JPS57183031A - Method for wafer exposure and device thereof - Google Patents

Method for wafer exposure and device thereof

Info

Publication number
JPS57183031A
JPS57183031A JP56067909A JP6790981A JPS57183031A JP S57183031 A JPS57183031 A JP S57183031A JP 56067909 A JP56067909 A JP 56067909A JP 6790981 A JP6790981 A JP 6790981A JP S57183031 A JPS57183031 A JP S57183031A
Authority
JP
Japan
Prior art keywords
wafer
chuck
exposure
positioning
repeat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56067909A
Other languages
Japanese (ja)
Inventor
Hiroshi Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56067909A priority Critical patent/JPS57183031A/en
Publication of JPS57183031A publication Critical patent/JPS57183031A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To contrive the improvement of through-put of the exposing operation for the subject wafer by a method wherein, when a step-and-repeat exposure is performed on the wafer, another wafer is operated simultaneously with the above wafer. CONSTITUTION:A mask 114 having a prescribed pattern is matched to a cylinder 104, a positioning is performed on a wafer chuck 1021, wherein a wafer 1161 that was positioned in advance by positioning structure 108 was assembled, and the mirror cylinder 104 are positioned, and the wafer 1161 is matched to the mask 114. Then, a step-and-repeat is performed on the chuck 1021 for each stage 101 in X-Y direction, a plurality of patterns are repeatedly transferred on the wafer 1161. Thus, while the exposure is performed on the wafer 1161, the wafer 1162 is assembled in the wafer 1022, and the positioning of the wafer 1162 is performed using the structure 108. Then, after the exposure has been finished, the chuck 1021 is moved in the direction shown by an arrow and positioned at a point below the structure 108, and at the same time, the chuck 1022 is placed on the stage 101, and a step-and-repeat exposure is performed on the wafer 1162 in the same manner as above.
JP56067909A 1981-05-06 1981-05-06 Method for wafer exposure and device thereof Pending JPS57183031A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56067909A JPS57183031A (en) 1981-05-06 1981-05-06 Method for wafer exposure and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56067909A JPS57183031A (en) 1981-05-06 1981-05-06 Method for wafer exposure and device thereof

Publications (1)

Publication Number Publication Date
JPS57183031A true JPS57183031A (en) 1982-11-11

Family

ID=13358496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56067909A Pending JPS57183031A (en) 1981-05-06 1981-05-06 Method for wafer exposure and device thereof

Country Status (1)

Country Link
JP (1) JPS57183031A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989421A (en) * 1982-11-15 1984-05-23 Canon Inc Device for printing of pattern
JPS6017921A (en) * 1983-07-11 1985-01-29 Hitachi Ltd Reduction projecting exposure device
JPS6033299U (en) * 1983-08-13 1985-03-07 立川ブラインド工業株式会社 Shutter locking device
JPH01309324A (en) * 1988-06-07 1989-12-13 Nikon Corp Aligner
EP0516317A2 (en) * 1991-05-29 1992-12-02 Orc Manufacturing Co., Ltd. Method of locating work in automatic exposing apparatus
EP0687957A1 (en) * 1994-06-17 1995-12-20 International Business Machines Corporation A multi-task semiconductor wafer stepper
WO1998006009A1 (en) * 1996-08-02 1998-02-12 Mrs Technology, Inc. Lithography system with remote multisensor alignment
WO1999032940A1 (en) * 1997-12-22 1999-07-01 Asm Lithography B.V. Repetitively projecting a mask pattern using a time-saving height measurement
US6327022B1 (en) 1997-01-27 2001-12-04 Nikon Corporation Projection exposure method and apparatus
US6341007B1 (en) 1996-11-28 2002-01-22 Nikon Corporation Exposure apparatus and method
US6819425B2 (en) 2000-08-24 2004-11-16 Asml Netherland B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US6894763B2 (en) 1997-11-22 2005-05-17 Nikon Corporation Exposure apparatus and methods utilizing plural mask and object stages movable in opposite directions, and methods of producing devices using the same
US7289212B2 (en) 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
US7561270B2 (en) 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147026A (en) * 1974-08-21 1976-04-22 Ciba Geigy BIIZUKEIJONOGANRYOSEIBUTSUNOSEIZOHO
JPS53105376A (en) * 1977-02-25 1978-09-13 Hitachi Ltd Positioning unit
JPS5429978A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Carrier device for semiconductor wafer and mask
JPS5447581A (en) * 1977-09-22 1979-04-14 Hitachi Ltd Mask aligner
JPS551106A (en) * 1978-06-16 1980-01-07 Nippon Telegr & Teleph Corp <Ntt> Device for positioning mask and wafer to each other

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147026A (en) * 1974-08-21 1976-04-22 Ciba Geigy BIIZUKEIJONOGANRYOSEIBUTSUNOSEIZOHO
JPS53105376A (en) * 1977-02-25 1978-09-13 Hitachi Ltd Positioning unit
JPS5429978A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Carrier device for semiconductor wafer and mask
JPS5447581A (en) * 1977-09-22 1979-04-14 Hitachi Ltd Mask aligner
JPS551106A (en) * 1978-06-16 1980-01-07 Nippon Telegr & Teleph Corp <Ntt> Device for positioning mask and wafer to each other

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989421A (en) * 1982-11-15 1984-05-23 Canon Inc Device for printing of pattern
JPS6362090B2 (en) * 1982-11-15 1988-12-01
JPS6017921A (en) * 1983-07-11 1985-01-29 Hitachi Ltd Reduction projecting exposure device
JPS6033299U (en) * 1983-08-13 1985-03-07 立川ブラインド工業株式会社 Shutter locking device
JPH027183Y2 (en) * 1983-08-13 1990-02-21
JPH01309324A (en) * 1988-06-07 1989-12-13 Nikon Corp Aligner
EP0516317A2 (en) * 1991-05-29 1992-12-02 Orc Manufacturing Co., Ltd. Method of locating work in automatic exposing apparatus
EP0687957A1 (en) * 1994-06-17 1995-12-20 International Business Machines Corporation A multi-task semiconductor wafer stepper
US5715064A (en) * 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
WO1998006009A1 (en) * 1996-08-02 1998-02-12 Mrs Technology, Inc. Lithography system with remote multisensor alignment
US6798491B2 (en) 1996-11-28 2004-09-28 Nikon Corporation Exposure apparatus and an exposure method
US7256869B2 (en) 1996-11-28 2007-08-14 Nikon Corporation Exposure apparatus and an exposure method
US6341007B1 (en) 1996-11-28 2002-01-22 Nikon Corporation Exposure apparatus and method
US6400441B1 (en) 1996-11-28 2002-06-04 Nikon Corporation Projection exposure apparatus and method
US6549269B1 (en) 1996-11-28 2003-04-15 Nikon Corporation Exposure apparatus and an exposure method
US6590634B1 (en) 1996-11-28 2003-07-08 Nikon Corporation Exposure apparatus and method
US7177008B2 (en) 1996-11-28 2007-02-13 Nikon Corporation Exposure apparatus and method
US6327022B1 (en) 1997-01-27 2001-12-04 Nikon Corporation Projection exposure method and apparatus
US6590636B2 (en) 1997-01-27 2003-07-08 Nikon Corporation Projection exposure method and apparatus
US6894763B2 (en) 1997-11-22 2005-05-17 Nikon Corporation Exposure apparatus and methods utilizing plural mask and object stages movable in opposite directions, and methods of producing devices using the same
WO1999032940A1 (en) * 1997-12-22 1999-07-01 Asm Lithography B.V. Repetitively projecting a mask pattern using a time-saving height measurement
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
US6819425B2 (en) 2000-08-24 2004-11-16 Asml Netherland B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7289212B2 (en) 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
US7561270B2 (en) 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7633619B2 (en) 2000-08-24 2009-12-15 Asml Netherlands B.V. Calibrating a lithographic apparatus
US7940392B2 (en) 2000-08-24 2011-05-10 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby

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