TWI271904B - High-speed, precision, laser-based method and system - Google Patents
High-speed, precision, laser-based method and system Download PDFInfo
- Publication number
- TWI271904B TWI271904B TW091106212A TW91106212A TWI271904B TW I271904 B TWI271904 B TW I271904B TW 091106212 A TW091106212 A TW 091106212A TW 91106212 A TW91106212 A TW 91106212A TW I271904 B TWI271904 B TW I271904B
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- laser beam
- modified
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- orientation
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Classifications
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
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- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Description
1271904 五、發明説明(1 ) 發明背 1. 發明igi 本I月係有關於雷射材料處理方法及系統之領域,更 ㈣言之’係有關於處理半導體晶圓、電子基材及進行雷 射被加工的工件之掃描式雷射處理方法及系統。 2. 背景 傳、洗上,對於大多數精密掃描雷射處理應用係已經採 =圓形點區。譬如Nd: YAG雷射等許多雷射源係產生圓形 Γ7斯束圓形向斯束在成像通過習知的球面光學裝置時將 產生圓形點區。這些點區係掃描過目標部位以處理材料, 且所產生的雷射材料交互作用將移除或以其他方式改變目 標的材料。許多雷射處理應用中,系統的產出率係受限於·· +均功率、基材的光子通量損害臨界值,並在脈衝式系統 中亦受限於:雷射q率、及雷射脈衝特徵。 ’不範性彳政加工操作係包括:冗餘記憶電路的鏈接件吹 製田射铋整、及電路製造。對於譬如將次微米寬度的熔 線吹製在一記憶元件上之處理應用,需要以最小的側向與 基材損害將能量有效率地耦合至一狹窄的熔線,大圓形點 區可月b ie成如第1 9a圖所示之不良的相鄰鏈接件損害。較小 的點區雖然可以處理更細微的熔線,但如第19b圖所示,隨 著減小的點區尺寸之較高光子通量將會使得基材損害的潛 在危險增大。當微加工由一系列小雷射點區製成的一線 時’點區重豐或稱為“咬合尺寸(bite size),,以及q率係為決 定最大掃描速度之兩項處理特徵。當不適合採用較大點區 穿声紙張尺度適用中國國家標準(CNS) M規格(21〇χ297公釐) 1271904 A7 、發明説明(2 ) "" "~' @峰值光子通里日t,需要較寬縫寬的雷射修整應用係可能 ❿要多次通過一小點區。在加工大型導線計數元件上的細 丨間距導線之導線架製造領域中,係使用如美國專利 5,632,083號所描述之_旋轉的長形點區。 偏離圓形的點區係時常視為令處理品質受限之系統 瑕症,在雷射光學裝置的領域中已多方致力改良束品質、 I來自二極體雷射的束變圓、及設計與實行衍射限制式系 、统之高鏞正光學裝置。束形補償所用之向量衍射效應係描 述於美國專利4,397,527號中。 已知許多種將束定型及將點區定型之技術,其中一種 I法係肖圓形束—起使用_相位板來修改點區形狀,藉 以如第2G圖上部所示用以處理記憶體熔線,這亦揭露於寇 丁里(Cordmgley)的美國專利5,3〇〇,756號中,使用此簡單型 才目位板的主要效果係為生成如第2 〇圖下部所示之一高帽狀 勿佈輪廓,但其中亦描述生成一橢圓形點區之技術。 美國專利6,341,029號係描述使用一具有顫動的歪像 點區來將一雷射束強度輪廓加以定型,歪像點區可使得較 尖銳的線緣具有一變窄的點區寬度,同時一增大的點區長 度係保持所需要的總功率而不超過每單位基材面積的整體 功率之處理極限。 費坎晋(Veldkamp)的美國專利七41〇,237號係描述一] 種用於將一圓形南斯束轉變為長形平頂狀輪廓之衍射格柵 及稜鏡方法。 迪奇(Dickey)的美國專利5,864,43〇號係描述一種以相 ㉞紙張尺度適用中國國家標準_) M規格⑵〇><297公董} ----
(請先閲讀背面之注意事項再填寫本頁) 1271904 五、發明説明(3 ) 位為基礎將一圓形高斯束轉變為一平頂、正方形或長方形 點區之方法。 另一種技術係生成一陣列的點區,譬如詹姆士(以❿以) 的美國專利5,463,200號所揭露。 另一種熟知的技術係為成像孔徑屏罩。 切趾法(apodization)係為另一種簡單之修改束形及點 區形狀的技術。 拜德(Baird)等人經公告的專利申請案 US2002/0005390 A1號係揭露一種UV#射系統,其中提供 一光學裝置模組以增強雷射束的形狀品質。 孫(Sun)等人之美國專利5,265,114號係描述一種選擇 性雷射處理一多材料多層裝置的一或多種材料之一目標結 構之方法及系統。 孫(Sun)等人之美國專利6,〇57,18〇號係描述一種以紫 外線雷射輸出來切斷導電鍵接件之方法。 發明概沭 本發明至少一項實施例之一目的係為將一經修改的 雷射束順序性及相對式定位在至少一點區中,此至少一點 區係對於多種不同微加工應用之一領域中的一或多個目標 之雷射材料處理具有可調整的尺寸比。 本發明至少一項實施例之一目的係為矯正由系統引 發的點區不均勾性,藉以生成精密的圓形點區或譬如橢圓 形點區等長形點區。 為了貫施本發明之上述目的及其他目的,揭露一種用 (請先閲讀背面之注意事項再填寫本頁) tr·
1271904 A7 B7 五、發明説明(4 於加工位於-領域内至少—目標的材料之高速度、精密度 及以雷射為基礎之方法。此方法係包含沿著—傳播路^ 生-雷射束’以及可控制式修改雷射束以獲得一經修改的 雷射束。此方法亦包括將經修改的雷射束順序性及相對性 定位在在領域内各目標處之至少—點區中以處理各目標材 料’其中至少-點區具有一組所需要的空間性特徵,包括 藉由可控制式修改的步驟所獲得之一可調式尺寸比。 並且,為了進行本發明的上述目的及其他目的,揭露 一種用於處理在一領域内具有預定尺寸及一特徵之至少一 目標的材料之高速度、精密度系統。此线係包括―雷射 源,此雷射源係用於沿著一傳播路徑產生一具有一輻照圖 型的雷射束,此輻照圖型係在一與傳播路徑大致垂直的平 ®t具有1寸tb及H -控制器係產生控制訊號, 控制訊號係包括基於此特徵之定向控制訊號。一第一子系 統係配置於傳播路徑以依據預定尺寸將雷射束定型,藉以 改變尺寸比並獲得一經修改的束。—第二子系統係依據定 向控制訊號可控制式地改變輻照圖型的定向。一束輸送及 來焦子系統係將經修改的束順序性定位及聚焦在各目標上 的至少一點區中’藉以處理各目標的材料。 並且’為了貫施本發明的上述目的及其他目的,揭露 一種用於處理位於一領域内至少一目標的材料之高速度、 冰月後度及以雷射為基礎之方法,此方法包括以下步驟:a) 沿著一傳播路徑產生一雷射束;b)可控制式修改雷射束以 獲得一經修改的雷射束;c)在領域内的一目標處將經修改 .爵本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂| _费| 1271904
的雷射束相對定位在至少— ;&甲猎以處理目標的材 广,,、中至少一點區係具有一組所需要的空間性特徵,其 中包括自㈣e)獲得之—可調式尺寸比;及d)對於各目標 重後步驟a)至e) ’直到位於領域内所有目標的材料均 處理為止。 為了貫施本發明的上述目的及其他目的,提供一種處 理至少一微結構之方法,此至少一結構係為一包含複數個 微結構之多材料元件的一部份’此至少一微結構係具有用 於移除目標材料之-指定區域。此方法包括:產生_雷射 束,修改雷射束以獲得-經修改的雷射束,及將經修:的 雷射束順序性與相對性定位在指定區域上之至少一非圓 點區中’此至少—非圓形點區具有-預定的非圓形能量 佈,藉以移除指定區域中的目標材料。預定的非圓形能 刀佈係覆1指定區域的一面積,所以相較於一覆蓋相同 積的圓形能量分佈所耦合入指定區域中之能量,非圓形 蓋为佈係將能量更有效率地耦合入指定區域中。 並且’為了實施本發明的上述目的及其他目的,提供 一種處理至少一微結構之系統,此至少一微結構係為一包 含複數個微結構之多材料元件的一部份,此至少一微結構 係具有用於移除目標材料之一指定區域。此系統包括:用 於產生一雷射束之構件,及用於修改雷射束以獲得一經修 改的雷射束之構件。此系統亦包含將經修改的雷射束順序 性與相對性定位在指定區域上之至少一非圓形點區中, 至乂 非圓形點區具有一預定的非圓形能量分佈,藉以 形 分 量 面 能 此 移 (請先閲讀背面之注意事項再填寫本頁) 訂· 费, 纖本紙張尺度適用中國國家標準(_ M規格⑵㈣97公董〉 1271904 A7 B7 五、發明説明(6 除指定區域中的目標材料。預定的非圓形能量分佈係覆蓋 指定區域的一面積,所以相較於一覆蓋相同面積的圓形能 置分佈所耦合入指定區域中之能量,非圓形能量分佈係將 能量更有效率地輕合入指定區域中。 由下文對於本發明最佳實施模式的詳細描述並參照 圖式’更易於瞭解本發明之上述目的及其他目的、特性及 優點。 圖式簡單說1 第1圖為兩對本發明的30-60-60稜鏡歪像束放大器以 及一通過的雷射束之側視圖; 第2圖為兩對的未偏移放大器以及通過的雷射束之立 體圖; 第3圖為一對的未偏移稜鏡以及一通過的雷射束之側 視圖; 第4圖為另一對的未偏移稜鏡以及一通過的雷射束之 側視圖; 第5圖為未轉向稜鏡對以及一通過的雷射束之側視 圖; 第6圖為具有道威(Dove)棱鏡旋轉器之一歪像稜鏡對 的側視示意圖; 第7圖為美國專利4,58〇,879號的一對稜鏡對之側視示 意圖; 第8圖為美國專利6,219,169號的一對稜鏡對之側視示 意圖; 搬本紙張尺度適用中國國家檩準(CNS) M規格⑵0X297公爱) (請先閲讀背面之注意事項#'填寫本頁) -訂| !27l9〇4
、發明説明( 第9圖為美國專利4,948,233號的一對稜鏡對之側視示 思、圖; 第l〇a及l〇b圖分別為一具有對準補償用的相交圓柱之 二元件式球型-圓柱型放大器之俯視及側視示意圖; 第11圖顯示隨著本發明第二放大器旋轉經過一相交的 空值位置(null position)之具有接近正交軸線的束輻照輪 廓; 第12a及12b圖顯示利用本發明的方法及系統將一系列 圓形點區轉變成一對應系列的橢圓形點區; 第13a至13c圖顯示三系列的橢圓形點區,第13a圖13a 為具有一圓角的目標所使用之第一系列;第13b圖為具有一 整齊角落的目標所使用之第二系列;第13c圖則可供藉由在 目標材料中加工一連串的平行線時所使用; 第14圖為一種用於本發明的目標材料處理之系統的 第一實施例之方塊圖; 第15為此系統的第二實施例之方塊圖; 第16圖為一正方形點區的繪圖; 第1圖為一具有非線性旋轉及對稱性之經修改的正 方形點區所製成之一長方形點區的繪圖; 第18圖為利用一放大器的第三實施例對於來自一經 修改的正方形點區之一改良式長方形點區之繪圖,其中顯 示具有光學補償的點區定型; 第19a圖為將造成相鄰鏈接件損害之一大雷射點區的 俯視示意圖,並連帶顯示其強度輪廓的一對應剖面; 10 (請先閲讀背面之注意事項再填寫本頁) 2.Q.3本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 1271904 五、發明説明(8 ) 第19b圖為將造成基材變化之一小雷射點區的俯視示 意圖’並連帶顯示其強度輪摩的一對應剖面; 第19c圖為將盡量減少損害之一對準的橢圓形點區的 俯視不意圖,並連帶顯示其強度輪廓的一對應剖面; 第19d圖為一不對準的橢圓形點區的俯視示意圖,並 連帶顯示其強度輪廓的一對應剖面; 第20圖為一習知技藝相位板的側視圖,圖中上方為一 輸入高斯脈衝,下方為一高帽輸出脈衝; 第21圖為相對光子通量vs.點區以微米為單位的一半 f度之複數個圖式藉以顯示基材光子通量(基材上的能量 在度),基材光子通量係為各種點區在鏈接件與點區之間的 不對準之一函數; 第22圖為本發明的一切換式系統的示意圖,其中對於 一雷射束提供兩個不同的光學路徑; 第23圖為顯示本發明的方法之流程方塊圖;及 第24a至24d圖為可利用本發明所鑽製形成之各種圓與 橢圓等圖型的示意圖。 " 致隹實施’例的諾細描诸 本發明的一型態係有關於以一經修改的束對於目樟 的雷射處理’其中係調整包括一點區的尺寸比等空間性特 徵,所以藉由-種理想方式來進行雷射材料處理。示範性 應用係包括但不限於半導體鏈接件吹製、電阻器修整、雷 射鑽製及各種點區轉換。 田 譬如,雷射束定向及轄照分佈可能係大致與目標幾何 1271904 A7 Γ----------- Β7 五、發明説明(9 ) 構如第1%至19(1圖,一金屬鏈接件100係在一記憶元 卜 目 戸 ’、 長方形剖面)相匹配藉以將雷射能量有效率地 搞合至目標(亦即第19c圖),同時降低背景輻照(譬如矽基 材)及潛在伴隨的損害。可能經由不對準(第刚圖)或經由 幸田妝一相鄰鏈接件時溢出一圓形點區(第19 a圖)導致發生 這些損害。雖然第19a圖的情形係呈現極端狀況,但熟悉此 鏈接件吹製技藝者可暸解:數微米的鏈接件間距並不罕 見,甚至不希望具有達到或超過點區102的13%(l/e**2)之 能量。鏈接件通常可能具有8 : 1的尺寸比,並具有小於雷 射處理波長或可相比較之狹窄尺寸。譬如,一鍵接件可能 為〇·6微米x5微米尺寸並其中具有小於i微米的厚度。 第2 1圖係進一步支持使用非圓形點區來吹製或切斷 鏈接件,當一鏈接件及點區如第19d圖所示並不對準時,聚 焦在基材上的入射能係增大光子通量(能量密度,譬如焦耳 =方公分)造成可能的損冑,圓形點區的不匹配(105為偏 口 〇6為對準)係具有明顯的效果,一偏移的橢圓形107 可降低損害的危險,經聚焦的線1〇8及橢圓形109均提供低 度的損害危險。 藉由相對於熔線幾何結構配合改變點區的尺寸比並 將點區軸線定向以盡量加大吸收並盡量減少側向及基材損 °將可利用可控制式橢圓形點區來吹製熔線。本發明可 谷易且快速地容納具有改變定向之熔線的幾何結構。 可依據目標區域中一雷射材料交互作用的靠模加工 來選擇或可控制式調整一點區的空間性特徵。譬如,、可能 辦紙張尺度準⑽)A4“T^97公釐)-〜---
(請先閱讀背面之注意事項再填寫本頁) 1271904 A7 ----— B7____ 五、發明説明(10 ) 利用一熱罪杈加工來評估一給定脈衝能量所移除的材料量 及/或伴隨損害的程度。可能使用或修改一以電腦為基礎的 靠模加工(其中包括雷射脈衝的熱擴散),使得所移除材料 與點區形狀產生關聯。在吹製具有更細間距且偏離1 ··淡 區尺寸比的鏈接件之應用中,以靠模加工為基礎將點區定 型之方式可能特別有益。對於此靠模加工輸入之示範性點 區形狀可能係沿長度為橢圓形高斯式“高,,帽並沿寬度為高 斯式、或為其他形狀。DRAM製造的趨勢係朝向增加密度 (鏈接件/面積)及減小間距。 同樣地,可能需要在一特定方向(譬如平行於電流方向) 中主動修整元件及控制電子電路的“咬合尺寸,,或切縫寬 度,以將這些電路修整成為所需要的數值。同樣地,可能 需要依據與一所量測電子參數的比較而動態地控制所移除 的材料量。同樣地,為了在材料中將孔進行微加工且其中 孔的幾何結構必須符合特定形狀規格(包括立體規格),對 於點區輻照輪廓的動態控制可能為有利的方式。 可能使用如第12至13圖所示跨過切縫的軸線中之一 I1牛低的點區尺寸以及沿著切割方向的軸線中之增大的點區 尺寸來改善處理速度。現在考慮一項使用標稱30微米點區 來切割一線(如第12a圖所示)之範例,若點區修改成一 2〇微 米乘以45微米的橢圓形點區,點區面積將保持固定,工件 上光子通量亦將保持固定。若45微米軸線的定向係沿著切 口J方向,而與3 0微米點區的情形具有相同脈衝率及咬合尺 寸,則切割速度係增大50%。切縫寬度係成比例地降低 .祕紙張尺度適用中國國家標準(CNS) M規格⑵㈣97公幻 13
•訂_ (請先閲讀背面之注意事項再填寫本頁) i 1271904 五、發明説明(11 ) 33%。由此可容易地看出:相較於圓形點區的情形(如第m 及⑶圖所示),五個順序性橢圓形脈衝係產生增大的線長 度。 藉由-可控制式點區定向,可微加工呈現曲線性及多 段式的線(如第1域i3b圖所外此範财,制形的定 向可旋轉90度而以較慢掃描速率生成一寬線,可利用受控 制的點區特徵來改善U型切割、L型切割及其他修整切割形 狀的修整速度。 在點區定向具有固定位置的應用中,亦可改良加工速 度。第13c圖顯示:在設有一連串的平行切縫之一修整應用 中可以如何改良加工速度同時降低切縫寬度,較多數量 的分段若設有增大的長度,將具有更大利益。 亚且,藉由點區特徵的動態控制,可進行對於加工“咬 合尺寸”的更細微控制。 約' 15或略為更大的示範性尺寸比係可望顯著改 善加工速度及系統產出率。 、用方、私除扣確材料量之特定的雷射蝕刻應用係可能 因為對於所需要的點區特徵組之時變式控制( — e-V — ng control)而獲益。 現在芩第24&至24(1圖,可將橢圓形的最大曲率半徑 又疋為人所而要的目標特性的局部凹形半徑相等且重 豐。此一系列沿著-彎曲路徑的點區係屬合形成一即使在 使用大咬合尺寸時大致仍無扇貝邊緣缺陷㈣% scalloping defect)之精密外部半徑。可以一系列精密的同心圈來加工 07 本紙張 S 家
(請先閱讀背面之注意事項再填寫本頁) 14 五、發明説明(丨2 ) 一具高邊緣品質之有效率的孔。 〃在需要一高度對稱圓束的應用中,可利用本發明—杏 把例將特定㈣尺寸轉換成—更理想的輪廓。對於二 或橢圓形輪人束’部份點區形狀不規難射歸因於光學 :統:斤引起的各種效果’其中部份包括譬如像散性等像 與基材法向所呈現之入射束偏離的餘弦誤差、及具有 ΝΑ>0·5的極快偏振光學系統之向量衍射效果。利用一橢圓 形產生光學系統將一輸入束加以預定型’藉以補償上述不 規則性’使得成像在工件上的點區係具有大致理想 性特徵。 根據本發明,可能經由一受控制的定向及/或尺寸比變 化來轉換入射雷射束的尺寸比。同樣地,可能譬如連同定 向控制及/或深寬控制來修改雷射束的振幅及相位輪廊,藉 以產生一高斯性或非高斯性點區輪廓,其譬如為一 “高帽 (top hat),此南帽係具有諸如橢圓形、長方形或不對稱形 狀等具有深寬及/或定向的受控制變化之受控制形狀。 隨後對於束輻照及點區輪廓的轉換提供數項示範性 貫施例,可單獨使用或合併使用這些實施例,且其特定適 用但不限於使用在自動系統中。 擴圓束的成像係為一種利用高斯束傳播來生成一橢 圓形點區形狀之方式,此束之寬的‘‘快,,軸線將產生一狹窄 的束腰部而較小的“慢,,軸線將產生一較大腰部,故導致一 橢圓形良好.聚焦的點區。此技藝最常用來產生橢圓束形狀 之兩種習知技術係為使用歪像稜鏡或圓柱形束放大望遠鏡 五 發明説明(η ) 此技術具有高效率且不會在側向或 將歪像束放大或壓縮, 軸向導入非高斯性產物 習知的束定型及點區定型技術—般係產生一固定式 焦點區尺寸比,可藉由傾斜的相位板或孔徑或者調整歪像 稜鏡部使得這些元件成為可變式,如美國專利5刀4,彻、 4,〇59,343及6,225,595號所示。或者,在本發明的—實施例 中,可使用-歪像束放大器或I缩器的圓柱形元件的變焦 來調整點區形狀’此調整程度係可符合—材料處理操作之 精密度要求。 根據本發明,任何上述束定型及點區定型元件的旋轉 將皆可提供可變式點以向。或者,元件可保持固定且可 利用-影像旋轉H來轉動此束且將點區形狀對準至處理特 性。傳統上係由一旋轉的道威稜鏡(Dove prism)或等效性光 學系統來施加影像旋#,影像旋轉係具有《學横桿的優 點,使得影像係以旋轉器元件的二倍速度旋轉。因此,對 於180度的影像旋轉只需要9〇度的機械動作。若無影像旋轉 器,影像旋轉速率通常係等於元件的旋轉,所以18〇度旋轉 將需要180度的機械動作。一般而言,影像旋轉亦會導致偏 振旋轉,此偏振旋轉可能造成對於材料處理不利之可變式 傳輸損失。並且,一光學系統中偏離束軸線之構件旋轉係 造成不良的束環繞(beam clipping)及工件上之點區的位置 誤差。 一種使用一對未偏移歪像束放大器之可變式束補償 光學系統係揭露於美國專利6,219,169號中。可藉由兩放大 1271904 發明説明(14 态獨立热關地%轉來提供量值調整並補償與輸入束的對 準。一種二稜鏡折射性未偏離棱鏡配置係顯示於美國專利 4/擊號(亦即本文的第_中,亦揭露其他類錄 难配置’美國專利4,623,252號係顯示—種單件配置,美國 專利4风號係顯示—種包括⑽表面之複雜的配置, 吴國專利4,580,879號顯示_種包括一摺疊鏡面之裝置(亦 即本文的第7圖),且美國專利4,627,69〇號顯示一種雙重 TIR平行輸出稜鏡對。 可如同美國專利5,632,083號般地使用一像散性高斯 束來生成橢圓形點區,此像散性束係具有在z軸線分離之兩 個束腰部。在各個腰部上,束為橢圓开》,且腰部代表次要 軸線。各腰部的橢圓形係為正交定向,改變一像散性束的 聚焦將會改變點區的尺寸比,像散性束係廣泛地使用於聚 焦偵測用途。 一種束補償光學系統係揭露於美國專利6,219,169 唬,其中詳細描述為了補償而採用一對歪像束之實施例, 此系統雖然預定將一橢圓束修改成一圓束,但此型系統亦 了適用在本發明的一貫施例中控制一輸入束的空間性特 徵。 本發明的一較佳實施例中,可連續改變兩個束放大器 的相對定向藉以在丨與M2之間實行一種可調式尺寸比。兩 歪像束放大器之級聯及獨立旋轉係將生成具有可變式尺寸 比及旋轉之一受控制的點區。放大器的相對定向係提供尺 寸比,且此對的絕對旋轉係決定點區軸線的定向。若兩放 L:彝紙張尺度適用中_家標準(⑽)Μ規格⑵㈣97公董) 17 (請先閲讀背面之注意事項再填寫本頁) 、可丨 身- 1271904 五、發明説明( ==大率Μ相等且放大軸線以9。度相交,則達 =!之:對稱性放大及-圓形束。若放大轴線重合, 改者一條轴線具有一放大率μ2,且藉由 改束的尺寸比。 b 束的偏離較佳係受到控制,使得元件旋轉並不會 ==置誤差或束的環繞。描述於美國專利6,取169號並 =弟8圖之二構件式圓柱形束放大器及歪像稜鏡並不 …會造成束轉向之未放大軸線中的楔構件誤差。因 精密應用中較佳係採用高精確度構件。不敏感化及/ =可觸、償U件亦有利於較高的精密度,熟悉此光學設 之精密度要求/者係月b夠评鑑出對於特定點區放置需求 具有一個反射表面的束放大器係可提供束轉向能力 以利错由機械式調整加以對準。為了降低對於傾斜的敏感 度,可提供-第二反射表面以盡量減低束轉向的影響。 當選擇令最大放大率比所需要值更高時,可顯著地降 低束放大器的動作範圍。降低束放大器的旋轉係將會降低 束放大益中的束轉向所造成之指向性誤差貢獻,譬如,對 於防反射用之接近布魯斯特角⑻㈣如,s叫⑷使用的歪 像稜鏡而言,大的旋轉將令布魯斯特角判別標準受挫而導 致隨者偏而行因變之大的反射損失。對於10至20度範圍内 j "疋轉’反射知失變化只局限於數個百分點。對於放大 器具有不對準的偏振敏感性轴線之設計,可在束放大器之 間使用-譬如半波板等偏振旋轉構件來改善效率。 2 i i本紙張尺細中國國μ規格 (請先閲讀背面之注意事項再填寫本頁) tT— 五、發明説明(l6 ) 當高放大束方文大器從一橢圓束形旋轉經過圓形並回 到橢圓形時H11圖所示,第二㈣形軸線係大約與第 -橢圓形呈正交,這可使橢圓形呈現正交定向而不需要束 放大器之大的角度旋轉。可藉由小的矯正性束放大器旋轉 來控制橢圓形定向的小幅非線性。當以—束定型過滤器來 產生此束日τ彳使用光學補償來橋正定向非線性並降低潛 在的束扭曲。便利情形中,對於高放大性束放大器,只用 小於180度的束旋轉譬如使用⑽度旋轉即可達成任意的擴 圓定向。 可與一固定式歪像束放大器一起使用一影像旋轉 器,此實施例中,束放大器則可能係屬於諸如單一透射性 楔稜鏡或如美國專利4,759,616號具有TIR的稜鏡等偏移且 偏離的類型。對於-具有—第二偏振敏感性歪像束放大器 之可變式放大系統,影像旋轉器可能造成透射變化,已知 一個旋轉的半波板係可有效作為偏振旋轉器,使用一個牦 度的波板作為90度的偏振旋轉器,但是譬如為3〇度的一波 板將使偏振旋轉60度。偏振旋轉〜係為波板旋轉^的兩 倍。可在影像旋轉器之後安裝一半波板且使得此板的光學 軸線對準至旋轉器的輸入偏振軸線而隨著影像旋轉器旋轉 ,入射在波板之經旋轉的偏振0以系為波板^旋轉之兩 倍,所以波板將使偏振反轉回到輸入定向,可對於歪像稜 鏡的各種構造一起使用此偏振保存影像旋轉器或相等物。 可能具有許多種具有相等或不同放大率之束放大器 放大組合,譬如可使用一對束塵縮器、或一放大器與一壓 1271904 A7 B7 五、發明説明(17 縮器。總共具有四種可能的光學置換方式:放大器/放大 為、放大器/聚光器、聚光器/放大器、及聚光器/聚光器。 可使用一具有放大率M的歪像束放大器以及一具有壓縮率 1 /M的束壓知§為’此情形中’係在放大及壓縮軸線對準時 > 達成放大率1,並在軸線相交時達成尺寸比M2,聚光器 放大器之組合係提供比放大器=> 聚光器更小的一束足 跡,這將可減輕在製造方面的要求並提供較小的光學裝置。 本發明的另一實施例中,可使用譬如可變形鏡面等一 對轉接性光學元件來改變束的尺寸比,各元件係生成一圓 柱形構件,構件的相對光學功率係決定了歪像放大,轉接 性光學元件可能改變其圓柱形軸線的定向以決定出放大軸 線的定向。 當使用圓柱形元件時,可能使兩元件的光學構件相交 錯,以提供一種更不佔體積的光學系統。分別考慮具有構 件Al、A2及Bl、B2之元件八及3,沿著光學軸線的系列將 為Al、A2、B1及B2,一交錯的方式係使用一系列的A1、 B卜A 2、B 2,-嵌套狀方式亦可能生成—不佔體積的系統。 此情形中,此系列的構件係可為A1、Bi、B2、A2。所有 情形中,元件構件A1及A2彼此係保持其各別的相對旋轉定 向,構件B1與B2亦然。 面 對
广請光閲讀背面之漆意事項符璘寫本頁J 熟悉此雷射處理技藝者係瞭解:一般利用某些形式的 相對動作來定位目標及雷射束。在平移階級及/或旋轉鏡 之許多微加工系統組合中,譬如使用電流計(“gaW〇s”)。… 於疋位咸置的組合係可施用本發明的可控制式空間性特 多紙張尺細家標準(_ A4規^ 五 發明説明(l8 ) 谜。如第13圖所示,在遵循逐漸旋轉的曲線期間,橢圓轉 速的要求係受到限制。一般而言,最嚴苛的需求係發生在 ^角轉動時’這通常係與階級或電流計之最高需求同時發 田本發明使用TEM⑽高斯束時,產生具有高斯輪廓之 可义尺寸比橢圓形點區。此等實施例亦可能包括一過濾器 構件以在產生步驟中修改束的振幅及/或相位分佈,並藉以 修改點區形狀及輻照輪廓。譬如,使用一諸如寇丁里 (Cordingley)的相位板等過濾器,藉以生成一導致高帽點區 形狀之束輪廓。在產生束的步驟中包括此過濾器時,施加 至束的定型係連同束的尺寸比一起將過濾器壓印定型,因 此*,經過濾的點區形狀係具有可變的尺寸比及定向,正常 圓形的高帽將轉變為一可控制式橢圓形高帽點區。 利用旋轉性對稱過濾器來生成類似圓高帽形等對稱 點區。可使用並非旋轉對稱性的其他過濾器來生成標稱非 旋轉對稱性點區。可連同空值擴大(null expansi〇n)使用具 有4摺對稱性的過濾器,藉以大致沿著正交軸線生成可變^ 二區。譬如,一產生正方形點區形狀(亦即第16圖)的過濾 器係可產生與如第17及1 8圖所示之過濾器定向對準之可變 式規則點區。高斯束定型的理論描述請見福瑞德m.迪齊, =考特C.(Fred M· Dickey,Scott C.)所編之“雷射束定型:理 淪及技術,,浩斯魏德(Holswade),紐約,Marcel Dekker 2〇〇〇 的第三章。 ’ 在一種直線束轉換過濾器的情形中,較佳係矯正旋轉 '、紙張尺度適用中國國家標準(CNS) A4規格(2歉297公茇) Ϊ271904 A7 ' ^---------- B7 _ 五、發明説明(j/) " ~ 的非''、泉丨生以維持經過一可變範圍所定型的點區對於目標之 且對於中間非正交點區定向而言,影像旋轉係為 較佳方式。 熟悉此技藝者瞭解:可能有其他種未對準的定向,譬 如,正方形點區可能變成一可變菱形,當然可使用其他對 稱與不對稱性過濾器來生成具有可控制式空間性特徵的點 區热悉光學過濾技藝者已習知如以下各案揭露的各種替 代方式·美國專利5,300,756號(寇丁里);美國專利5,864,430 號(迪齊);及美國專利5,917,845號(撒立司(Sales)等人)。 本發明的一實施例中可採用諸如步進馬達及伺服馬 達等許多類型的旋轉式致動器,藉以動態地控制束放大器 的疋向、因而動態地控制雷射尺寸比大小及定向。當需要 兩速操作日守,光學裝置的轉動慣量可能降低,且可能使用 閉迴路伺服控制式致動器。較佳將歪像束放大施加於光束 路徑中具有較小束徑的一點,使用一聚光器/放大器配置亦 有助於卩牛低光學裝置的慣量。影像旋轉領域的改良(尤其在 同速致動器及(零慣量)固態元件)將可望對於本發明提供 直接利益。 一傳播束係入射在一第一歪像束放大器、一第二歪像 束放大器及一包括一物鏡的掃描系統上,第一束放大器係 將束的輻照圖型轉接至一具有預定尺寸比的第一橢圓上, 一第一束旋轉構件係控制第一橢圓束輻照圖型的定向,第 -橢圓束係人射在H像束放A器上且其巾橢圓軸線 係定向為與第二歪像束放大器呈現預定的定向。第二歪像 24夺紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 22 (請先閲讀背面之注意事項再填寫本頁) 訂- 1271904 、發明説明(2〇 束放大器係將第一橢圓束輻照圖型轉接至-第二橢圓輕照 圖型,一第二束旋轉器係控制第二橢圓束的定向。 第及第一歪像束放大器較佳係為相同的光學元 車乂 ^第正像束放大器相對於第二歪像束放大器之 旋轉係包含第-束旋轉器,且第一及第二歪像束放大器的 旋轉係包含第一束旋轉器。熟悉此技藝者瞭解:可使用一 或兩個分離的影像轉子來取代旋轉的歪像束放大器其中任 一者或兩者。 較佳,各歪像裝置的放大係大於MG.5,其中Μ為所需 要的歪像放大率。 一項實施例中,各束放大器係為如第1圖所示藉由 SF14玻璃製成之一對3〇_6〇-9〇度稜鏡1〇、12、14、16所組 成。稜鏡面A、Β、C係分別相對構成30、60、90度角。各 束放大器以下述方式運作,第一稜鏡係作為使束折射的3〇 度楔件’第一表面B與輸入束呈法向並具有防反射塗覆, 第一表面C係接近布魯斯特角(Brewster,s angie)以降低反 射損失’折射束係與光學軸線偏離約6〇度角,第二稜鏡的 定向可使得斜邊C平行於輸入束轴線且使得面a與背離第 一稜鏡之束呈法向。束係透射通過AR塗覆面a並約以60度 角入射在件邊C上,入射角係足以產生TIr反射,偏離的束 此時係受到反射而反向回行,此束現在傳播至第二稜鏡的 面B並以大約接近布魯斯特角的3 〇度角入射,將稜鏡設定 相對位置以使得此束大致在輸入光學軸線的高度與面B交 會。此束在光學軸線上的一點從面B折射時係沿著光學轴 [漆紙張尺度適用中國國家標準(CNS) M規格(21〇χ297公釐) 23 (請先閲讀背面之注意事項再填寫本頁) 訂— 1271904 A7
1271904 A7 -------- —__B7 五、發明説明(22 ) 系統介面、一動力介面及驅動器。 系統控制器產生控制訊號,控制訊號係依據代表譬如 目標材料的預定位置及定向等目標特徵的參考資料藉以控 制雷射源及χ,γ掃描系統並且亦控制產生器及旋轉器。 本發明的另一實施例中,複數個光學路徑具有一光學 開關以在光學路徑之間作切換,各光學路徑係包含一組獨 特的光學構件。譬如,兩路徑各包括歪像光學裝置以控制 點區尺寸比並對準此點區軸線的定向。兩光學路徑之束的 疋向係可使得各點區的主要軸線對準至一正交的目標特 性。譬如美國專利3,753,608號所揭露(聚焦用)之一種多路 徑、以偏振為基礎之光學開關係在正交的點區狀態之間提 供快速切換。當在兩或更多種固定狀態之間作正交切換 時,各路徑係包括固定式歪像放大,但可藉由本發明揭露 的歪像光學裝置來達成具有任意定向之可變式尺寸比點 區。 弟22圖顯示一項此種實施例,一經偏振輸入束12〇可 能係為一偏振旋轉器的輸出,譬如為一電腦控制液晶裝 置。讓渡予本發明受讓人並以引用方式整體併入本文之美 國專利6,1 81,728號中係描述一種偏振控制器以及使用經 疋向的偏振束來處理結構物。輸入偏振可能譬如為兩種正 交偏振中的一者,束分光器121將如圖示沿著兩光學路徑 122、123使束通過,各路徑包括各種摺疊鏡面124及歪像光 學構件125藉以改變束的尺寸比及定向,隨後將束重新導向 偏振束分光器 '组合件”126藉以使束回到原始路徑。隨後可 2;|許紙張尺度適用中國國家標準(CNS) Μ規格(21〇χ297公愛) (請先閱讀背面之注意事項再填寫本頁) 訂— 25 五、發明説明(23 ) 能使用-第二偏振旋轉器」 2 後將,tl·由认、、, 木k擇束128的輸出偏振,然 ' win子系統並聚焦 出偏振構件127可处炎. 上 A者,輸 板絲以轉變—》形偏振或光 =:t偏振的輸送束,熟悉此技藝者瞭解亦可 以利對:::的^化方式’且可將各種組件添加至子系統 以利對準及提供長期指向性的穩定度。 ,切換作用可能係介於傳遞不同束旋轉量之路徑之 此構造巾’至少—光學路徑的偏絲線可能變得鱼歪 ^束轴線並㈣準,彻—❹個四分之—波板對於特定 ^徑將偏振軸線與束重新對準。美國專利4,3i8,59i號揭 路-種正交偏振切換式影像旋轉器,藉以相對於 點區軸線維持此偏振軸線。 形 ―可能以串列方式使用兩或更多個切換式路徑,其中提 供第-複數個束路徑以控制—點區特性,且第二複數個束 路杈係遵循第一複數個束路徑以控制一第二特性。譬如, 一第-偏振束開關係以不同的歪像束放大量來切換兩個路 徑,譬如2倍及3倍尺寸比。並利用—第二偏振束來切 倍及3倍尺寸比束,藉以控制正交定向。 、 目私特彳政可能係包括定向、尺寸(亦即長度、寬度、厚 度)、以及譬如所測得電阻等量測特徵。特徵可能係為預定 或在雷射處理操作時所測得並藉由程序回饋加以監測。 第15圖類似第14圖,但差異在於裝置丨及2代表本發明 之先前描述、的較佳實施例,其中驅動器係驅動用於轉動歪 像裝置之致動器。 1271904 A7 ---—-----—__ B7__ 五、發明説明(Μ) ""-- 本發明係適用於㈢及脈衝式雷射處理操作,亦可以 毫微微秒雷射處理系統來施用本發明,其中可藉由一精密 控:式燒錄臨界值進行選擇性材料移除;或者施用為微微 秒耗圍之類#的狹窄脈衝系、统,此應用中,在選擇光學組 件時係考慮到光學構件的分散。 實際上,經修改的點區係定位於沿著目標的各點上, -項實施例中,可藉由雷射束及目標與_低慣量束定位系 統之相對定位來達成領域中之高速度、順序性的點區定 位s如,可使用如下案描述並為熟悉雷射處理技藝者所 瞭解之一固態束偏向器或電流測定性掃描系統:歐佛貝克 (Overbeek)之美國專利 5 飘 759、4 532,術、up·號。 已熟知對於向量及隨機存取掃描採用電流計及/或聲_ 光偏向為',其他實施例可能係包括微鏡面、輕重量衍射光 學構件或沿著一或多個軸線的活動鏡片。同樣地,可選擇 一組合件進行多軸線式掃描。 讓渡予本發明受讓人的美國專利5,998,759號亦揭 露·在電腦控制下,使用一外部調變器依需要提供雷射脈 衝,各雷射脈衝係與一目標位置相關聯。藉由此方式,一 般係可以包含:在領域(譬如一指定標示代碼或者一橫行或 直列之一連串的選定微觀目標結構)内從一連串重疊點區 形成一線(譬如雷射切縫)一直到任意圖型等等各種可能 性。 另一實.施例中,可能如美國專利6344,^ 8號所示利用 雷射處理裝置的粗略動作以及精密平移階級動作之一組合 1271904 五、發明説明(μ 件來進仃經修改的雷射束及目標之相對定位,其中細微階 級係支撐一個半導體晶圓。這可合併使用,759號專利所描 述的卩通廷脈衝(pulse on demand),,方式來移除鏈接件或處 理其他微型結構。 ,可使用各種組合件,美國專利5,847,960及5,751,585號 係描述使用高速度束定位器(譬如電流計)與緩慢的平移階 、’及之、、且a件之雷射束的相對定位之各種實施例。 第2 3圖以抓私方塊圖提供本發明之一種方法所使用 的各種處理步驟之總結。 這些技術不論單獨使用或合併使用均適用於包括以 下的微加工應用:雷射鑽製、修整、半導體鏈接件吹製、 屏罩修理及其他。 雖然已經圖示及描述本發明之實施例,這些實施例並 未顯示及描述本發明所有可能的形式。而是,說明書採用 的文字僅供示範而非限制性質,並瞭解可作出各種改變而 不脫離本發明之精神與範圍。
(請先閲讀背面之注意事項再填寫本頁) 28 1271904 A7 B7 五、發明説明(26 ) 10、12、14、16···棱鏡 100…金屬鏈接件 102···點區 105…偏移 10 6…對準 10 7…偏移的橢圓形 108···經聚焦的線 109···橢圓形 120···經偏振輸入束 121···束分光器 122···光學路徑 123···光學路徑 元件標號對照 124…摺疊鏡面 125…歪像光學構件 126…偏振束分光器“組合件” 127···第二偏振旋轉器 128…束 A…AR塗覆面 Al、A2及Bl、B2···構件 B…第一表面 C…第二表面 0 b…偏振旋轉 <9r···波板旋轉 (請先閲讀背面之注意事項再填寫本頁)
222本紙張尺度適用中國國家標準(0^) M規格(210X297公釐) 29
Claims (1)
1271904 }iL太 六、申請專利範圍 第91106212號專利申請案申請專利範圍修正本 95.3.17 1 · 一種高速度、精密度及以雷射為基礎在一領域内處理 至少一目標的材料之方法,該方法包含: 沿著一傳播路徑產生一雷射束; 可控制式修改该雷射束’以獲得一經修改的雷射 束;及 在該領域内將該經修改的雷射束順序性及相對性 定位在各目標上之至少一點區中以處理各目標的材 料,其中該至少一點區係具有藉由該可控制式修改步 驟所獲得之一組所需要的空間性特徵,其中包括一可 調式尺寸比。 如申請專利範圍第丨項之方法,其中該至少一點區係 ^有-對軸線’且其中該經修改的雷射束係聚焦在該 等兩軸線中的一大致共同點上。 如申請專利範圍第1項之方法 係大於0 · 1但小於10。 如申请專利範圍第1項之方法 位於該領域内。 如申請專利範圍第1項之方法 性定位步驟係包括向量掃描該經修改的雷之 驟。 如申請專利範圍第W之方法,其中係在該順序性及 該經修改的雷射束之步驟期間重覆該可 k制式修改該雷射束之步驟,使得該至少―點區且有 2. 3. 4. 5. 6. 其中該可調式尺寸比 其中該等多個目標係 其中該順序性及相對 30 1271904 六、申請專利範圍 至少一第二組所需要的空間性特徵。 7·如申請專利範圍第1項之方半,甘士〆 去其中係依據各目標的 至少-目標特徵來決定該組所需要的空間性特徵。 如申請專利範圍第㈣之方法,其中係依據各目標的 至少一目標材料性質來決定該組所需要的空間性特 徵。 如t請專利範圍第1項之方法,其中係依據至少-程 序變數來決定該組所需要的空間性特徵。 1〇.如申請專利範圍第1項之方法,其中係依據至少-所 需要的雷射材料處理特徵來決定該組所需要的空間 性特徵。 如”專利範圍第旧之方法,其中該產生步驟係包 括足型”射束之步驟,藉以改變該尺寸比及獲得一 具有-弟-長形輻照圖型之經修改的束,該第一長形 2照圖型係具有一第一定向,且其中該經修改的束係 輸送並聚焦至該至少一點區中。 12·如申請專利範圍第η項之方法,其中該產生步驟係包 括進-步定型該經修改的雷射束之步驟,藉以獲得一 具有-第二長形輕照圖型之雷射束,該第二長形幸畐照 圖型係具有一第二定向。 13. 如申請專利範圍第12項之方法,其中該可控制式修改 步驟係依據目標定向來控制該等第_及第二定向之 絕對定向。 14. 如申請專利範圍第12項之方法,其中該定型步驟係進 8. 9. 11
3] 1271904 、申請專利範圍 驟 步包括控制該等第一及第二定向的相對定向之步 15·如:請專利範圍第!項之方法,其中該順序性及相對 性定位步驟係將該束輸送及聚焦在沿著一雷射處理 路,伸之複數個點區中’其中各該等點區的尺寸比 1及定向係依據各目標的預定尺寸及目標定向而定。 6·如申請專利範圍第15項之方法,其中該雷射處理路徑 係為一曲線路徑。 17. 2中請專利範圍第15項之方法,其中各該等點區係為 :具有一主要軸線的長形點區,且其中至少一該等點 區的主要軸線係與該雷射處理路徑相對準。 如申凊專利範圍第丨5項之方法 _ 刃泰其中各該等點區係為 一具有一主要軸線的長形點區,且其中至少一該等 區的主要轴線係與該雷射處理路徑呈橫向。/、 • 2申請專利範圍第1項之方法,其中依據各目標的 疋尺寸及目標定向來控制該至少一點區的定向及 尺寸比。 2〇·=請專利範圍第】項之方法,其中該產生步驟係 括過濾該雷射束以獲得一 于、、工仞步修改的點區形狀 步驟。 21. 如申請專利範圍第2 ,^ 万去,其中該產生步驟係 括過濾該雷射束以獲得一細 廓之步驟。 、-初步修改的點區輻照輕 22. 如申請專利範圍第】項 7 β,其中該處理係為微加
18. 點 預 包 之 包
32 1271904 申請專利範圍 工 23.如申請專利範圍 導細負之方法,其中该處理係包括半 夕除、f射修整、雷射鑽製或雷射钱刻。 25 .。專利範圍第1項之方法,其中該順序性及相對 性疋位步驟係將該經修改的束輸送及聚焦在沿著一 田=處理路fe掃描之_點區中,其中該點區的尺寸比 及疋向係依據各目標的預定尺寸及目標定向而定。 如申j專利範圍第1:[員之方法,其中該經修改的束係 /、有#圓形南斯束的一輻照圖型。 I如申:專利祀圍第1項之方法,其中該經修改的束係 具有-種在-方向呈一高帽式且在與該方向正交的 一方向呈高斯式之輻照圖型。 27. 一種高速度、精密度及在—領域内處理具有預定尺寸 及一特徵的至少—目標的材料之系統,該系統包含: 一㈣源’其用於沿著-傳播路#產生—雷射束 並具有-輻照圖型,該輕照圖型係在與該傳播路徑大 致垂直的一平面中具有一尺寸比及一定向; -控制器,其用於依據該特徵產生包括定向控制 訊號之控制訊號; -第-子系統’其配置於該傳播路徑中以依據該 等預定尺寸來定型該雷射束,藉以改變該尺寸比及獲 得一經修改的束; 一第二子系統,其用於依據該等定向控制訊號來 可控制式改變該輻照圖型的定向;及 1271904
六、申請專利範圍 束輸送及水焦子糸統’其用於將該經修改的束 順序性定位及聚焦在各目標的至少一點區中以處理各 目標的材料。 28·如申請專利範圍第27項之系統,其中該第一子系統係 包括一用於定型該雷射束之第一歪像光學元件,藉以 獲得一具有一第一長形輻照圖型之經初步修改的雷 射束’該第一長形輻照圖型係具有一第一定向。
29·如申請專利範圍第28項之系統,其中該第一子系統係 包括一用於進一步定型該經初步修改的雷射束之第 二歪像光學元件,藉以獲得該具有一第二長形輻照圖 里之經修改的束,該第二長形輻照圖型係具有一第二 疋向。 30·如申請專利範圍第29項之系統,其中該第二子系統係 包括至少一用於移動該等歪像光學元件之致動器,藉 以回應該等定向控制訊號來控制該等元件之絕對定 向。
31·如申請專利範圍第3〇項之系統,其中一致動器係移動 ▲:違寺歪像光學元件,卩回應該等控制訊號來控制 该等元件的相對定向。 如申睛專利範圍第27項之系統,其中該束輸送及聚焦 系、、'先係將遠經修改的束順序性定位及聚焦至沿著 的田射處理路徑延伸之複數個點區’其中各該等點區 尺寸比及定向係依據該等預定尺寸及目標定向而 定。 34 1271904 、申請專利範圍 其中該雷射處理路徑 33 ·如申請專利範圍第32項之系統 係為一曲線路徑。 34. 36. 如申請專利範圍第32項 丹平各該等點區係為 具有一主要軸線的長形點區,且其中至少一該等點 區的主要軸線係與該雷射處理路徑相對準。 ” ^申請專利範圍第32項之线,其中各該等點區係為 。具有一主要軸線的長形點區,且其中至少一該等點 區的主要軸線係與該雷射處理路徑呈橫向。 如申請專利範圍第27項之系統,纟中該第—子系統係 包括-橢圓產生器,且其中該經修改的束之輻照圖案 係為一橢圓形輻照圖型,且該至少一點區係為至少一 橢圓形點區。 37·如申請專利範g第36項之系統,其中該第二子系統係 包括一束旋轉器以轉動該經修改的束。 38·如申請專利範圍第27項之系統,#中依據該等預ϋ 寸及目標定向來控制該至少一點區的定向及一尺寸 比。 39·如申請專利範圍第27項之系統,其中該處理係為微加 工° 40.如申請專利範圍第27項之系統,其中該處理係包括半 導體鏈接件移除、雷射修整、雷射鑽製或雷射蝕刻。 41·如申請專利範圍第27項之系統,其中該系統係補償將 導致一偏離圓形或一偏離橢圓形狀況之系統誤差。 42.如申請專利範圍第27項之系統,其中該第一子系統係 1271904
43. 44. 45. 2 乂直列式或補償式偏移光學路徑為基礎之一 口疋式放大器/旋轉器。 如申請專利範圍第27項之系統,丨中該第-子系統係 匕括複數個未偏移稜鏡對。 申明專利圍第27項之系統,其中該第—子系統係 包括一多構件式球形-圓柱形放大器。 如申請專利範圍第27項之系統,其進_步包含一用於 過濾該雷射束之過濾器,藉以獲得一經初步修改的點 區形狀。 饭如申請專利範圍第27項之系統,其中該第二子系統係 包括一轉接性光學構件。 47.如申請專利範圍第27項之系統,其中該第一子系統係 包括一轉接性光學構件。 48·如申請專利範圍第27項之系統,其進一步包含一用於 過濾該雷射束之過濾器,藉以獲得一經初步修改的點 區幸S照輪廓。 49·如申請專利範圍第27項之系統,其中該束輸出及聚焦 子系統係將該經修改的束順序性定位及聚焦在一點 區中’該點區係沿著一雷射處理路徑受到掃描,其中 該點區的尺寸比及定向係依據該預定尺寸及目標定 向而定。 5 0.如申s月專利範圍弟2 7項之糸統’其中該轄照圖型係為 一橢圓形高斯束。 51.如申請專利範圍第2 7項之系統,其中該_照圖型係在
-36 - 1271904 六、申清專利範圍 一方向為一高帽且在與該方向正交的一方向為高斯 52· —種兩速度、精密度及以雷射為基礎在一領域内處理 至少一目標的材料之方法,該方法包含: a) 沿著一傳播路徑產生一雷射束; b) 可控制式修改該雷射束,以獲得一經修改的雷 射束; c)在該領域内將該經修改的雷射束順序性定位在 目私上之至少一點區中以處理該目標的材料,其中 該至少一點區係具有藉由該步驟b)所獲得之一組所需 要的空間性特徵,其中包括一可調式尺寸比;及 目標的材料均受到處理為止 53. 54. 55. 如申請專利範圍第52項之方法,其進—步包含:心 :程序、材料及目標特徵其中至少—者藉以獲得資 枓’其中該步驟b)係以該資料為基礎。 、 如申晴專利範圍第5 3項之方法,甘ώ外土 各曰貝之方去’其中該步驟句係對於 各目私重覆步驟a)至c)及步驟e)直到 標的材料均受到處理為止。 〃所有目 如申請專利範圍第3項之方法,其中該 係大於0.33但小於3。 ⑼工尺寸比 該微結構係為一 部份,該至少一 指定區域,該方 一種用於處理至少一微結構之方法, 含有複數個微結構之多材料元件的一 U結構係具有用於移除目標材料之一 37 56. 1271904 =、申請專利範圍 法包含: 產生一雷射束;
修改該雷射束,以獲得—經修改的雷射束;及 將该經修改的雷射束順序性與相對性定位在該指 定區域上之至少一非圓形點區中,該至少一非圓形點 區具有-預定的非圓形能量分佈,藉以移除該指定區 域中的目標材料,其中該預定的非圓形能量分佈係覆 蓋該指定區域的一面積,所以相較於-覆蓋相同面積 的圓形能量分佈所耗合入該指定區域中之能量,該非 圓形能量分佈係將能量更有效率地耗合入該指定區域 中。 π ^請專利範圍第56項之方法,其中該狀非圓形能 置分佈係包括以下預先指定的特徵:一尺寸比、—聚 焦的點區尺寸、一定向、聚焦深度及—聚焦的輻照分 佈。
58.如申請專利範圍第56項之方法,其中該至少-微結構 係為一具有一長度之鏈接件結構且該多材料元件係 為一半導體元件,且其甲該指定區域係位於其間作並 不包括對於該鏈接件結構之電接觸部。 59·如申請專利範圍第58項之方法’其中該指定區域係小 於9亥寺接觸部之間的鏈接件結構長度之80%。 6〇·如申請專利範圍第58項之方法,其中該至少-非圓形 點區係具有與該鏈接件結構長度對準之一主要輛線^ .如申請專利範圍第60項之方法,其中該至少一非圓形 38 1271904 六、申請專利範圍 點區係具有大於約1 ·2之一尺寸比。 62. 如申請專利範圍第60項之方法,其中該至少一非圓形 點區係具有大於約L2且小於該鏈接件結構長度的約 80%之一尺寸比。 63. 如申請專利範圍第6〇項之方法,其中該至少一非圓形 點區係具有大於1 · 5之一尺寸比。 64·如申請專利範圍第56項之方法,其中該至少一微結構
係具有-長方形,該長方形的窄邊係具有小Μ微求 的尺寸。 认如申請專利範圍第56項之方法,其中該至少一微結構 係具有一長方形,該長方形的窄邊係具有小於0.8微米 的尺寸。 66·如申請專利範圍第 〆 貝之H其中該至少-微結構 〃有I方开/ „玄長方形的窄邊係具有小於微米 的尺寸。
π如申請專利範圍第56項之方法,其中該至少一微結構 係在该指定區域中具有至少為4 ··丨之_尺寸比。 68·如申請專利範圍第% 、方法,其中該等微結構係位 方、忒70件的一半導體基材上。 其中δ亥非圓形能量分 其中該非圓形能量分 69·如申請專利範圍第56項之方法 佈係為橢圓形高斯式。 70·如申請專利範圍第56項之方法 大 —維度中為-高帽且在;該::: 又的一弟二維度中為高斯式。 39 1271904 Γ、申請專利範圍 7Ι· Π:專利範圍第7°項之方法,其㈣-維度係沿 者该至少一微結構的一長度。 72H#·"56項之方法’其中重覆該定位步 複數二Γ具有相對應複數個預定非圓形能量分佈之 73 1 形點區來處理—領域中的複㈣微結構。 有如申料利範_之方法,其中各非圓形點區具 ^向且各微結構具有4向,且其中該定位步驟 之向等非圓形點區的定向對準至該等微結構 74 理利耗圍弟73項之方法,其令該等複數個受處 里的嘁結構之定向係為正交定向。 構利耗圍弟73項之方法,其中依據預定的微結 構疋向來自動地控制該對準步驟。 76·==利範圍第75項之方法,其中該等預定的微結 構疋向係包含在一晶圓修理檔案中。 77.=利範圍第72項之方法,其中該等喻 、、Ό構係為_多材料冗餘記憶體元件之金屬鍵接件。 包 括使β亥至少一非圓形點區的一軸線與該至少 I如申請專利範圍第56項之方法,其中該定 括使該δ小_ Α㈤^ — — . . ^ 微結 構對準之步驟 79·如申請專利範圍第78項之方法,其中該對準步驟係自 動地進行,且其中該對準步驟係包括將該雷射束切換 至複數個光學路徑其中的一者。 、 80.如申請專利範圍第79項之方法,其中該雷射束受到偏 40 1271904
振’且其中該切換步驟係包括可控制式修改該雷射束 的偏振。 A如申請專利範圍第79項之方法,其中該切換步驟係包 括错由-歪像光學系統可控制式地修改該雷射束。 I如申請專利範圍第78項之方法,其中該對準步驟係包 括至少半自動地調整該至少一非圓形點區的一主要
83·如申請專利範圍第78項之方法,其中該對準步驟係包 括提供電腦產生的訊號,藉以自動調整該至少__ 形點區的一主要軸線。 84·如申請專利範圍第83 一 ^貝之方法,其中該對準步驟係進 -步包括回應於定向控制訊號而自動地移動一光學 85. 86. 87. 如申請專利範圍第84項之方法,其中該移動光學子李 統之步驟係、包括移動該子系統之—歪像光學板件 如申請專利範圍第56項之方法,纟中該元件中所包含 之微結構係以橫列與直行規則地配置。 如甲请專利範圍第56項之方法,#中該預定的非s 能量分佈係依據使該指定區域的_剖面與該至少 非圓形點區的形狀產生關聯之一種輻 用的靠模加工。 其中該靠模加工係為 其中該靠模加工係為
88·如申請專利範圍第87項之方法 一熱靠模加工。 89.如申請專利範圍第87項之方法 41 1271904
42 1271904
、申請專利範圍 量並未降低。 97·如申請專利範圍第56項 ^^f ^ ,、 法,其中係乾淨地移除該 才曰疋s域中之目標材料。 98.如申請專利範圍第% . g,a ,,,、之方法,其中係移除該指定區 A T之目;f示材料而不俊 從材抖不良地改變到達該元# 的相鄰微結構。 又』運Θ兀件 "·如申請專利範圍第56項 ^ ^ 、之方法,其中係移除該指定區 的鋪覆層。 材枓不良地改變到達該元件 100·如申請專利範圍第56項之 ,.. 方去’其中係移除該指定區 或中之目標材料而不使材 '斗不良地改變到處達該元 件的一基材。 101·如申請專利範圍第56項 仗# θ ^决’其中該非圓形能量分 布係具有與該至少一微姓 冓的一邊緣相平行之一邊 緣輪廓。 102.如申請專利範圍第98項之方 其進一步包含增加該 至 一非圓形點區的最大能量之步驟。 1〇3.如申請專利範圍第99項之方法,甘、 其進一步包含增加該 至夕一非圓形點區的最大能量之步驟。 4.如申晴專利範圍第1⑽項之 _ n 貝<万去,其進一步包含增加 忒至少一非圓形點區的最大 l〇c , ^ 犯里之步驟。 • ϋ申晴專利範圍第97項之方法, 其進一步包含減少該 主 >、一非圓形點區的最小能量 | <步驟。 43
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