JP5472101B2 - 露光装置及びデバイス製造方法 - Google Patents
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
- G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0277—Electrolithographic processes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
Claims (12)
- エネルギビームにより物体を露光し、前記物体上にパターンを形成する露光装置であって、
物体を保持して所定平面に沿って移動する移動体と;
前記エネルギビームを前記物体に投射する光学系と;
少なくとも前記光学系と前記物体との間の空間に液体を供給する液体供給装置と;
レーザ光を、計測光と参照光とに分離する分岐素子を含む光学ユニットを有し、前記液体中に設定された前記所定平面に平行な光路に沿って前記光学ユニットに所定距離隔てて配置された計測光反射面に垂直に前記計測光を照射するとともに、前記光学ユニットに設けられた参照光反射面に前記参照光を照射し、前記計測光の反射光と前記参照光の反射光との干渉に基づいて前記空間内に存在する前記液体の屈折率に関連する物理量の変化を、光学的に計測する干渉計と;を備え、
前記空間内に前記液体が存在する状態で、前記光学ユニットのうち前記計測光の射出部と、前記計測光反射面とが前記液体中に設けられる露光装置。 - 請求項1に記載の露光装置において、
前記干渉計は、前記エネルギビームの経路の少なくとも一部を挟む2点間で、前記液体の屈折率に関連する物理量の変化を計測する露光装置。 - 請求項2に記載の露光装置において、
前記物理量は、前記2点間の計測光の光路長である露光装置。 - 請求項2又は3に記載の露光装置において、
前記2点は、前記液体中の前記所定平面に略平行な計測光路上に位置する露光装置。 - 請求項4に記載の露光装置において、
前記移動体は、前記物体に対するパターンの形成のため、前記エネルギビームに対して前記所定平面内の走査方向に相対移動し、
前記計測光路は、前記所定平面に平行な面内で前記走査方向に直交する露光装置。 - 請求項5に記載の露光装置において、
前記干渉計は、前記走査方向に離れた複数の計測光路上の各2点間で、前記液体の屈折率に関連する物理量の変化を計測する露光装置。 - 請求項6に記載の露光装置において、
前記干渉計は、前記移動体の前記走査方向の移動に応じたタイミングで、前記複数の計測光路上の各2点間で、前記物理量の変化を計測する露光装置。 - 請求項1〜7のいずれか一項に記載の露光装置において、
前記干渉計の計測結果に基づいて、前記光学系と液体とを含む投影光学系の光学特性及び前記エネルギビームの波長の少なくとも一方を調整する調整装置を更に備える露光装置。 - 請求項1〜8のいずれか一項に記載の露光装置において、
前記干渉計の計測結果に基づいて、前記移動体の前記所定平面に直交する方向の位置及び前記所定平面に対する傾斜の少なくとも一方を制御する制御装置を更に備える露光装置。 - 請求項1〜9のいずれか一項に記載の露光装置において、
前記光学ユニットは、前記投影光学系の前記物体に対向する対向面の一端部近傍に設けられ、
前記計測光反射面は、前記投影光学系の前記対向面の他端部近傍に設けられる露光装置。 - 請求項1〜10のいずれか一項に記載の露光装置において、
前記干渉計は、前記レーザ光を、前記光学ユニットまで導く光ファイバを含む露光装置。 - 請求項1〜11のいずれか一項に記載の露光装置を用いて物体上にパターンを形成する工程と;
前記パターンが形成された物体を現像する工程と;を含むデバイス製造方法。
Priority Applications (1)
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JP2010510043A JP5472101B2 (ja) | 2008-04-30 | 2009-04-30 | 露光装置及びデバイス製造方法 |
Applications Claiming Priority (4)
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JP2008119238 | 2008-04-30 | ||
JP2008119238 | 2008-04-30 | ||
JP2010510043A JP5472101B2 (ja) | 2008-04-30 | 2009-04-30 | 露光装置及びデバイス製造方法 |
PCT/JP2009/001951 WO2009133704A1 (ja) | 2008-04-30 | 2009-04-30 | 露光装置及び露光方法、並びにデバイス製造方法 |
Publications (2)
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JPWO2009133704A1 JPWO2009133704A1 (ja) | 2011-08-25 |
JP5472101B2 true JP5472101B2 (ja) | 2014-04-16 |
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Country Status (5)
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US (1) | US20090280439A1 (ja) |
JP (1) | JP5472101B2 (ja) |
KR (1) | KR20100135215A (ja) |
TW (1) | TW200951640A (ja) |
WO (1) | WO2009133704A1 (ja) |
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EP1895570A4 (en) * | 2005-05-24 | 2011-03-09 | Nikon Corp | EXPOSURE METHOD AND APPARATUS, AND DEVICE MANUFACTURING METHOD |
CN101927403A (zh) * | 2010-08-02 | 2010-12-29 | 东阳市双燕设备有限公司 | 一种恒定式飞行光路激光切割机 |
TWI624733B (zh) * | 2011-03-30 | 2018-05-21 | 瑪波微影Ip公司 | 用於曝光工具的干涉儀模組的校準 |
WO2013070980A1 (en) * | 2011-11-09 | 2013-05-16 | Zygo Corporation | Fiber delivery for metrology systems used in lithography tools |
JP6674250B2 (ja) * | 2015-12-16 | 2020-04-01 | キヤノン株式会社 | 露光装置、露光方法、および物品の製造方法 |
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2009
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- 2009-04-30 TW TW098114313A patent/TW200951640A/zh unknown
- 2009-04-30 JP JP2010510043A patent/JP5472101B2/ja active Active
- 2009-04-30 KR KR1020107004946A patent/KR20100135215A/ko not_active Application Discontinuation
- 2009-04-30 US US12/432,998 patent/US20090280439A1/en not_active Abandoned
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JP2007242784A (ja) * | 2006-03-07 | 2007-09-20 | Nikon Corp | 照明装置及び露光装置、並びにデバイス製造方法 |
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WO2009133704A1 (ja) | 2009-11-05 |
TW200951640A (en) | 2009-12-16 |
KR20100135215A (ko) | 2010-12-24 |
US20090280439A1 (en) | 2009-11-12 |
JPWO2009133704A1 (ja) | 2011-08-25 |
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