496B2
(en)
|
2011-07-21 |
2016-05-03 |
Nikon Corporation |
Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium
|
US9256137B2
(en)
|
2011-08-25 |
2016-02-09 |
Nikon Corporation |
Exposure apparatus, liquid holding method, and device manufacturing method
|
US8601407B2
(en)
|
2011-08-25 |
2013-12-03 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Geometric pattern data quality verification for maskless lithography
|
US20130050666A1
(en)
|
2011-08-26 |
2013-02-28 |
Nikon Corporation |
Exposure apparatus, liquid holding method, and device manufacturing method
|
US8473877B2
(en)
|
2011-09-06 |
2013-06-25 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Striping methodology for maskless lithography
|
NL2009345A
(en)
|
2011-09-28 |
2013-04-02 |
Asml Netherlands Bv |
Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods.
|
CN102378494B
(zh)
*
|
2011-10-31 |
2014-03-26 |
深南电路有限公司 |
一种电路板阻焊加工方法
|
JP6156147B2
(ja)
|
2011-11-17 |
2017-07-05 |
株式会社ニコン |
エンコーダ装置、光学装置、露光装置、及びデバイス製造方法
|
US20130135594A1
(en)
|
2011-11-25 |
2013-05-30 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, exposure method, device manufacturing method, program, and recording medium
|
US20130169944A1
(en)
|
2011-12-28 |
2013-07-04 |
Nikon Corporation |
Exposure apparatus, exposure method, device manufacturing method, program, and recording medium
|
US9207549B2
(en)
|
2011-12-29 |
2015-12-08 |
Nikon Corporation |
Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
|
US9360772B2
(en)
|
2011-12-29 |
2016-06-07 |
Nikon Corporation |
Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
|
US9543223B2
(en)
|
2013-01-25 |
2017-01-10 |
Qoniac Gmbh |
Method and apparatus for fabricating wafer by calculating process correction parameters
|
EP2620976B1
(en)
*
|
2012-01-25 |
2016-07-20 |
Qoniac GmbH |
Overlay model for aligning and exposing semiconductor wafers
|
CN103246170B
(zh)
*
|
2012-02-09 |
2015-07-08 |
中芯国际集成电路制造(上海)有限公司 |
曝光装置及曝光方法
|
TWI573174B
(zh)
|
2012-03-08 |
2017-03-01 |
瑪波微影Ip公司 |
處理諸如晶圓的靶材之微影系統和方法
|
US9323160B2
(en)
|
2012-04-10 |
2016-04-26 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
|
US9268231B2
(en)
|
2012-04-10 |
2016-02-23 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
|
US10679883B2
(en)
*
|
2012-04-19 |
2020-06-09 |
Intevac, Inc. |
Wafer plate and mask arrangement for substrate fabrication
|
WO2013175835A1
(ja)
|
2012-05-21 |
2013-11-28 |
株式会社ニコン |
反射鏡、投影光学系、露光装置、及びデバイス製造方法
|
RU2525152C2
(ru)
*
|
2012-06-25 |
2014-08-10 |
Общество с ограниченной ответственностью "ВЕСТТРЭЙД ЛТД" |
Способ формирования изображения микрообъекта (варианты) и устройство для его осуществления (варианты)
|
US9823580B2
(en)
|
2012-07-20 |
2017-11-21 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
|
CN103676494B
(zh)
*
|
2012-09-25 |
2015-11-18 |
上海微电子装备有限公司 |
用于扫描光刻机的逐场调焦调平方法
|
US9568828B2
(en)
|
2012-10-12 |
2017-02-14 |
Nikon Corporation |
Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
|
US9494870B2
(en)
|
2012-10-12 |
2016-11-15 |
Nikon Corporation |
Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
|
WO2014080957A1
(ja)
|
2012-11-20 |
2014-05-30 |
株式会社ニコン |
露光装置、移動体装置、及びデバイス製造方法
|
KR102169388B1
(ko)
|
2012-11-30 |
2020-10-23 |
가부시키가이샤 니콘 |
흡인 장치, 반입 방법, 반송 시스템 및 노광 장치, 그리고 디바이스 제조 방법
|
CN113035768A
(zh)
|
2012-11-30 |
2021-06-25 |
株式会社尼康 |
搬送系统
|
DE102012223128B4
(de)
*
|
2012-12-13 |
2022-09-01 |
Carl Zeiss Microscopy Gmbh |
Autofokusverfahren für Mikroskop und Mikroskop mit Autofokuseinrichtung
|
US9651873B2
(en)
|
2012-12-27 |
2017-05-16 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
|
JP6119242B2
(ja)
|
2012-12-27 |
2017-04-26 |
株式会社ニコン |
露光装置、露光方法、及びデバイス製造方法
|
US9720331B2
(en)
|
2012-12-27 |
2017-08-01 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
|
US9057955B2
(en)
|
2013-01-22 |
2015-06-16 |
Nikon Corporation |
Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
|
US9352073B2
(en)
|
2013-01-22 |
2016-05-31 |
Niko Corporation |
Functional film
|
WO2014132923A1
(ja)
|
2013-02-28 |
2014-09-04 |
株式会社ニコン |
摺動膜、摺動膜が形成された部材、及びその製造方法
|
JP5344105B1
(ja)
*
|
2013-03-08 |
2013-11-20 |
ウシオ電機株式会社 |
光配向用偏光光照射装置及び光配向用偏光光照射方法
|
JPWO2014181858A1
(ja)
|
2013-05-09 |
2017-02-23 |
株式会社ニコン |
光学素子、投影光学系、露光装置及びデバイス製造方法
|
JP6344387B2
(ja)
*
|
2013-06-14 |
2018-06-20 |
株式会社ニコン |
基板処理装置及びデバイス製造方法
|
JP6112201B2
(ja)
|
2013-07-05 |
2017-04-12 |
株式会社ニコン |
多層膜反射鏡、多層膜反射鏡の製造方法、投影光学系、露光装置、デバイスの製造方法
|
JP2015041094A
(ja)
*
|
2013-08-23 |
2015-03-02 |
株式会社東芝 |
露光装置、露光方法および露光プログラム
|
KR102230319B1
(ko)
|
2013-10-08 |
2021-03-19 |
가부시키가이샤 니콘 |
액침 부재, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
|
US9766559B2
(en)
*
|
2013-10-30 |
2017-09-19 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Edge-dominant alignment method in exposure scanner system
|
EP3065165B1
(en)
|
2013-10-30 |
2022-12-07 |
Nikon Corporation |
Substrate-holding apparatus and exposure apparatus
|
CN105917441A
(zh)
|
2014-01-16 |
2016-08-31 |
株式会社尼康 |
曝光装置及曝光方法、以及器件制造方法
|
EP3264030B1
(en)
|
2015-02-23 |
2020-07-22 |
Nikon Corporation |
Measurement device, lithography system and exposure device, and device manufacturing method
|
CN107278279B
(zh)
|
2015-02-23 |
2020-07-03 |
株式会社尼康 |
基板处理系统及基板处理方法、以及组件制造方法
|
EP4300194A3
(en)
|
2015-02-23 |
2024-04-10 |
Nikon Corporation |
Measurement device, lithography system and exposure apparatus, and control method, overlay measurement method and device manufacturing method
|
CN107430356B
(zh)
|
2015-03-25 |
2021-02-26 |
株式会社尼康 |
布局方法、标记检测方法、曝光方法、测量装置、曝光装置、以及组件制造方法
|
DE102015211941A1
(de)
*
|
2015-06-26 |
2016-12-29 |
Zf Friedrichshafen Ag |
Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
|
US10031427B2
(en)
*
|
2015-09-30 |
2018-07-24 |
Applied Materials, Inc. |
Methods and apparatus for vibration damping stage
|
JP6925783B2
(ja)
*
|
2016-05-26 |
2021-08-25 |
株式会社アドテックエンジニアリング |
パターン描画装置及びパターン描画方法
|
EP3506012A4
(en)
*
|
2016-08-24 |
2020-04-15 |
Nikon Corporation |
MEASURING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD
|
WO2018061811A1
(ja)
|
2016-09-27 |
2018-04-05 |
株式会社ニコン |
決定方法及び装置、プログラム、情報記録媒体、露光装置、レイアウト情報提供方法、レイアウト方法、マーク検出方法、露光方法、並びにデバイス製造方法
|
KR102239782B1
(ko)
|
2016-09-30 |
2021-04-13 |
가부시키가이샤 니콘 |
계측 시스템 및 기판 처리 시스템, 그리고 디바이스 제조 방법
|
EP3598236A4
(en)
|
2017-03-16 |
2021-01-20 |
Nikon Corporation |
CONTROL DEVICE AND CONTROL PROCESS, EXPOSURE DEVICE AND EXPOSURE PROCESS, DEVICE MANUFACTURING PROCESS, DATA PRODUCTION PROCESS AND PROGRAM
|
CN106842830B
(zh)
*
|
2017-04-19 |
2018-05-18 |
广东工业大学 |
一种焦点探测侧面式光刻焦面位置的检测装置及方法
|
JP6591482B2
(ja)
*
|
2017-05-22 |
2019-10-16 |
株式会社東海理化電機製作所 |
露光方法
|
US10585360B2
(en)
*
|
2017-08-25 |
2020-03-10 |
Applied Materials, Inc. |
Exposure system alignment and calibration method
|
KR102426485B1
(ko)
|
2017-09-29 |
2022-07-27 |
온투 이노베이션 아이엔씨. |
리소그래피 노광 공정의 최적화를 위한 시스템 및 방법
|
CN109671106B
(zh)
|
2017-10-13 |
2023-09-05 |
华为技术有限公司 |
一种图像处理方法、装置与设备
|
CN111123667B
(zh)
*
|
2018-10-31 |
2021-09-24 |
上海微电子装备(集团)股份有限公司 |
光刻装置、光刻装置的垂向控制方法及曝光方法
|
DE102018132001A1
(de)
|
2018-12-12 |
2020-06-18 |
Laser Imaging Systems Gmbh |
Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
|
CN112099315B
(zh)
*
|
2019-06-17 |
2021-10-22 |
上海微电子装备(集团)股份有限公司 |
一种光刻设备及其控制方法、装置和存储介质
|
CN112099317B
(zh)
*
|
2019-06-18 |
2022-03-11 |
上海微电子装备(集团)股份有限公司 |
一种光刻设备及其控制方法、装置和存储介质
|
WO2021047903A1
(en)
|
2019-09-09 |
2021-03-18 |
Asml Holding N.V. |
Invariable magnification multilevel optical device with telecentric converter
|
CN113125109B
(zh)
*
|
2019-12-30 |
2023-11-24 |
魔门塔(苏州)科技有限公司 |
一种图像曝光时间量测系统及标板设备
|
KR20220143743A
(ko)
|
2020-02-21 |
2022-10-25 |
온투 이노베이션 아이엔씨. |
리소그래피 공정에서 오버레이 오류를 보정하기 위한 시스템 및 방법
|
EP4166642A4
(en)
*
|
2020-06-10 |
2024-03-13 |
Bgi Shenzhen |
IMAGE COLLECTION DEVICE FOR BIOLOGICAL SAMPLES AND GENE SEQUENCER
|
DE102020124006B3
(de)
|
2020-09-15 |
2022-01-05 |
Laser Imaging Systems Gmbh |
Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
|
KR20230056049A
(ko)
*
|
2020-09-30 |
2023-04-26 |
주식회사 히타치하이테크 |
하전 입자 빔 장치
|
DE102020127981B3
(de)
|
2020-10-23 |
2021-12-16 |
Laser Imaging Systems Gmbh |
Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
|
EP4080265A1
(en)
*
|
2021-04-20 |
2022-10-26 |
Leica Instruments (Singapore) Pte Ltd |
Microscope system and corresponding control system, method and computer program
|