JPS60221757A - Mask for exposure - Google Patents

Abstract

PURPOSE:To process simultaneously >=two kinds in the same process, and to shorten the work time of the whole process by placing plural different kinds of patterns on an effective area in one reticle. CONSTITUTION:Plural patterns A, B and C having each different quality are placed in an effective area 5 of a reticle 4 of a reducing projection aligner use mask. In this state, in case of burning-in, the reticle 4 is fixed to a mask supporting frame 6, a shielding plate 7 is opened and closed, and a projection is executed selectively. Therefore, >=two kinds can be processed simultaneously in the same process, and the work time of the whole process can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an exposure mask, and particularly to a reduction projection exposure mask, such as a reticle.

In the manufacture of semiconductor devices, it is applied to the surface of a semiconductor substrate for selective diffusion, oxidation, and etching. A mask aligner is used for optical processing of organic photosensitizers.

Conventional mask aligners can be broadly categorized by projection method: (
1) A method in which the mask pattern is projected onto the wafer surface at a ratio of 1: ], and (2) a method in which the mask pattern is projected onto the wafer surface at a ratio of, for example, 1/10.
There is a method in which the image is reduced in size and moved and projected onto a surface. Of these, (1) uses one master mask with patterns for, say, 200 chips arranged, and the light emission time is short, about 10 seconds, but the pattern is fine and has the same dimensions as the object to be processed, so the resolution is high. There are limits to this, making it difficult to produce masks with precise patterns. On the other hand, (2) uses a mask 1 in which a pattern 2 having a size approximately 10 times that of one chip is arranged as shown in FIG. 1, so extremely high precision can be obtained. The amount of light for projection can also be small, but as shown in FIG.
The processing time is long because the projections for 00 chips are performed sequentially.
For example, it takes 20 minutes. Such reduction projection aligners are particularly problematic when they are required to be produced more quickly than in large quantities, such as in small-volume production types or express prototype types.

For example, regarding a reticle with a pattern written in 1% digits, see Denshi Materials March 1983 issue, p.

-72 to 78.

The present invention has been made in order to solve the problems of the prior art described above, and an object of the present invention is to provide a mask, that is, a reticle, which can be used in a reduction projection exposure apparatus and can shorten the overall working time. be.

In order to achieve the above object, one embodiment of the present invention processes two or more types of butter simultaneously in the same process by arranging a plurality of different types of butter in an effective area within one reticle,
The main idea is to shorten the entire process.

FIG. 3 shows an example of the structure of a mask for a reduction projection aligner according to an embodiment of the present invention. In the figure, reference numeral 4 indicates a reticle, and the area within the dashed line 5 indicates an effective area within the reticle, that is, an effective diameter of the reduction lens. Within this effective area, there are a plurality of different patterns A of different types.

B and C are provided. These A, B, and C belong to the same layer on the surface of the semiconductor wafer to be processed, and are processed in the same process.

By using such a reticle, the image shown in FIG.
), three types of patterns can be printed on the wafer at the same time, and since there was only one pattern per reticle, printing three types of patterns required three times as much effort and time as conventional methods. However, in one embodiment of the present invention, only one step is required, and the number of steps can be significantly reduced. The same figure (b
) and (c) are cases in which two or only one type of patterns of different types from one reticle are taken out and selectively printed, and a selection mask (shielding plate) is used.

FIG. 4 shows a mask support frame 6 in a reduction projection aligner used in one embodiment of the present invention, and the mask (
By fixing the reticle 4 and opening and closing the shielding plate 7, it is possible to selectively project different patterns on the mask.

According to such an embodiment of the present invention, it has the high precision that is an advantage of the reduction projection method, and also shortens the number of processes in the case of small-lot, multi-product production by printing patterns of different types at the same time. It became possible. Furthermore, according to an embodiment of the present invention, reticles having different patterns of a plurality of types are used as a reduction projection aligner to enable selective projection of each different pattern, and in this case, the mask setting time is reduced. This is especially effective when processing small quantities of prototypes on an express basis.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the form of a conventional reticle for a reduction projection aligner, FIG. 2 is a schematic diagram showing the principle structure of a reduction projection aligner, and FIG. 3 is a mask for a reduction projection aligner according to an embodiment of the present invention. FIG. 4 is a schematic sectional view showing a mask support part of a reduction projection aligner used in one embodiment of the present invention, and FIGS. 5(a), (b), (c)
) is a plan view showing a form in which different types of patterns are selectively extracted from a reduction projection mask according to an embodiment of the present invention. 1...Mask, 2...Pattern, 3...Wafer,
4... Reticle, butt... effective area, 6... mask support frame, 7... shielding plate that opens and closes, A, B, C... different patterns for each product. □×Y No. 312J No. 5 (a-> (b) (c)

Claims (1)

[Claims] 1. A reticle for reduction projection exposure characterized by having a plurality of patterns. 2. The reticle for reduction projection exposure according to claim 1, wherein the plurality of patterns have at least two different patterns.