CN107672334B - 制造电子设备的方法 - Google Patents
制造电子设备的方法 Download PDFInfo
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- CN107672334B CN107672334B CN201711129365.4A CN201711129365A CN107672334B CN 107672334 B CN107672334 B CN 107672334B CN 201711129365 A CN201711129365 A CN 201711129365A CN 107672334 B CN107672334 B CN 107672334B
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- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B2037/0069—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus the apparatus being originally designed for another function, e.g. printer, photocopier
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K59/80—Constructional details
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
Description
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Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230106718A (ko) | 2012-12-27 | 2023-07-13 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피제어를 위한 기법 |
US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
KR102541161B1 (ko) | 2013-12-12 | 2023-06-08 | 카티바, 인크. | 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조 |
JP2015168186A (ja) * | 2014-03-07 | 2015-09-28 | 株式会社リコー | 画像処理装置、画像処理プログラム、画像処理方法、及び画像処理システム |
JP6330506B2 (ja) | 2014-06-18 | 2018-05-30 | ブラザー工業株式会社 | 画像読取装置 |
JP6330505B2 (ja) * | 2014-06-18 | 2018-05-30 | ブラザー工業株式会社 | 画像読取装置 |
KR102185496B1 (ko) | 2014-06-30 | 2020-12-03 | 카티바, 인크. | 개선된 속도 및 정확도의 영구층 어레이 인쇄 기술 |
KR20160019589A (ko) * | 2014-08-11 | 2016-02-22 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치와, 이의 제조 방법 |
US10418427B2 (en) * | 2014-09-25 | 2019-09-17 | Joled Inc. | Method for manufacturing organic EL display panel |
US9463615B2 (en) * | 2015-03-06 | 2016-10-11 | Kyle Thomas Turner | Method of producing a high quality image on a blanket |
WO2016155829A1 (en) * | 2015-04-01 | 2016-10-06 | Hewlett-Packard Development Company L.P. | Structure forming for a three-dimensional object |
US9286554B1 (en) * | 2015-04-01 | 2016-03-15 | Xerox Corporation | System and method for halftone printing in a three-dimensional object printer |
JP6235524B2 (ja) * | 2015-04-17 | 2017-11-22 | ファナック株式会社 | 砂鋳型を製造する砂鋳型製造システムおよび砂鋳型製造方法 |
CN104795509A (zh) * | 2015-05-07 | 2015-07-22 | 京东方科技集团股份有限公司 | 一种oled器件的封装方法及封装结构、显示装置 |
US9955041B2 (en) * | 2015-06-12 | 2018-04-24 | Xerox Corporation | System and method for tone reproduction curve color resolution enhancement in a three-dimensional object printer |
KR102400483B1 (ko) * | 2015-10-02 | 2022-05-23 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치용 제조 장치와, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
US10875238B2 (en) | 2015-10-20 | 2020-12-29 | Hewlett-Packard Development Company, L.P. | Patterned layer deposition |
US11203207B2 (en) * | 2015-12-07 | 2021-12-21 | Kateeva, Inc. | Techniques for manufacturing thin films with improved homogeneity and print speed |
US10335995B2 (en) | 2015-12-16 | 2019-07-02 | Xerox Corporation | System and method for compensating for dissimilar shrinkage rates in different materials used to form a three-dimensional printed object during additive manufacturing |
KR102487276B1 (ko) | 2016-03-21 | 2023-01-12 | 삼성디스플레이 주식회사 | 잉크젯 인쇄 방법 및 이를 이용한 표시 장치 제조방법 |
WO2018017541A1 (en) * | 2016-07-21 | 2018-01-25 | Kateeva, Inc. | Methods of forming a polymeric thin film layer on an organic light-emitting diode substrate |
US10650621B1 (en) | 2016-09-13 | 2020-05-12 | Iocurrents, Inc. | Interfacing with a vehicular controller area network |
KR101974086B1 (ko) * | 2016-09-30 | 2019-05-02 | 삼성디스플레이 주식회사 | 표시모듈 |
US10150282B2 (en) * | 2016-10-14 | 2018-12-11 | Xerox Corporation | System and method for additive manufacture of chemical delivery devices using halftone screening |
JP6528759B2 (ja) * | 2016-12-22 | 2019-06-12 | カシオ計算機株式会社 | 立体画像形成システム及びプログラム |
US10366674B1 (en) * | 2016-12-27 | 2019-07-30 | Facebook Technologies, Llc | Display calibration in electronic displays |
CN110178216B (zh) * | 2017-01-13 | 2023-03-10 | 尼斯迪格瑞科技环球公司 | 使用由图案化疏水性层界定的可印刷溶液印刷复杂电子电路 |
WO2018190857A1 (en) * | 2017-04-14 | 2018-10-18 | Hewlett-Packard Development Company, L.P. | Drop weights corresponding to drop weight patterns |
US10084997B1 (en) * | 2017-05-23 | 2018-09-25 | Sony Corporation | Adaptive optics for a video projector |
CN107275515B (zh) * | 2017-06-20 | 2019-12-03 | 深圳市华星光电技术有限公司 | Oled器件封装方法、结构、oled器件及显示屏 |
WO2019021370A1 (ja) * | 2017-07-25 | 2019-01-31 | シャープ株式会社 | 塗布装置、elデバイス製造装置およびelデバイス |
EP3435650A1 (en) * | 2017-07-26 | 2019-01-30 | HP Scitex Ltd | Ink-optimized halftone screen |
US10453907B2 (en) * | 2017-08-21 | 2019-10-22 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | OLED device and method for fabricating the same |
JP7047311B2 (ja) * | 2017-09-29 | 2022-04-05 | セイコーエプソン株式会社 | 印刷制御装置、印刷装置および印刷制御方法 |
CN110165068B (zh) * | 2018-05-11 | 2020-12-18 | 京东方科技集团股份有限公司 | 有机膜结构及制备方法、封装结构及制备方法和发光基板 |
JP7230612B2 (ja) * | 2019-03-20 | 2023-03-01 | 株式会社リコー | 液体吐出装置、制御方法、及びプログラム |
KR20200119454A (ko) * | 2019-04-09 | 2020-10-20 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
US11367643B2 (en) * | 2019-06-28 | 2022-06-21 | Applied Materials, Inc. | Method for substrate registration and anchoring in inkjet printing |
JP7382164B2 (ja) * | 2019-07-02 | 2023-11-16 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
US11182532B2 (en) * | 2019-07-15 | 2021-11-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Hierarchical density uniformization for semiconductor feature surface planarization |
KR20210063508A (ko) | 2019-11-22 | 2021-06-02 | 삼성디스플레이 주식회사 | 표시 장치 제조 방법 |
CN111300987B (zh) * | 2020-02-27 | 2021-02-02 | 深圳怡化电脑股份有限公司 | 喷墨间隔时间确定方法、装置、计算机设备及存储介质 |
WO2022070192A1 (en) * | 2020-10-01 | 2022-04-07 | Tritone Technologies Ltd. | Mold thickness uniformity calibration method and apparatus |
US11903302B2 (en) * | 2020-12-16 | 2024-02-13 | Universal Display Corporation | Organic vapor jet printing system |
AU2022218997A1 (en) * | 2021-02-10 | 2023-09-07 | Njie, Mohammed Alboury | Poly-layered, poly-dimensional solar-stack structure |
CN113602018B (zh) * | 2021-07-06 | 2022-08-09 | 华中科技大学 | 一种柔性电子喷印制膜漏打印缺陷在线补偿方法及系统 |
WO2023041161A1 (en) * | 2021-09-16 | 2023-03-23 | Abb Schweiz Ag | Method of applying coating medium, coated object, control system and coating system |
CN114132080B (zh) * | 2021-12-02 | 2022-06-07 | 北京博示电子科技有限责任公司 | 一种调整打印点的方法、装置、电子设备和存储介质 |
WO2023239417A1 (en) * | 2022-06-10 | 2023-12-14 | Magic Leap, Inc. | Compensating thickness variations in substrates for optical devices |
CN117465134A (zh) * | 2022-07-28 | 2024-01-30 | 杭州宏华数码科技股份有限公司 | 用于控制喷印装置的方法、设备和介质 |
CN115847807B (zh) * | 2022-12-09 | 2023-10-27 | 湖南大学 | 一种基于体积打印原理的复合材料增材制造系统的方法 |
US11962737B1 (en) | 2023-03-10 | 2024-04-16 | Ricoh Company, Ltd. | Edge enhancement with compensation mechanism |
US11956403B1 (en) | 2023-03-10 | 2024-04-09 | Ricoh Company, Ltd. | Edge enhancement with compensation mechanism |
Family Cites Families (367)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140418A (ja) | 1984-07-31 | 1986-02-26 | Mitsubishi Motors Corp | タ−ボ過給装置用タ−ビンハウジングの製造方法 |
US4992270A (en) | 1987-01-09 | 1991-02-12 | International Flavors & Fragrances Inc. | Use of benzyl formate, and d-pulegone and mixtures of same as beetle attractants |
US4963882B1 (en) | 1988-12-27 | 1996-10-29 | Hewlett Packard Co | Printing of pixel locations by an ink jet printer using multiple nozzles for each pixel or pixel row |
US4922270A (en) | 1989-01-31 | 1990-05-01 | Hewlett-Packard Company | Inter pen offset determination and compensation in multi-pen thermal ink jet pen printing systems |
US5345673A (en) * | 1989-07-12 | 1994-09-13 | Yoshitaka Saitoh | Method of manufacturing a printed wiring board |
JP3005909B2 (ja) | 1989-12-11 | 2000-02-07 | 日本電気株式会社 | 有機薄膜el素子 |
EP0443861B2 (en) | 1990-02-23 | 2008-05-28 | Sumitomo Chemical Company, Limited | Organic electroluminescence device |
JP2633106B2 (ja) * | 1991-05-24 | 1997-07-23 | シャープ株式会社 | レジスト塗布装置 |
US6406114B1 (en) | 1991-06-05 | 2002-06-18 | Canon Kabushiki Kaisha | Tonal product recorded by ink and having a plurality of pixels with plural tonal levels |
US5320250A (en) | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
JPH0578655U (ja) | 1992-04-01 | 1993-10-26 | 豊田合成株式会社 | エアバッグ装置 |
EP0598104B1 (en) | 1992-06-05 | 1999-04-28 | Eastman Kodak Company | Method and apparatus for reproducing an image with gray level printing |
JP2991270B2 (ja) | 1993-04-26 | 1999-12-20 | キヤノン株式会社 | カラーフィルターの製造方法 |
US5434430A (en) | 1993-04-30 | 1995-07-18 | Hewlett-Packard Company | Drop size detect circuit |
EP0622230A3 (en) | 1993-04-30 | 1995-07-05 | Hewlett Packard Co | Process for bidirectional printing. |
US5555006A (en) | 1993-04-30 | 1996-09-10 | Hewlett-Packard Company | Inkjet printing: mask-rotation-only at page extremes; multipass modes for quality and throughput on plastic media |
US6164746A (en) | 1993-09-24 | 2000-12-26 | Canon Kabushiki Kaisha | Ink-jet printer method and apparatus, color filter, display device, apparatus having display device, ink-jet head unit adjusting device and method, and ink-jet head unit |
US6705717B1 (en) * | 1993-09-30 | 2004-03-16 | Canon Kabushiki Kaisha | Ink-jet printer and printing system capable of printing on clothes and papers, ink to be used in the system and production method for producing article with employing the system |
JPH07169567A (ja) | 1993-12-16 | 1995-07-04 | Idemitsu Kosan Co Ltd | 有機el素子 |
JP3463362B2 (ja) | 1993-12-28 | 2003-11-05 | カシオ計算機株式会社 | 電界発光素子の製造方法および電界発光素子 |
FR2716010B1 (fr) | 1994-02-04 | 1996-04-19 | Toxot Science & Appl | Dispositif et procédés de fabrication et de réparation de filtres colorés. |
US5498444A (en) | 1994-02-28 | 1996-03-12 | Microfab Technologies, Inc. | Method for producing micro-optical components |
JPH07294916A (ja) | 1994-04-21 | 1995-11-10 | Toray Ind Inc | 表示器 |
US5469276A (en) | 1994-10-11 | 1995-11-21 | Seiko Epson Corporation | Method and apparatus for reducing artifacts in halftone images using gray balance correction |
JPH08323982A (ja) * | 1995-03-29 | 1996-12-10 | Sony Corp | 液体噴射記録装置 |
US5932012A (en) | 1995-06-23 | 1999-08-03 | Hitachi Techno Engineering Co., Ltd. | Paste applicator having positioning means |
EP1256387B1 (en) | 1995-10-13 | 2009-02-18 | Nordson Corporation | Flip chip underfill system and method |
US5681757A (en) | 1996-04-29 | 1997-10-28 | Microfab Technologies, Inc. | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process |
US5779971A (en) | 1996-06-07 | 1998-07-14 | Hewlett-Packard Company | Solder jet printhead |
JP3036436B2 (ja) | 1996-06-19 | 2000-04-24 | セイコーエプソン株式会社 | アクティブマトリックス型有機el表示体の製造方法 |
EP1332876B1 (en) | 1996-09-09 | 2006-03-22 | Seiko Epson Corporation | Ink jet printer and ink printing method |
JPH10138475A (ja) | 1996-11-13 | 1998-05-26 | Ricoh Co Ltd | インクジェット記録装置及びヘッド駆動回路 |
US6149263A (en) | 1996-11-13 | 2000-11-21 | Ricoh Company, Ltd. | Ink jet recording apparatus capable of increasing a monochrome print speed without causing ink supply shortage to an image |
JP3899566B2 (ja) | 1996-11-25 | 2007-03-28 | セイコーエプソン株式会社 | 有機el表示装置の製造方法 |
US6013982A (en) | 1996-12-23 | 2000-01-11 | The Trustees Of Princeton University | Multicolor display devices |
JP3346454B2 (ja) | 1997-01-08 | 2002-11-18 | セイコーエプソン株式会社 | インクジェット式印刷装置及び印刷方法 |
US7217754B2 (en) | 1997-02-26 | 2007-05-15 | Integument Technologies, Inc. | Polymer composites and methods for making and using same |
US6019454A (en) | 1997-03-04 | 2000-02-01 | Hewlett-Packard Company | Multipass inkjet printmodes with randomized dot placement, to minimize patterning and liquid loading |
US6283572B1 (en) | 1997-03-04 | 2001-09-04 | Hewlett-Packard Company | Dynamic multi-pass print mode corrections to compensate for malfunctioning inkjet nozzles |
US6352331B1 (en) | 1997-03-04 | 2002-03-05 | Hewlett-Packard Company | Detection of non-firing printhead nozzles by optical scanning of a test pattern |
EP1225056B1 (en) * | 1997-03-21 | 2004-11-24 | Canon Kabushiki Kaisha | Process for producing a printed substrate |
KR100589987B1 (ko) * | 1997-05-15 | 2006-06-14 | 자아 테크날러쥐 리미티드 | 잉크 인쇄 장치의 동작 |
EP0887199B1 (en) * | 1997-06-26 | 2004-03-31 | Mitsubishi Paper Mills, Ltd. | Ink jet recording sheet |
JP3747127B2 (ja) | 1997-07-28 | 2006-02-22 | キヤノン株式会社 | カラーフィルタの製造方法及び表示装置の製造方法及び表示装置を備えた情報処理装置の製造方法 |
JP3332822B2 (ja) | 1997-09-05 | 2002-10-07 | キヤノン株式会社 | カラーフィルタ基板の製造方法 |
US20030166104A1 (en) | 1997-09-18 | 2003-09-04 | Genentech, Inc. | Secreted and transmembrane polypeptides and nucleic acids encoding the same |
US6154229A (en) | 1997-10-28 | 2000-11-28 | Hewlett-Packard Company | Thermal ink jet print head and printer temperature control apparatus and method |
JP2000062158A (ja) | 1998-06-10 | 2000-02-29 | Canon Inc | 液体噴射記録ヘッド等の記録ヘッド検査装置、液体噴射記録ヘッド着弾点検査方法、液体噴射記録ヘッドの製造方法、液体噴射記録ヘッドおよび該ヘッドを搭載可能な液体噴射記録装置 |
AUPP413798A0 (en) * | 1998-06-16 | 1998-07-09 | Sony Corporation | Permanent image formation |
US6325480B1 (en) | 1998-07-28 | 2001-12-04 | Eastman Kodak Company | Ink jet printer and method capable of forming a plurality of registration marks on a receiver and sensing the marks formed thereby |
US6066357A (en) | 1998-12-21 | 2000-05-23 | Eastman Kodak Company | Methods of making a full-color organic light-emitting display |
US6363177B1 (en) * | 1998-12-30 | 2002-03-26 | Xerox Corporation | Systems and methods for rotating high addressability images |
US6228228B1 (en) | 1999-02-23 | 2001-05-08 | Sarnoff Corporation | Method of making a light-emitting fiber |
JP3244081B2 (ja) * | 1999-02-25 | 2002-01-07 | セイコーエプソン株式会社 | 電子写真装置及び電子写真の画像処理方法 |
US6313545B1 (en) | 1999-03-10 | 2001-11-06 | Wader, Llc. | Hydrocratic generator |
US6629741B1 (en) | 1999-03-11 | 2003-10-07 | Fuji Xerox Co., Ltd. | Ink jet recording head drive method and ink jet recording apparatus |
US6286299B1 (en) | 1999-04-26 | 2001-09-11 | General Electric Co. | Gas turbine combined lift/hydraulic system |
JP2002011872A (ja) | 1999-05-06 | 2002-01-15 | Seiko Epson Corp | 液体噴射装置、画像記録装置、及び液体噴射装置の駆動方法、並びにコンピュータ読み取り可能な記録媒体 |
US6827423B1 (en) | 1999-05-06 | 2004-12-07 | Seiko Epson Corporation | Liquid jetting apparatus, method of driving the same, computer-readable recording medium storing the method and image recording apparatus incorporating the same |
US7288420B1 (en) * | 1999-06-04 | 2007-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing an electro-optical device |
NL1012376C2 (nl) | 1999-06-17 | 2000-12-19 | Ocu Technologies B V | Werkwijze voor het bedrukken van een substraat en een drukinrichting geschikt om deze werkwijze toe te passen. |
DE19929322A1 (de) | 1999-06-25 | 2000-12-28 | Eastman Kodak Co | Tintenstrahldrucker für die Herstellung von Fotoabzügen |
US6401001B1 (en) * | 1999-07-22 | 2002-06-04 | Nanotek Instruments, Inc. | Layer manufacturing using deposition of fused droplets |
JP2001038892A (ja) | 1999-08-02 | 2001-02-13 | Seiko Epson Corp | 印刷装置、印刷方法、記録媒体およびノズルブロックの製造方法 |
JP3384388B2 (ja) | 1999-08-18 | 2003-03-10 | セイコーエプソン株式会社 | 液体噴射装置、及び、液体噴射装置の駆動方法 |
JP2001129985A (ja) | 1999-08-24 | 2001-05-15 | Canon Inc | プリント位置調整方法並びに該方法を用いるプリント装置およびプリントシステム |
JP2001071476A (ja) | 1999-09-03 | 2001-03-21 | Canon Inc | 吐出液滴評価装置および吐出液滴評価方法 |
JP2001147515A (ja) | 1999-09-07 | 2001-05-29 | Ricoh Co Ltd | フォトマスク設計方法、フォトマスク設計装置、コンピュータ読取可能な記憶媒体、フォトマスク、フォトレジスト、感光性樹脂、基板、マイクロレンズ及び光学素子 |
US6347857B1 (en) | 1999-09-23 | 2002-02-19 | Encad, Inc. | Ink droplet analysis apparatus |
US6517176B1 (en) | 1999-09-30 | 2003-02-11 | Seiko Epson Corporation | Liquid jetting apparatus |
JP3679987B2 (ja) | 1999-09-30 | 2005-08-03 | セイコーエプソン株式会社 | 液体噴射装置 |
JP3446686B2 (ja) | 1999-10-21 | 2003-09-16 | セイコーエプソン株式会社 | インクジェット式記録装置 |
US20090191342A1 (en) | 1999-10-25 | 2009-07-30 | Vitex Systems, Inc. | Method for edge sealing barrier films |
JP2001138590A (ja) | 1999-11-11 | 2001-05-22 | Seiko Epson Corp | シリアルプリンタ、印刷システム及びシリアルプリンタにおけるキャリッジの駆動方法 |
JP4027552B2 (ja) | 1999-12-07 | 2007-12-26 | 株式会社日立ハイテクノロジーズ | 透明基板検査装置 |
US6629739B2 (en) | 1999-12-17 | 2003-10-07 | Xerox Corporation | Apparatus and method for drop size switching in ink jet printing |
US6961141B2 (en) | 2000-02-25 | 2005-11-01 | Eastman Kodak Company | Method and electronic apparatus for formatting and serving inkjet image data |
TW514596B (en) * | 2000-02-28 | 2002-12-21 | Hewlett Packard Co | Glass-fiber thermal inkjet print head |
US6495917B1 (en) | 2000-03-17 | 2002-12-17 | International Business Machines Corporation | Method and structure of column interconnect |
TWI226205B (en) * | 2000-03-27 | 2005-01-01 | Semiconductor Energy Lab | Self-light emitting device and method of manufacturing the same |
TW490997B (en) * | 2000-03-31 | 2002-06-11 | Seiko Epson Corp | Method of manufacturing organic EL element, and organic EL element |
US6247787B1 (en) | 2000-04-29 | 2001-06-19 | Hewlett-Packard Company | Print mode for improved leading and trailing edges and text print quality |
US7074640B2 (en) * | 2000-06-06 | 2006-07-11 | Simon Fraser University | Method of making barrier layers |
US6754551B1 (en) | 2000-06-29 | 2004-06-22 | Printar Ltd. | Jet print apparatus and method for printed circuit board manufacturing |
US7075677B1 (en) | 2000-06-30 | 2006-07-11 | Silverbrook Research Pty Ltd | Ink jet fault tolerance using oversize drops |
TW577813B (en) | 2000-07-10 | 2004-03-01 | Semiconductor Energy Lab | Film forming apparatus and method of manufacturing light emitting device |
JP3467570B2 (ja) | 2000-08-04 | 2003-11-17 | セイコーエプソン株式会社 | 液体噴射装置、及び、液体噴射装置の駆動方法 |
CA2356809C (en) * | 2000-09-04 | 2005-11-22 | Canon Kabushiki Kaisha | Ink set for ink jet recording |
JP3491155B2 (ja) | 2000-11-21 | 2004-01-26 | セイコーエプソン株式会社 | 材料の吐出方法、及び吐出装置、カラーフィルタの製造方法及び製造装置、液晶装置の製造方法及び製造装置、el装置の製造方法及び製造装置 |
JP3552669B2 (ja) | 2001-01-11 | 2004-08-11 | セイコーエプソン株式会社 | 画像印刷方法、画像印刷装置、画像印刷システム、ラベル作成方法およびラベル作成システム |
US6478404B2 (en) * | 2001-01-30 | 2002-11-12 | Hewlett-Packard Company | Ink jet printhead |
US20020110673A1 (en) * | 2001-02-14 | 2002-08-15 | Ramin Heydarpour | Multilayered electrode/substrate structures and display devices incorporating the same |
JP2002323615A (ja) | 2001-04-24 | 2002-11-08 | Canon Inc | インクジェット着色装置及び方法、カラーフィルタ、エレクトロルミネッセンス素子、表示装置の製造方法、表示装置用パネルの製造装置及び製造方法 |
US6672697B2 (en) | 2001-05-30 | 2004-01-06 | Eastman Kodak Company | Compensation method for overlapping print heads of an ink jet printer |
WO2002099848A2 (en) | 2001-06-01 | 2002-12-12 | Litrex Corporation | Formation of printed circuit board structures using piezo microdeposition |
US7449070B2 (en) | 2001-06-01 | 2008-11-11 | Ulvac, Inc. | Waveform generator for microdeposition control system |
JP2003014442A (ja) | 2001-07-03 | 2003-01-15 | Canon Inc | 液滴体積測定装置 |
US6783210B2 (en) | 2001-07-05 | 2004-08-31 | Seiko Epson Corporation | Ink jet recording apparatus and method of driving the same |
JP2003022892A (ja) | 2001-07-06 | 2003-01-24 | Semiconductor Energy Lab Co Ltd | 発光装置の製造方法 |
JP4126976B2 (ja) | 2001-07-23 | 2008-07-30 | セイコーエプソン株式会社 | 吐出装置及びその制御方法、吐出方法、マイクロレンズアレイの製造方法、並びに電気光学装置の製造方法 |
GB2379413A (en) | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Printhead alignment method |
GB2379412A (en) | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Deposition of soluble materials |
GB2379411A (en) | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Inkjet deposition apparatus |
JP3647405B2 (ja) | 2001-09-26 | 2005-05-11 | キヤノン株式会社 | 画像処理装置及び画像処理方法 |
WO2003036738A1 (en) | 2001-10-19 | 2003-05-01 | Koninklijke Philips Electronics N.V. | Multi-nozzle printing method for pled displays |
JP3835532B2 (ja) | 2001-10-26 | 2006-10-18 | リコープリンティングシステムズ株式会社 | インクジェット式印刷装置 |
US6863361B2 (en) | 2001-10-30 | 2005-03-08 | Hewlett-Packard Development Company, L.P. | Method to correct for malfunctioning ink ejection elements in a single pass print mode |
JP2003161824A (ja) | 2001-11-29 | 2003-06-06 | Matsushita Electric Ind Co Ltd | カラーフィルタ及びそのオーバーコート形成方法及びこれを用いた液晶表示素子 |
JP4425509B2 (ja) | 2001-11-30 | 2010-03-03 | ブラザー工業株式会社 | インク噴射装置 |
US6736484B2 (en) | 2001-12-14 | 2004-05-18 | Seiko Epson Corporation | Liquid drop discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter method of manufacture thereof, and device for manufacturing thereof; and device incorporating backing, method of manufacturing thereof, and device for manufacture thereof |
JP4066661B2 (ja) | 2002-01-23 | 2008-03-26 | セイコーエプソン株式会社 | 有機el装置の製造装置および液滴吐出装置 |
US6921148B2 (en) | 2002-01-30 | 2005-07-26 | Seiko Epson Corporation | Liquid drop discharge head, discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter, method of manufacture thereof, and device for manufacture thereof; and device incorporating backing, method of manufacture thereof, and device for manufacture thereof |
JP2003249355A (ja) | 2002-02-26 | 2003-09-05 | Seiko Epson Corp | 表示装置の製造方法、表示装置、電子機器の製造方法および電子機器 |
JP3772805B2 (ja) | 2002-03-04 | 2006-05-10 | セイコーエプソン株式会社 | 液体噴射ヘッド、及び、それを備えた液体噴射装置 |
JP3838964B2 (ja) | 2002-03-13 | 2006-10-25 | 株式会社リコー | 機能性素子基板の製造装置 |
JP2003266738A (ja) | 2002-03-19 | 2003-09-24 | Seiko Epson Corp | 吐出装置用ヘッドユニットおよびこれを備えた吐出装置、並びに液晶表示装置の製造方法、有機el装置の製造方法、電子放出装置の製造方法、pdp装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機elの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
JP3979135B2 (ja) | 2002-03-20 | 2007-09-19 | セイコーエプソン株式会社 | チャンバ装置、これを備えた電気光学装置および有機el装置 |
JP4036023B2 (ja) | 2002-04-23 | 2008-01-23 | ブラザー工業株式会社 | インクジェット装置、有機elディスプレイパネル製造方法、パラメータ決定方法およびパラメータ決定プログラム |
JP4200810B2 (ja) | 2002-05-17 | 2008-12-24 | セイコーエプソン株式会社 | ディスプレー製造装置、及び、ディスプレー製造方法 |
US6972261B2 (en) | 2002-06-27 | 2005-12-06 | Xerox Corporation | Method for fabricating fine features by jet-printing and surface treatment |
JP4040543B2 (ja) | 2002-07-08 | 2008-01-30 | キヤノン株式会社 | 液体吐出装置及び方法、パネル製造装置及び製造方法、カラーフィルタ製造方法、液晶表示パネルの製造方法、液晶表示パネルを備えた装置の製造方法 |
US7111755B2 (en) | 2002-07-08 | 2006-09-26 | Canon Kabushiki Kaisha | Liquid discharge method and apparatus and display device panel manufacturing method and apparatus |
US7188919B2 (en) | 2002-07-08 | 2007-03-13 | Canon Kabushiki Kaisha | Liquid discharge method and apparatus using individually controllable nozzles |
US7258900B2 (en) * | 2002-07-15 | 2007-08-21 | Jds Uniphase Corporation | Magnetic planarization of pigment flakes |
US7201462B2 (en) | 2002-07-24 | 2007-04-10 | Canon Kabushiki Kaisha | Ink jet printing apparatus and method for correcting ejection driving |
JP2004058627A (ja) | 2002-07-31 | 2004-02-26 | Canon Inc | 液滴計測方法およびその装置 |
US7121642B2 (en) | 2002-08-07 | 2006-10-17 | Osram Opto Semiconductors Gmbh | Drop volume measurement and control for ink jet printing |
JP2004066133A (ja) | 2002-08-07 | 2004-03-04 | Seiko Epson Corp | 製造システム、その制御装置、制御方法、制御システム及び制御プログラム |
US6911132B2 (en) | 2002-09-24 | 2005-06-28 | Duke University | Apparatus for manipulating droplets by electrowetting-based techniques |
US7823535B2 (en) | 2002-09-27 | 2010-11-02 | Shimadzu Corporation | Liquid portioning method and device |
JP2004160449A (ja) | 2002-10-24 | 2004-06-10 | Seiko Epson Corp | デバイス製造装置及びデバイスの製造方法、電子機器 |
JP2004148619A (ja) | 2002-10-30 | 2004-05-27 | Brother Ind Ltd | カラーインクジェットプリンタ |
JP3976260B2 (ja) * | 2002-10-31 | 2007-09-12 | 日本製紙株式会社 | インクジェット記録媒体 |
JP4257163B2 (ja) | 2002-11-12 | 2009-04-22 | セイコーエプソン株式会社 | 描画装置におけるノズルの異常判別方法および描画装置、並びに電気光学装置、電気光学装置の製造方法および電子機器 |
JP3801158B2 (ja) * | 2002-11-19 | 2006-07-26 | セイコーエプソン株式会社 | 多層配線基板の製造方法、多層配線基板、電子デバイス及び電子機器 |
ATE539888T1 (de) | 2002-11-27 | 2012-01-15 | Ulvac Inc | Industrielles mikroauftragesystem mit auftrageverteilung zur verminderung der auswirkung von tröpfchenausrichtungstoleranzen und -fehlern sowie tröpfchenvolumentoleranzen und fehlern |
JP2004177243A (ja) * | 2002-11-27 | 2004-06-24 | Dainippon Printing Co Ltd | 微量液滴の体積の測定方法およびそれに用いる微量液滴採取用基板 |
JP2004209412A (ja) | 2003-01-06 | 2004-07-29 | Seiko Epson Corp | 液滴吐出装置、電気光学装置、電気光学装置の製造方法および電子機器 |
AU2003900180A0 (en) | 2003-01-16 | 2003-01-30 | Silverbrook Research Pty Ltd | Method and apparatus (dam001) |
KR100492118B1 (ko) | 2003-01-21 | 2005-06-01 | 삼성전자주식회사 | 잉크젯 프린터의 헤드간격 조절장치 및 그 조절방법 |
KR100615173B1 (ko) | 2003-02-11 | 2006-08-25 | 삼성에스디아이 주식회사 | 다중 잉크젯 헤드를 이용한 발광 용액 주입 방법 |
KR100505061B1 (ko) | 2003-02-12 | 2005-08-01 | 삼성전자주식회사 | 기판 이송 모듈 |
JP4168788B2 (ja) | 2003-03-06 | 2008-10-22 | セイコーエプソン株式会社 | 成膜方法、カラーフィルタ基板の製造方法、エレクトロルミネッセンス装置用基板の製造方法、表示装置の製造方法 |
JP3915789B2 (ja) | 2003-03-13 | 2007-05-16 | セイコーエプソン株式会社 | カラーフィルタ基板の製造方法 |
JP4311050B2 (ja) | 2003-03-18 | 2009-08-12 | セイコーエプソン株式会社 | 機能液滴吐出ヘッドの駆動制御方法および機能液滴吐出装置 |
JP4273819B2 (ja) | 2003-04-14 | 2009-06-03 | セイコーエプソン株式会社 | 液体噴射装置、及びその制御方法 |
JP2004337709A (ja) | 2003-05-14 | 2004-12-02 | Seiko Epson Corp | 液滴吐出装置、カラーフィルター製造装置、カラーフィルター及びその製造方法、液晶装置、電子機器 |
JP2005012179A (ja) * | 2003-05-16 | 2005-01-13 | Seiko Epson Corp | 薄膜パターン形成方法、デバイスとその製造方法及び電気光学装置並びに電子機器、アクティブマトリクス基板の製造方法 |
JP4241195B2 (ja) | 2003-06-02 | 2009-03-18 | ソニー株式会社 | 液体吐出装置の濃度調整方法、液体吐出装置の濃度調整システム、及び液体吐出装置 |
JP2005014216A (ja) | 2003-06-23 | 2005-01-20 | Seiko Epson Corp | ドットずれ検出方法およびドットずれ検出装置 |
JP2005015885A (ja) | 2003-06-27 | 2005-01-20 | Ebara Corp | 基板処理方法及び装置 |
US6942719B2 (en) | 2003-06-30 | 2005-09-13 | The Boeing Company | Methods and systems for pressure swing regeneration for hydrogen generation |
CN1819922A (zh) | 2003-07-10 | 2006-08-16 | 皇家飞利浦电子股份有限公司 | 用于将图案准确定位在基片上的方法和设备 |
JP2005044613A (ja) * | 2003-07-28 | 2005-02-17 | Seiko Epson Corp | 発光装置の製造方法および発光装置 |
JP4148085B2 (ja) | 2003-09-26 | 2008-09-10 | セイコーエプソン株式会社 | 電気光学装置の製造方法、電気光学装置の製造方法で製造された電気光学装置、電気光学装置を搭載した電子機器。 |
US6942308B2 (en) | 2003-10-10 | 2005-09-13 | Hewlett-Packard Development Company, L.P. | Compensation of lateral position changes in printing |
US7253927B2 (en) * | 2003-10-15 | 2007-08-07 | Benq Corporation | Method of adjusting halftone image dot positions for improving print quality |
JP4093167B2 (ja) | 2003-10-15 | 2008-06-04 | セイコーエプソン株式会社 | 液滴吐出装置、電気光学装置の製造方法、電気光学装置および電子機器 |
JP2005131606A (ja) | 2003-10-31 | 2005-05-26 | Seiko Epson Corp | 吐出装置、カラーフィルタ基板の製造装置、エレクトロルミネッセンス表示装置の製造装置、および吐出方法 |
JP2005178042A (ja) * | 2003-12-16 | 2005-07-07 | Seiko Epson Corp | 印刷装置、コンピュータプログラム、印刷システム、及び、インク滴の吐出方法 |
JP2005183184A (ja) | 2003-12-19 | 2005-07-07 | Asahi Glass Co Ltd | 有機el表示装置の製造方法 |
JP2005193104A (ja) | 2004-01-05 | 2005-07-21 | Seiko Epson Corp | 吐出装置及びその制御方法、吐出方法、並びにデバイスの製造方法及びデバイス |
US20050156176A1 (en) | 2004-01-16 | 2005-07-21 | Rahul Gupta | Method for printing organic devices |
JP4100354B2 (ja) | 2004-02-19 | 2008-06-11 | セイコーエプソン株式会社 | 材料塗布方法、カラーフィルタの製造方法、エレクトロルミネッセンス表示装置の製造方法、およびプラズマ表示装置の製造方法。 |
JP3994998B2 (ja) | 2004-03-03 | 2007-10-24 | セイコーエプソン株式会社 | 発光装置、発光装置の製造方法及び電子機器 |
JP4419015B2 (ja) | 2004-03-04 | 2010-02-24 | リコープリンティングシステムズ株式会社 | インクジェット塗布方法及び装置 |
JP4161964B2 (ja) | 2004-03-09 | 2008-10-08 | セイコーエプソン株式会社 | パターン形成方法、パターン形成システムおよび電子機器 |
US7281778B2 (en) | 2004-03-15 | 2007-10-16 | Fujifilm Dimatix, Inc. | High frequency droplet ejection device and method |
JP3981675B2 (ja) * | 2004-04-16 | 2007-09-26 | 株式会社石井表記 | 膜形成方法及び膜形成装置 |
US20050247340A1 (en) * | 2004-04-19 | 2005-11-10 | Zeira Eitan C | All printed solar cell array |
CN1947278B (zh) * | 2004-04-22 | 2010-10-13 | 奥斯兰姆奥普托半导体有限责任公司 | 用于有机电子元件的封装及其制造方法和用途 |
ATE477515T1 (de) * | 2004-06-03 | 2010-08-15 | Molecular Imprints Inc | Fluidausgabe und tropfenausgabe nach bedarf für die herstellung im nanobereich |
GB0414487D0 (en) * | 2004-06-29 | 2004-07-28 | Xaar Technology Ltd | Manufacture of electronic devices |
JP4580706B2 (ja) | 2004-07-08 | 2010-11-17 | 株式会社東芝 | インク塗布装置及び表示装置製造方法 |
JP4561226B2 (ja) * | 2004-08-06 | 2010-10-13 | セイコーエプソン株式会社 | カラーフィルタの成膜方法 |
JP4159525B2 (ja) | 2004-08-23 | 2008-10-01 | 株式会社石井表記 | 配向膜形成方法およびインクジェット式プリントヘッド噴出検査装置 |
CN101706629B (zh) | 2004-08-23 | 2012-02-29 | 株式会社石井表记 | 定向膜形成方法和喷墨类型打印头排出检查设备 |
US7235431B2 (en) | 2004-09-02 | 2007-06-26 | Micron Technology, Inc. | Methods for packaging a plurality of semiconductor dice using a flowable dielectric material |
US7281785B2 (en) | 2004-09-17 | 2007-10-16 | Fujifilm Dimatix, Inc. | Fluid handling in droplet deposition systems |
JP4100385B2 (ja) * | 2004-09-22 | 2008-06-11 | セイコーエプソン株式会社 | 多層構造形成方法、配線基板の製造方法、および電子機器の製造方法 |
JP4329740B2 (ja) * | 2004-10-22 | 2009-09-09 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置の製造方法、及び有機エレクトロルミネッセンス装置 |
US20060093751A1 (en) | 2004-11-04 | 2006-05-04 | Applied Materials, Inc. | System and methods for inkjet printing for flat panel displays |
US7503637B2 (en) | 2004-11-10 | 2009-03-17 | Seiko Epson Corporation | Liquid-ejection testing method, liquid-ejection testing device, and computer-readable medium |
GB0426221D0 (en) * | 2004-11-30 | 2004-12-29 | Xaar Technology Ltd | Deposition of electronically-active fluids |
KR100648923B1 (ko) | 2004-12-14 | 2006-11-28 | 삼성전자주식회사 | 화상형성 시스템 및 화상형성 방법 |
JP4568800B2 (ja) | 2004-12-17 | 2010-10-27 | 国立大学法人埼玉大学 | 小滴の状態計測装置及び該装置におけるカメラの校正方法 |
US20060132529A1 (en) | 2004-12-22 | 2006-06-22 | Bart Verhoest | Positioning system |
KR100668325B1 (ko) | 2005-01-21 | 2007-01-12 | 삼성전자주식회사 | 컬러 필터의 제조장치 및 제조방법 |
JP2006212501A (ja) | 2005-02-02 | 2006-08-17 | Seiko Epson Corp | 液滴吐出装置、液滴吐出装置におけるワイピング方法、電気光学装置の製造方法、電気光学装置および電子機器 |
US7554697B2 (en) | 2005-02-14 | 2009-06-30 | Konica Minolta Holdings, Inc. | Image forming apparatus, image forming method, and image forming program |
JP4337746B2 (ja) * | 2005-03-09 | 2009-09-30 | セイコーエプソン株式会社 | フォトマスクおよびその製造方法、電子機器の製造方法 |
JP2006289951A (ja) | 2005-03-16 | 2006-10-26 | Seiko Epson Corp | 印刷方法、印刷装置、印刷プログラム、コンピュータ読み取り可能な記録媒体、印刷装置制御プログラム、印刷装置制御方法、印刷用データ生成装置、印刷用データ生成プログラム及び印刷用データ生成方法 |
JP2006264041A (ja) | 2005-03-23 | 2006-10-05 | Brother Ind Ltd | インクジェットヘッドの検査方法 |
US7616340B2 (en) | 2005-03-25 | 2009-11-10 | Fujifilm Corporation | Image processing method and apparatus, threshold value matrix creating method, image forming apparatus, sub-matrix creating method and program |
KR101047836B1 (ko) | 2005-04-25 | 2011-07-08 | 가부시키가이샤 아루박 | 인테그럴 프린트헤드 어셈블리 |
JP4905998B2 (ja) | 2005-04-25 | 2012-03-28 | 株式会社アルバック | 液滴分析システム |
US7249829B2 (en) | 2005-05-17 | 2007-07-31 | Eastman Kodak Company | High speed, high quality liquid pattern deposition apparatus |
AU2005202167B2 (en) * | 2005-05-19 | 2010-12-16 | Canon Kabushiki Kaisha | Method of forming structures using drop-on-demand printing |
JP4845429B2 (ja) | 2005-06-23 | 2011-12-28 | キヤノン株式会社 | インクジェット記録装置 |
WO2007008686A2 (en) * | 2005-07-09 | 2007-01-18 | Deschryver Michelle E | Electronic savings transfers |
EP1752213A1 (en) | 2005-08-12 | 2007-02-14 | Samsung Electronics Co., Ltd. | Device for printing droplet or ink on substrate or paper |
US20070076040A1 (en) | 2005-09-29 | 2007-04-05 | Applied Materials, Inc. | Methods and apparatus for inkjet nozzle calibration |
JP4916697B2 (ja) | 2005-10-18 | 2012-04-18 | 株式会社アルバック | インク塗布装置、吐出ノズルの検査方法及びインクの塗布方法 |
JP2007117833A (ja) | 2005-10-26 | 2007-05-17 | Seiko Epson Corp | 薄膜形成方法及び薄膜形成装置 |
JP2007152340A (ja) | 2005-11-11 | 2007-06-21 | Seiko Epson Corp | 吐出量測定方法、パターン形成方法、デバイス、電気光学装置、電子機器 |
JP4635842B2 (ja) | 2005-11-16 | 2011-02-23 | セイコーエプソン株式会社 | 吐出パターンデータ補正方法、吐出パターンデータ補正装置、液滴吐出装置、並びに電気光学装置の製造方法 |
WO2007063459A1 (en) | 2005-11-29 | 2007-06-07 | Koninklijke Philips Electronics N.V. | Ink jet device and method for producing a biological assay substrate by releasing a plurality of substances onto the substrate |
US8173995B2 (en) * | 2005-12-23 | 2012-05-08 | E. I. Du Pont De Nemours And Company | Electronic device including an organic active layer and process for forming the electronic device |
TWI287828B (en) | 2005-12-30 | 2007-10-01 | Ind Tech Res Inst | Method for printing a pattern and data processing method thereof |
US20070299725A1 (en) | 2006-02-09 | 2007-12-27 | Boyer William J | Airline membership program |
KR20070082386A (ko) * | 2006-02-16 | 2007-08-21 | 삼성전자주식회사 | 잉크젯 헤드의 노즐들로부터 토출되는 잉크 액적들의 양을균일하게 하기 위한 잉크 액적들의 정규화 방법 |
KR20070084890A (ko) | 2006-02-22 | 2007-08-27 | 삼성전자주식회사 | 잉크젯 헤드의 잉크 토출 특성 조절 방법 |
JP5038763B2 (ja) * | 2006-04-04 | 2012-10-03 | 株式会社リコー | インクジェット記録装置と画像処理方法、画像処理制御プログラムと記録媒体および高浸透性顔料インク |
JP2007299725A (ja) | 2006-04-07 | 2007-11-15 | Sekisui Chem Co Ltd | 有機エレクトロルミネッセンス素子 |
JP2007315976A (ja) | 2006-05-26 | 2007-12-06 | Japan Aerospace Exploration Agency | 微小液滴・気泡・粒子の位置・粒径・速度測定の方法と装置 |
US7347530B2 (en) | 2006-06-22 | 2008-03-25 | Orbotech Ltd | Inkjet printing of color filters |
JP5066846B2 (ja) * | 2006-06-23 | 2012-11-07 | 凸版印刷株式会社 | 有機トランジスタおよびその製造方法 |
US20080024532A1 (en) | 2006-07-26 | 2008-01-31 | Si-Kyoung Kim | Methods and apparatus for inkjet printing system maintenance |
US7564564B2 (en) | 2006-08-22 | 2009-07-21 | Artium Technologies, Inc. | Automatic set-up for instrument functions |
JP2008073647A (ja) * | 2006-09-22 | 2008-04-03 | Fujifilm Corp | 液体吐出装置及びレジストパターン形成方法 |
PL1911594T3 (pl) * | 2006-10-12 | 2013-10-31 | Agfa Graphics Nv | Sposób działania głowicy drukującej do drukowania atramentowego |
JP2008123993A (ja) | 2006-10-19 | 2008-05-29 | Sharp Corp | 液滴塗布装置および液滴塗布方法 |
PL2082619T3 (pl) | 2006-11-06 | 2023-03-13 | Agency For Science, Technology And Research | Nanocząstkowy enkapsulujący stos barierowy |
GB0622784D0 (en) | 2006-11-15 | 2006-12-27 | Cambridge Display Technology O | Droplet volume control |
US20100066779A1 (en) | 2006-11-28 | 2010-03-18 | Hanan Gothait | Method and system for nozzle compensation in non-contact material deposition |
WO2008072309A1 (ja) | 2006-12-12 | 2008-06-19 | Hitachi, Ltd. | プラズマディスプレイパネルおよびそれを用いたプラズマディスプレイ装置 |
EP1933393A1 (en) * | 2006-12-13 | 2008-06-18 | Samsung SDI Co., Ltd. | Method of manufacturing a substrate for an electronic device |
JP4289391B2 (ja) | 2006-12-20 | 2009-07-01 | セイコーエプソン株式会社 | 液状体の描画方法、カラーフィルタの製造方法、有機el素子の製造方法 |
KR20080057584A (ko) | 2006-12-20 | 2008-06-25 | 삼성에스디아이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
US8079656B2 (en) | 2006-12-22 | 2011-12-20 | Palo Alto Research Center Incorporated | Method for decimation of images |
KR101610885B1 (ko) | 2007-01-17 | 2016-04-08 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 프린팅기반 어셈블리에 의해 제조되는 광학 시스템 |
WO2008089449A2 (en) | 2007-01-19 | 2008-07-24 | Biodot, Inc. | Systems and methods for high speed array printing and hybridization |
KR20090113858A (ko) | 2007-01-31 | 2009-11-02 | 후지필름 디마틱스, 인크. | 설정 가능한 메모리를 가진 인쇄기 |
JP4840186B2 (ja) | 2007-02-19 | 2011-12-21 | セイコーエプソン株式会社 | チャンバ装置 |
JP4442620B2 (ja) | 2007-02-26 | 2010-03-31 | セイコーエプソン株式会社 | 着弾ドット測定方法および着弾ドット測定装置、並びに液滴吐出装置および電気光学装置の製造方法 |
JP4967741B2 (ja) | 2007-03-23 | 2012-07-04 | セイコーエプソン株式会社 | 液滴吐出装置および電気光学装置の製造方法 |
US7648220B2 (en) | 2007-04-23 | 2010-01-19 | Hewlett-Packard Development Company, L.P. | Sensing of fluid ejected by drop-on-demand nozzles |
KR100878763B1 (ko) | 2007-05-09 | 2009-01-14 | 삼성전자주식회사 | 잉크 방울의 체적 측정 방법 및 이를 이용한 잉크젯 헤드의노즐 제어 방법 |
US8404160B2 (en) | 2007-05-18 | 2013-03-26 | Applied Nanotech Holdings, Inc. | Metallic ink |
KR100875986B1 (ko) * | 2007-05-22 | 2008-12-26 | 위아무역주식회사 | 잉크 젯 헤드를 이용한 균일한 두께의 박막 형성방법 |
JP2008296547A (ja) * | 2007-06-04 | 2008-12-11 | Toppan Printing Co Ltd | 凸版印刷装置 |
EP2155493A4 (en) | 2007-06-14 | 2010-08-11 | Massachusetts Inst Technology | METHOD AND DEVICE FOR APPLYING FILMS |
JP5266671B2 (ja) | 2007-06-21 | 2013-08-21 | セイコーエプソン株式会社 | 液状体の吐出方法、有機el素子の製造方法、カラーフィルタの製造方法 |
FI121061B (fi) | 2007-07-04 | 2010-06-30 | Reate Oy | Menetelmä optisen kappaleen valmistamiseksi ja laitteisto |
JP2009025765A (ja) * | 2007-07-24 | 2009-02-05 | Seiko Epson Corp | 液状体の吐出方法、カラーフィルタの製造方法、有機el素子の製造方法 |
KR101443216B1 (ko) * | 2007-09-05 | 2014-09-24 | 삼성전자주식회사 | 광 반응성 재료를 이용한 유기발광소자 및 그 제조 방법 |
CN101391524B (zh) | 2007-09-17 | 2012-01-18 | 财团法人工业技术研究院 | 喷墨装置以及校正方法 |
JP2009072973A (ja) | 2007-09-19 | 2009-04-09 | Seiko Epson Corp | 液体吐出装置、その制御方法及びそのプログラム |
JP5277604B2 (ja) | 2007-10-15 | 2013-08-28 | セイコーエプソン株式会社 | 液体噴射ムラの抑制 |
US8057005B2 (en) | 2007-10-15 | 2011-11-15 | Xerox Corporation | Drop mass calibration method based on drop positional feedback |
JP5211649B2 (ja) | 2007-11-06 | 2013-06-12 | セイコーエプソン株式会社 | 吐出ヘッドの駆動方法、液状体の吐出方法、有機el素子の製造方法 |
JP4888346B2 (ja) * | 2007-11-06 | 2012-02-29 | セイコーエプソン株式会社 | 液状体の塗布方法、有機el素子の製造方法 |
US20090184990A1 (en) | 2007-12-06 | 2009-07-23 | Applied Materials, Inc. | Methods and apparatus for measuring deposited ink in pixel wells on a substrate using a line scan camera |
CN101945965A (zh) | 2007-12-28 | 2011-01-12 | 3M创新有限公司 | 柔性封装膜系统 |
CN101222026B (zh) * | 2008-01-23 | 2016-06-01 | 京东方科技集团股份有限公司 | 有机发光二极管显示装置及其制造方法 |
JP2009178627A (ja) * | 2008-01-29 | 2009-08-13 | Seiko Epson Corp | 薄膜形成方法、カラーフィルタの製造方法 |
US20090197013A1 (en) | 2008-02-04 | 2009-08-06 | Ffei Limited | Producing a flexographic printing plate |
JP4905380B2 (ja) | 2008-02-08 | 2012-03-28 | セイコーエプソン株式会社 | 駆動信号設定方法 |
JP2009189954A (ja) | 2008-02-14 | 2009-08-27 | Seiko Epson Corp | 駆動信号設定方法 |
JP4609510B2 (ja) * | 2008-03-25 | 2011-01-12 | ブラザー工業株式会社 | インクジェットプリンタ |
JP5115281B2 (ja) | 2008-04-01 | 2013-01-09 | セイコーエプソン株式会社 | 液滴吐出装置、液状体の吐出方法、カラーフィルタの製造方法、有機el装置の製造方法 |
US8449058B2 (en) | 2008-05-23 | 2013-05-28 | Fujifilm Dimatix, Inc. | Method and apparatus to provide variable drop size ejection with low tail mass drops |
US8025353B2 (en) | 2008-05-23 | 2011-09-27 | Fujifilm Dimatix, Inc. | Process and apparatus to provide variable drop size ejection with an embedded waveform |
CN201205534Y (zh) | 2008-06-02 | 2009-03-11 | 宗茂企业有限公司 | 电动喷枪快拆装置 |
JP2009291710A (ja) | 2008-06-05 | 2009-12-17 | Hitachi High-Technologies Corp | 液体散布装置、フラットパネルディスプレイの製造装置、フラットパネルディスプレイ、太陽電池パネルの製造装置、太陽電池パネル、液体散布方法およびプログラム |
US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
TW201016474A (en) * | 2008-06-24 | 2010-05-01 | Xjet Ltd | Method and system for non-contact materials deposition |
JP2010005593A (ja) | 2008-06-30 | 2010-01-14 | Duplo Seiko Corp | 可視媒体の表面加工方法及び表面加工装置 |
WO2010004865A1 (ja) | 2008-07-10 | 2010-01-14 | 富士電機ホールディングス株式会社 | 有機elディスプレイおよびその製造方法 |
US8419145B2 (en) | 2008-07-25 | 2013-04-16 | Eastman Kodak Company | Inkjet printhead and method of printing with multiple drop volumes |
WO2010014061A1 (en) | 2008-07-30 | 2010-02-04 | Hewlett-Packard Development Company, L.P. | Method of dispensing liquid |
JP4582225B2 (ja) * | 2008-08-15 | 2010-11-17 | ソニー株式会社 | 液体吐出装置及び液体吐出方法 |
JP5274154B2 (ja) | 2008-08-22 | 2013-08-28 | 株式会社ミマキエンジニアリング | プリンタ装置 |
GB2463493B (en) * | 2008-09-15 | 2012-11-14 | Cambridge Display Tech Ltd | An improved method for ink jet printing organic electronic devices |
JP5192335B2 (ja) | 2008-09-26 | 2013-05-08 | 富士フイルム株式会社 | インクジェット記録装置及び色補正方法 |
JP2009093189A (ja) | 2008-11-17 | 2009-04-30 | Seiko Epson Corp | 表示装置の製造方法 |
EP2373590B1 (en) | 2008-11-30 | 2013-08-21 | Xjet Ltd. | Method and system for applying materials on a substrate |
US20120056923A1 (en) | 2009-01-05 | 2012-03-08 | Kateeva, Inc. | Control systems and methods for thermal-jet printing |
US20100188457A1 (en) * | 2009-01-05 | 2010-07-29 | Madigan Connor F | Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle |
US20100184244A1 (en) | 2009-01-20 | 2010-07-22 | SunPrint, Inc. | Systems and methods for depositing patterned materials for solar panel production |
WO2010090080A1 (ja) | 2009-02-04 | 2010-08-12 | セーレン株式会社 | インクジェットヘッドの吐出状態検査方法およびインクジェットヘッドの吐出状態検査装置 |
JP2010204189A (ja) | 2009-02-27 | 2010-09-16 | Dainippon Printing Co Ltd | カラーフィルタの製造方法、表示装置の製造方法、および、塗布方法 |
JP2010201749A (ja) | 2009-03-03 | 2010-09-16 | Seiko Epson Corp | 液体吐出装置、及び、液体吐出装置の制御方法 |
US20100231672A1 (en) | 2009-03-12 | 2010-09-16 | Margaret Joyce | Method of improving the electrical conductivity of a conductive ink trace pattern and system therefor |
JP5129771B2 (ja) * | 2009-03-19 | 2013-01-30 | 大日本スクリーン製造株式会社 | インクジェットプリンタおよびインクジェット方式の印刷方法 |
JP5106687B2 (ja) * | 2009-03-25 | 2012-12-26 | キヤノン株式会社 | 色分解テーブルの作成方法およびその装置、並びに、画像形成装置 |
JP2010227762A (ja) | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 液滴吐出装置、薄膜形成方法 |
CN101533894B (zh) * | 2009-04-15 | 2011-01-05 | 河北大学 | 喷墨打印活性层的柔性聚合物太阳能电池制备方法 |
JP4897070B2 (ja) | 2009-06-08 | 2012-03-14 | パナソニック株式会社 | 機能膜製造方法 |
JP5468828B2 (ja) * | 2009-06-26 | 2014-04-09 | 北越紀州製紙株式会社 | インクジェット記録用光沢紙 |
JP2011005453A (ja) | 2009-06-29 | 2011-01-13 | Nagoya Oil Chem Co Ltd | マスキング材およびマスキング材原シート |
JP2013504462A (ja) * | 2009-09-15 | 2013-02-07 | トーンジェット リミテッド | 印刷方法および液体インクジェットインク |
JP5721992B2 (ja) | 2009-10-14 | 2015-05-20 | 富士フイルム株式会社 | 着色硬化性組成物、レジスト液、インクジェット用インク、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子、液晶ディスプレイ、有機elディスプレイ、画像表示デバイス、及び色素化合物 |
WO2011056872A2 (en) | 2009-11-03 | 2011-05-12 | Gen9, Inc. | Methods and microfluidic devices for the manipulation of droplets in high fidelity polynucleotide assembly |
KR20110065098A (ko) | 2009-12-09 | 2011-06-15 | 삼성전자주식회사 | 잉크젯 프린팅 장치의 잉크토출특성조절방법 및 구동방법 |
JP5182280B2 (ja) * | 2009-12-25 | 2013-04-17 | セイコーエプソン株式会社 | 吐出パターンデータ補正方法 |
JP4968324B2 (ja) * | 2009-12-29 | 2012-07-04 | ブラザー工業株式会社 | 媒体搬送装置及び記録装置 |
JP5234027B2 (ja) * | 2010-02-19 | 2013-07-10 | ブラザー工業株式会社 | 液滴吐出装置 |
JP4818472B2 (ja) | 2010-03-18 | 2011-11-16 | キヤノン株式会社 | 画像形成装置 |
JP5586299B2 (ja) | 2010-03-31 | 2014-09-10 | 東レエンジニアリング株式会社 | インクジェット塗布装置 |
JP2011216268A (ja) * | 2010-03-31 | 2011-10-27 | Toppan Printing Co Ltd | 有機el素子基板の製造方法 |
JP5062339B2 (ja) | 2010-05-12 | 2012-10-31 | パナソニック株式会社 | インクジェット装置 |
JP2012015324A (ja) | 2010-06-30 | 2012-01-19 | Fujifilm Corp | 液体塗布装置及び液体塗布方法並びにナノインプリントシステム |
JP4677050B1 (ja) | 2010-07-20 | 2011-04-27 | スタータック株式会社 | 被膜形成方法及びその方法により形成される複合材 |
JP5791242B2 (ja) * | 2010-07-21 | 2015-10-07 | キヤノン株式会社 | インクジェット記録装置、インクジェット記録方法及びインクジェット記録ヘッド |
CN101950771A (zh) * | 2010-07-27 | 2011-01-19 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种复合电极的制备方法 |
GB2483635A (en) | 2010-09-08 | 2012-03-21 | Cambridge Display Tech Ltd | Printing Apparatus involving beat patterns |
JP2012061789A (ja) | 2010-09-17 | 2012-03-29 | Seiko Epson Corp | 記録装置 |
US8608272B2 (en) * | 2010-12-03 | 2013-12-17 | Xerox Corporation | System and method for inkjet printing with a differential halftoned protective overcoat with gloss compensation |
JP2012139655A (ja) | 2011-01-05 | 2012-07-26 | Seiko Epson Corp | 印刷装置 |
EP2474404B1 (en) | 2011-01-06 | 2014-12-03 | LUXeXcel Holding B.V. | Print head, upgrade kit for a conventional inkjet printer, printer and method for printing optical structures |
JP2012160858A (ja) * | 2011-01-31 | 2012-08-23 | Canon Inc | 画像形成装置 |
JP5663342B2 (ja) | 2011-02-21 | 2015-02-04 | 東レエンジニアリング株式会社 | 塗布方法および塗布装置 |
JP2012213951A (ja) | 2011-04-01 | 2012-11-08 | Seiko Epson Corp | 液滴噴射装置及び液滴噴射方法 |
JP2012218233A (ja) | 2011-04-06 | 2012-11-12 | Seiko Epson Corp | 液体噴射装置およびその制御方法 |
US8579408B2 (en) | 2011-04-29 | 2013-11-12 | Xerox Corporation | System and method for measuring fluid drop mass with reference to test pattern image data |
KR101215021B1 (ko) | 2011-04-29 | 2012-12-24 | 인텔렉추얼디스커버리 주식회사 | 메모리성 디스플레이 장치 및 그 구동 방법 |
KR20120132360A (ko) | 2011-05-26 | 2012-12-05 | 세이코 엡슨 가부시키가이샤 | 액적 토출 장치 |
JP5845633B2 (ja) | 2011-05-26 | 2016-01-20 | セイコーエプソン株式会社 | 液滴吐出装置 |
CN103026789B (zh) * | 2011-06-03 | 2016-01-13 | 株式会社日本有机雷特显示器 | 有机el显示面板的制造方法以及有机el显示面板的制造装置 |
US8466484B2 (en) | 2011-06-21 | 2013-06-18 | Kateeva, Inc. | Materials and methods for organic light-emitting device microcavity |
US20130004653A1 (en) * | 2011-06-30 | 2013-01-03 | Shenzhen China Star Optoelectronics Technology Co.,Ltd. | Alignment Film Coating Method and Alignment Film Coating Apparatus |
JP2013030571A (ja) | 2011-07-27 | 2013-02-07 | Sumitomo Heavy Ind Ltd | 液滴吐出装置及び液滴吐出方法 |
KR101863853B1 (ko) | 2011-07-29 | 2018-06-04 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 및 그 제조방법 |
CN103733725A (zh) * | 2011-08-04 | 2014-04-16 | 3M创新有限公司 | 阻隔组件 |
CN106113943B (zh) | 2011-08-09 | 2018-03-30 | 科迪华公司 | 面向下的打印设备和方法 |
KR101878173B1 (ko) * | 2011-08-22 | 2018-08-17 | 엘지디스플레이 주식회사 | 기판 증착장치 |
JP5909935B2 (ja) * | 2011-09-05 | 2016-04-27 | 株式会社リコー | 画像処理方法、画像処理プログラム及び情報処理装置 |
US8777394B2 (en) * | 2011-09-27 | 2014-07-15 | Eastman Kodak Company | Inkjet printing using large particles |
US8597983B2 (en) * | 2011-11-18 | 2013-12-03 | Freescale Semiconductor, Inc. | Semiconductor device packaging having substrate with pre-encapsulation through via formation |
CN104136223B (zh) * | 2011-12-14 | 2016-08-24 | 惠普工业印刷有限公司 | 打印双面图像以及生成用于打印双面图像的打印机控制数据 |
WO2013099276A1 (ja) | 2011-12-28 | 2013-07-04 | パナソニック株式会社 | 有機el表示パネルとその製造方法 |
US8668307B2 (en) | 2012-02-21 | 2014-03-11 | Dip-Tech Ltd | Printing system |
JP5646592B2 (ja) | 2012-02-24 | 2014-12-24 | 富士フイルム株式会社 | 画像形成方法 |
JP6102321B2 (ja) | 2012-03-01 | 2017-03-29 | 株式会社リコー | 撮像ユニット、測色装置、画像形成装置、測色システムおよび測色方法 |
JP2013225671A (ja) | 2012-03-22 | 2013-10-31 | Ricoh Co Ltd | 薄膜製造装置、電気−機械変換素子、液体吐出ヘッド、画像形成装置および薄膜製造方法 |
JP5962321B2 (ja) | 2012-08-10 | 2016-08-03 | 株式会社リコー | 液滴吐出装置およびこれを用いたインクジェット記録装置 |
JP2014042995A (ja) | 2012-08-24 | 2014-03-13 | Seiko Epson Corp | 液体噴射装置、および、液体噴射装置の制御方法 |
JP6132511B2 (ja) | 2012-10-23 | 2017-05-24 | キヤノン株式会社 | 記録装置および記録位置ずれの補正方法 |
KR101980234B1 (ko) * | 2012-10-30 | 2019-05-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치와, 이의 제조 방법 |
KR101990321B1 (ko) * | 2012-12-04 | 2019-06-18 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
US20140165864A1 (en) | 2012-12-13 | 2014-06-19 | Melissa Oppenheim | System and method of generating printed media |
US9832428B2 (en) | 2012-12-27 | 2017-11-28 | Kateeva, Inc. | Fast measurement of droplet parameters in industrial printing system |
KR20230106718A (ko) | 2012-12-27 | 2023-07-13 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피제어를 위한 기법 |
US11141752B2 (en) | 2012-12-27 | 2021-10-12 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US9352561B2 (en) | 2012-12-27 | 2016-05-31 | Kateeva, Inc. | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances |
US9700908B2 (en) * | 2012-12-27 | 2017-07-11 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
JP6208771B2 (ja) | 2013-01-23 | 2017-10-04 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | プリントヘッドのテスト |
US9139024B2 (en) | 2013-01-31 | 2015-09-22 | Hewlett-Packard Development Company, L.P. | Sensor positioning system |
CN105431148A (zh) | 2013-03-07 | 2016-03-23 | 加利菲亚生物公司 | 混合谱系激酶抑制剂及治疗方法 |
JP6659532B2 (ja) | 2013-04-26 | 2020-03-04 | カティーバ, インコーポレイテッド | 印刷インク液滴測定および精密な公差内で流体を堆積する制御のための技法 |
CN103241025B (zh) * | 2013-04-28 | 2015-02-04 | 京东方科技集团股份有限公司 | 一种有机薄膜的喷墨打印方法 |
KR102541161B1 (ko) | 2013-12-12 | 2023-06-08 | 카티바, 인크. | 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조 |
CN103760920B (zh) | 2014-01-23 | 2017-01-18 | 宏泰集团(厦门)有限公司 | 智能声场控制系统 |
JP2015194530A (ja) | 2014-03-31 | 2015-11-05 | セイコーエプソン株式会社 | 光電変換素子の位置合わせ方法、および、液体噴射装置 |
KR102176314B1 (ko) | 2014-06-26 | 2020-11-10 | 에그트로닉 엔지니어링 에스.알.엘. | 전력을 전송하기 위한 방법 및 기기 |
WO2016011296A1 (en) | 2014-07-18 | 2016-01-21 | Kateeva, Inc. | Gas enclosure systems and methods utilizing cross-flow gas circulation and filtration |
US10144816B2 (en) | 2014-07-28 | 2018-12-04 | Denka Company Limited | Spherical alumina powder and resin composition using same |
WO2016036646A1 (en) | 2014-09-02 | 2016-03-10 | Kateeva, Inc. | Fast measurement of droplet parameters in industrial printing system |
EP3429862B1 (en) | 2016-03-14 | 2022-11-02 | Board of Regents, The University of Texas System | Systems and methods for precision inkjet printing |
US9961783B2 (en) | 2016-07-08 | 2018-05-01 | Kateeva, Inc. | Guided transport path correction |
JP6579140B2 (ja) | 2017-03-23 | 2019-09-25 | 日本電気株式会社 | 変換装置、ホスト装置、入出力スイッチシステム、情報処理システム、方法およびプログラム |
US10410100B1 (en) * | 2017-11-14 | 2019-09-10 | Landa Corporation Ltd. | AM Screening |
CN111373843A (zh) * | 2017-11-28 | 2020-07-03 | 堺显示器制品株式会社 | 有机el发光元件及其制造方法 |
CN111357393A (zh) * | 2017-11-28 | 2020-06-30 | 堺显示器制品株式会社 | 有机el发光元件及其制造方法 |
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