CN101447438B - 半导体器件的制造方法 - Google Patents
半导体器件的制造方法 Download PDFInfo
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- CN101447438B CN101447438B CN2008101863830A CN200810186383A CN101447438B CN 101447438 B CN101447438 B CN 101447438B CN 2008101863830 A CN2008101863830 A CN 2008101863830A CN 200810186383 A CN200810186383 A CN 200810186383A CN 101447438 B CN101447438 B CN 101447438B
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
Claims (10)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP381427/2001 | 2001-12-14 | ||
JP2001381427 | 2001-12-14 | ||
JP291975/2002 | 2002-10-04 | ||
JP2002291975A JP4173346B2 (ja) | 2001-12-14 | 2002-10-04 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN02151384A Division CN1424757A (zh) | 2001-12-14 | 2002-11-20 | 半导体器件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN101447438A CN101447438A (zh) | 2009-06-03 |
CN101447438B true CN101447438B (zh) | 2010-12-01 |
Family
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Family Applications (2)
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CN2008101863830A Expired - Fee Related CN101447438B (zh) | 2001-12-14 | 2002-11-20 | 半导体器件的制造方法 |
CNB2007101120301A Expired - Fee Related CN100536121C (zh) | 2001-12-14 | 2002-11-20 | 半导体器件及其制造方法 |
Family Applications After (1)
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CNB2007101120301A Expired - Fee Related CN100536121C (zh) | 2001-12-14 | 2002-11-20 | 半导体器件及其制造方法 |
Country Status (2)
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JP (2) | JP4747188B2 (zh) |
CN (2) | CN101447438B (zh) |
Families Citing this family (1)
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JP6121692B2 (ja) * | 2012-11-05 | 2017-04-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1242104A (zh) * | 1996-11-28 | 2000-01-19 | 株式会社尼康 | 曝光装置以及曝光方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3227792B2 (ja) * | 1992-05-18 | 2001-11-12 | ソニー株式会社 | 半導体装置の樹脂封止方法 |
US5637914A (en) * | 1994-05-16 | 1997-06-10 | Hitachi, Ltd. | Lead frame and semiconductor device encapsulated by resin |
JPH0878605A (ja) * | 1994-09-01 | 1996-03-22 | Hitachi Ltd | リードフレームおよびそれを用いた半導体集積回路装置 |
CN1143371C (zh) * | 1996-12-26 | 2004-03-24 | 株式会社日立制作所 | 模制塑料型半导体器件及其制造工艺 |
JP3493113B2 (ja) * | 1997-03-21 | 2004-02-03 | 株式会社ルネサステクノロジ | 半導体装置の製造方法およびリードフレーム |
JP2000091488A (ja) * | 1998-09-08 | 2000-03-31 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置とそれに用いられる回路部材 |
JP3455116B2 (ja) * | 1998-09-30 | 2003-10-14 | 株式会社三井ハイテック | 半導体装置の製造方法 |
JP3959898B2 (ja) * | 1999-09-01 | 2007-08-15 | 松下電器産業株式会社 | 樹脂封止型半導体装置の製造方法 |
JP2001077287A (ja) * | 1999-09-06 | 2001-03-23 | Mitsubishi Electric Corp | 半導体装置用リードフレーム |
JP3751496B2 (ja) * | 2000-03-02 | 2006-03-01 | 松下電器産業株式会社 | リードフレーム及びそれを用いた樹脂封止型半導体装置の製造方法 |
JP4173346B2 (ja) * | 2001-12-14 | 2008-10-29 | 株式会社ルネサステクノロジ | 半導体装置 |
-
2002
- 2002-11-20 CN CN2008101863830A patent/CN101447438B/zh not_active Expired - Fee Related
- 2002-11-20 CN CNB2007101120301A patent/CN100536121C/zh not_active Expired - Fee Related
-
2008
- 2008-06-16 JP JP2008156464A patent/JP4747188B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-04 JP JP2011082422A patent/JP2011155293A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1242104A (zh) * | 1996-11-28 | 2000-01-19 | 株式会社尼康 | 曝光装置以及曝光方法 |
Non-Patent Citations (1)
Title |
---|
JP平8-139259A 1996.05.31 |
Also Published As
Publication number | Publication date |
---|---|
JP4747188B2 (ja) | 2011-08-17 |
JP2011155293A (ja) | 2011-08-11 |
CN101447438A (zh) | 2009-06-03 |
CN101090102A (zh) | 2007-12-19 |
JP2008258652A (ja) | 2008-10-23 |
CN100536121C (zh) | 2009-09-02 |
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