AU3271801A - Dual-stage lithography apparatus and method - Google Patents

Dual-stage lithography apparatus and method

Info

Publication number
AU3271801A
AU3271801A AU32718/01A AU3271801A AU3271801A AU 3271801 A AU3271801 A AU 3271801A AU 32718/01 A AU32718/01 A AU 32718/01A AU 3271801 A AU3271801 A AU 3271801A AU 3271801 A AU3271801 A AU 3271801A
Authority
AU
Australia
Prior art keywords
dual
method
lithography apparatus
stage lithography
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU32718/01A
Inventor
Todd Joseph Bednarek
Stephen Roux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML US Inc
Original Assignee
ASML US Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US44963099A priority Critical
Priority to US09449630 priority
Application filed by ASML US Inc filed Critical ASML US Inc
Priority to PCT/US2000/042336 priority patent/WO2001040875A1/en
Publication of AU3271801A publication Critical patent/AU3271801A/en
Application status is Abandoned legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
AU32718/01A 1999-11-30 2000-11-29 Dual-stage lithography apparatus and method Abandoned AU3271801A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US44963099A true 1999-11-30 1999-11-30
US09449630 1999-11-30
PCT/US2000/042336 WO2001040875A1 (en) 1999-11-30 2000-11-29 Dual-stage lithography apparatus and method

Publications (1)

Publication Number Publication Date
AU3271801A true AU3271801A (en) 2001-06-12

Family

ID=23784886

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32718/01A Abandoned AU3271801A (en) 1999-11-30 2000-11-29 Dual-stage lithography apparatus and method

Country Status (2)

Country Link
AU (1) AU3271801A (en)
WO (1) WO2001040875A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6778258B2 (en) 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
EP1353229A1 (en) * 2002-04-09 2003-10-15 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
EP1353233A3 (en) * 2002-04-09 2007-10-03 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6757110B2 (en) * 2002-05-29 2004-06-29 Asml Holding N.V. Catadioptric lithography system and method with reticle stage orthogonal to wafer stage
JP2004072076A (en) * 2002-06-10 2004-03-04 Nikon Corp Exposure device, stage unit and method for manufacturing device
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US7019819B2 (en) 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
EP1957249B1 (en) 2005-12-08 2014-11-12 Canon Nanotechnologies, Inc. Method and system for double-sided patterning of substrates
US7670530B2 (en) * 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
CN100504614C (en) * 2006-04-14 2009-06-24 上海微电子装备有限公司 Stepping scan photo-etching machine double-platform exchanging and positioning system
CN2938172Y (en) 2006-07-18 2007-08-22 上海微电子装备有限公司 Exposure precision positioning system of changed by two-device
US8711327B2 (en) 2007-12-14 2014-04-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP2010129927A (en) * 2008-11-28 2010-06-10 Renesas Electronics Corp Method of manufacturing semiconductor device and program
CN103268073A (en) * 2013-05-28 2013-08-28 哈尔滨工业大学 Double-workpiece-table semi-physical simulation system based on virtual reality technology

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203719B2 (en) * 1991-12-26 2001-08-27 株式会社ニコン Device manufactured by an exposure apparatus, the exposure apparatus, exposure method, and device manufacturing method using the exposure method
SG88823A1 (en) * 1996-11-28 2002-05-21 Nikon Corp Projection exposure apparatus

Also Published As

Publication number Publication date
WO2001040875A1 (en) 2001-06-07

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase