TWI271904B - High-speed, precision, laser-based method and system - Google Patents

High-speed, precision, laser-based method and system Download PDF

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Publication number
TWI271904B
TWI271904B TW091106212A TW91106212A TWI271904B TW I271904 B TWI271904 B TW I271904B TW 091106212 A TW091106212 A TW 091106212A TW 91106212 A TW91106212 A TW 91106212A TW I271904 B TWI271904 B TW I271904B
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TW
Taiwan
Prior art keywords
laser beam
modified
dot
target
orientation
Prior art date
Application number
TW091106212A
Other languages
English (en)
Inventor
Jonathan S Ehrmann
James J Cordingley
Donald V Smart
Donald J Svetkoff
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Gsi Lumonics Corp
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Publication of TWI271904B publication Critical patent/TWI271904B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0736Shaping the laser spot into an oval shape, e.g. elliptic shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • B23K26/043Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/10Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/485Adaptation of interconnections, e.g. engineering charges, repair techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76888By rendering at least a portion of the conductor non conductive, e.g. oxidation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
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    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/38Conductors
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    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
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    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • B23K2103/166Multilayered materials
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    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

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1271904 五、發明説明(1 ) 發明背 1. 發明igi 本I月係有關於雷射材料處理方法及系統之領域,更 ㈣言之’係有關於處理半導體晶圓、電子基材及進行雷 射被加工的工件之掃描式雷射處理方法及系統。 2. 背景 傳、洗上,對於大多數精密掃描雷射處理應用係已經採 =圓形點區。譬如Nd: YAG雷射等許多雷射源係產生圓形 Γ7斯束圓形向斯束在成像通過習知的球面光學裝置時將 產生圓形點區。這些點區係掃描過目標部位以處理材料, 且所產生的雷射材料交互作用將移除或以其他方式改變目 標的材料。許多雷射處理應用中,系統的產出率係受限於·· +均功率、基材的光子通量損害臨界值,並在脈衝式系統 中亦受限於:雷射q率、及雷射脈衝特徵。 ’不範性彳政加工操作係包括:冗餘記憶電路的鏈接件吹 製田射铋整、及電路製造。對於譬如將次微米寬度的熔 線吹製在一記憶元件上之處理應用,需要以最小的側向與 基材損害將能量有效率地耦合至一狹窄的熔線,大圓形點 區可月b ie成如第1 9a圖所示之不良的相鄰鏈接件損害。較小 的點區雖然可以處理更細微的熔線,但如第19b圖所示,隨 著減小的點區尺寸之較高光子通量將會使得基材損害的潛 在危險增大。當微加工由一系列小雷射點區製成的一線 時’點區重豐或稱為“咬合尺寸(bite size),,以及q率係為決 定最大掃描速度之兩項處理特徵。當不適合採用較大點區 穿声紙張尺度適用中國國家標準(CNS) M規格(21〇χ297公釐) 1271904 A7 、發明説明(2 ) "" "~' @峰值光子通里日t,需要較寬縫寬的雷射修整應用係可能 ❿要多次通過一小點區。在加工大型導線計數元件上的細 丨間距導線之導線架製造領域中,係使用如美國專利 5,632,083號所描述之_旋轉的長形點區。 偏離圓形的點區係時常視為令處理品質受限之系統 瑕症,在雷射光學裝置的領域中已多方致力改良束品質、 I來自二極體雷射的束變圓、及設計與實行衍射限制式系 、统之高鏞正光學裝置。束形補償所用之向量衍射效應係描 述於美國專利4,397,527號中。 已知許多種將束定型及將點區定型之技術,其中一種 I法係肖圓形束—起使用_相位板來修改點區形狀,藉 以如第2G圖上部所示用以處理記憶體熔線,這亦揭露於寇 丁里(Cordmgley)的美國專利5,3〇〇,756號中,使用此簡單型 才目位板的主要效果係為生成如第2 〇圖下部所示之一高帽狀 勿佈輪廓,但其中亦描述生成一橢圓形點區之技術。 美國專利6,341,029號係描述使用一具有顫動的歪像 點區來將一雷射束強度輪廓加以定型,歪像點區可使得較 尖銳的線緣具有一變窄的點區寬度,同時一增大的點區長 度係保持所需要的總功率而不超過每單位基材面積的整體 功率之處理極限。 費坎晋(Veldkamp)的美國專利七41〇,237號係描述一] 種用於將一圓形南斯束轉變為長形平頂狀輪廓之衍射格柵 及稜鏡方法。 迪奇(Dickey)的美國專利5,864,43〇號係描述一種以相 ㉞紙張尺度適用中國國家標準_) M規格⑵〇><297公董} ----
(請先閲讀背面之注意事項再填寫本頁) 1271904 五、發明説明(3 ) 位為基礎將一圓形高斯束轉變為一平頂、正方形或長方形 點區之方法。 另一種技術係生成一陣列的點區,譬如詹姆士(以❿以) 的美國專利5,463,200號所揭露。 另一種熟知的技術係為成像孔徑屏罩。 切趾法(apodization)係為另一種簡單之修改束形及點 區形狀的技術。 拜德(Baird)等人經公告的專利申請案 US2002/0005390 A1號係揭露一種UV#射系統,其中提供 一光學裝置模組以增強雷射束的形狀品質。 孫(Sun)等人之美國專利5,265,114號係描述一種選擇 性雷射處理一多材料多層裝置的一或多種材料之一目標結 構之方法及系統。 孫(Sun)等人之美國專利6,〇57,18〇號係描述一種以紫 外線雷射輸出來切斷導電鍵接件之方法。 發明概沭 本發明至少一項實施例之一目的係為將一經修改的 雷射束順序性及相對式定位在至少一點區中,此至少一點 區係對於多種不同微加工應用之一領域中的一或多個目標 之雷射材料處理具有可調整的尺寸比。 本發明至少一項實施例之一目的係為矯正由系統引 發的點區不均勾性,藉以生成精密的圓形點區或譬如橢圓 形點區等長形點區。 為了貫施本發明之上述目的及其他目的,揭露一種用 (請先閲讀背面之注意事項再填寫本頁) tr·
1271904 A7 B7 五、發明説明(4 於加工位於-領域内至少—目標的材料之高速度、精密度 及以雷射為基礎之方法。此方法係包含沿著—傳播路^ 生-雷射束’以及可控制式修改雷射束以獲得一經修改的 雷射束。此方法亦包括將經修改的雷射束順序性及相對性 定位在在領域内各目標處之至少—點區中以處理各目標材 料’其中至少-點區具有一組所需要的空間性特徵,包括 藉由可控制式修改的步驟所獲得之一可調式尺寸比。 並且,為了進行本發明的上述目的及其他目的,揭露 一種用於處理在一領域内具有預定尺寸及一特徵之至少一 目標的材料之高速度、精密度系統。此线係包括―雷射 源,此雷射源係用於沿著一傳播路徑產生一具有一輻照圖 型的雷射束,此輻照圖型係在一與傳播路徑大致垂直的平 ®t具有1寸tb及H -控制器係產生控制訊號, 控制訊號係包括基於此特徵之定向控制訊號。一第一子系 統係配置於傳播路徑以依據預定尺寸將雷射束定型,藉以 改變尺寸比並獲得一經修改的束。—第二子系統係依據定 向控制訊號可控制式地改變輻照圖型的定向。一束輸送及 來焦子系統係將經修改的束順序性定位及聚焦在各目標上 的至少一點區中’藉以處理各目標的材料。 並且’為了貫施本發明的上述目的及其他目的,揭露 一種用於處理位於一領域内至少一目標的材料之高速度、 冰月後度及以雷射為基礎之方法,此方法包括以下步驟:a) 沿著一傳播路徑產生一雷射束;b)可控制式修改雷射束以 獲得一經修改的雷射束;c)在領域内的一目標處將經修改 .爵本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂| _费| 1271904
的雷射束相對定位在至少— ;&甲猎以處理目標的材 广,,、中至少一點區係具有一組所需要的空間性特徵,其 中包括自㈣e)獲得之—可調式尺寸比;及d)對於各目標 重後步驟a)至e) ’直到位於領域内所有目標的材料均 處理為止。 為了貫施本發明的上述目的及其他目的,提供一種處 理至少一微結構之方法,此至少一結構係為一包含複數個 微結構之多材料元件的一部份’此至少一微結構係具有用 於移除目標材料之-指定區域。此方法包括:產生_雷射 束,修改雷射束以獲得-經修改的雷射束,及將經修:的 雷射束順序性與相對性定位在指定區域上之至少一非圓 點區中’此至少—非圓形點區具有-預定的非圓形能量 佈,藉以移除指定區域中的目標材料。預定的非圓形能 刀佈係覆1指定區域的一面積,所以相較於一覆蓋相同 積的圓形能量分佈所耦合入指定區域中之能量,非圓形 蓋为佈係將能量更有效率地耦合入指定區域中。 並且’為了實施本發明的上述目的及其他目的,提供 一種處理至少一微結構之系統,此至少一微結構係為一包 含複數個微結構之多材料元件的一部份,此至少一微結構 係具有用於移除目標材料之一指定區域。此系統包括:用 於產生一雷射束之構件,及用於修改雷射束以獲得一經修 改的雷射束之構件。此系統亦包含將經修改的雷射束順序 性與相對性定位在指定區域上之至少一非圓形點區中, 至乂 非圓形點區具有一預定的非圓形能量分佈,藉以 形 分 量 面 能 此 移 (請先閲讀背面之注意事項再填寫本頁) 訂· 费, 纖本紙張尺度適用中國國家標準(_ M規格⑵㈣97公董〉 1271904 A7 B7 五、發明説明(6 除指定區域中的目標材料。預定的非圓形能量分佈係覆蓋 指定區域的一面積,所以相較於一覆蓋相同面積的圓形能 置分佈所耦合入指定區域中之能量,非圓形能量分佈係將 能量更有效率地輕合入指定區域中。 由下文對於本發明最佳實施模式的詳細描述並參照 圖式’更易於瞭解本發明之上述目的及其他目的、特性及 優點。 圖式簡單說1 第1圖為兩對本發明的30-60-60稜鏡歪像束放大器以 及一通過的雷射束之側視圖; 第2圖為兩對的未偏移放大器以及通過的雷射束之立 體圖; 第3圖為一對的未偏移稜鏡以及一通過的雷射束之側 視圖; 第4圖為另一對的未偏移稜鏡以及一通過的雷射束之 側視圖; 第5圖為未轉向稜鏡對以及一通過的雷射束之側視 圖; 第6圖為具有道威(Dove)棱鏡旋轉器之一歪像稜鏡對 的側視示意圖; 第7圖為美國專利4,58〇,879號的一對稜鏡對之側視示 意圖; 第8圖為美國專利6,219,169號的一對稜鏡對之側視示 意圖; 搬本紙張尺度適用中國國家檩準(CNS) M規格⑵0X297公爱) (請先閲讀背面之注意事項#'填寫本頁) -訂| !27l9〇4
、發明説明( 第9圖為美國專利4,948,233號的一對稜鏡對之側視示 思、圖; 第l〇a及l〇b圖分別為一具有對準補償用的相交圓柱之 二元件式球型-圓柱型放大器之俯視及側視示意圖; 第11圖顯示隨著本發明第二放大器旋轉經過一相交的 空值位置(null position)之具有接近正交軸線的束輻照輪 廓; 第12a及12b圖顯示利用本發明的方法及系統將一系列 圓形點區轉變成一對應系列的橢圓形點區; 第13a至13c圖顯示三系列的橢圓形點區,第13a圖13a 為具有一圓角的目標所使用之第一系列;第13b圖為具有一 整齊角落的目標所使用之第二系列;第13c圖則可供藉由在 目標材料中加工一連串的平行線時所使用; 第14圖為一種用於本發明的目標材料處理之系統的 第一實施例之方塊圖; 第15為此系統的第二實施例之方塊圖; 第16圖為一正方形點區的繪圖; 第1圖為一具有非線性旋轉及對稱性之經修改的正 方形點區所製成之一長方形點區的繪圖; 第18圖為利用一放大器的第三實施例對於來自一經 修改的正方形點區之一改良式長方形點區之繪圖,其中顯 示具有光學補償的點區定型; 第19a圖為將造成相鄰鏈接件損害之一大雷射點區的 俯視示意圖,並連帶顯示其強度輪廓的一對應剖面; 10 (請先閲讀背面之注意事項再填寫本頁) 2.Q.3本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 1271904 五、發明説明(8 ) 第19b圖為將造成基材變化之一小雷射點區的俯視示 意圖’並連帶顯示其強度輪摩的一對應剖面; 第19c圖為將盡量減少損害之一對準的橢圓形點區的 俯視不意圖,並連帶顯示其強度輪廓的一對應剖面; 第19d圖為一不對準的橢圓形點區的俯視示意圖,並 連帶顯示其強度輪廓的一對應剖面; 第20圖為一習知技藝相位板的側視圖,圖中上方為一 輸入高斯脈衝,下方為一高帽輸出脈衝; 第21圖為相對光子通量vs.點區以微米為單位的一半 f度之複數個圖式藉以顯示基材光子通量(基材上的能量 在度),基材光子通量係為各種點區在鏈接件與點區之間的 不對準之一函數; 第22圖為本發明的一切換式系統的示意圖,其中對於 一雷射束提供兩個不同的光學路徑; 第23圖為顯示本發明的方法之流程方塊圖;及 第24a至24d圖為可利用本發明所鑽製形成之各種圓與 橢圓等圖型的示意圖。 " 致隹實施’例的諾細描诸 本發明的一型態係有關於以一經修改的束對於目樟 的雷射處理’其中係調整包括一點區的尺寸比等空間性特 徵,所以藉由-種理想方式來進行雷射材料處理。示範性 應用係包括但不限於半導體鏈接件吹製、電阻器修整、雷 射鑽製及各種點區轉換。 田 譬如,雷射束定向及轄照分佈可能係大致與目標幾何 1271904 A7 Γ----------- Β7 五、發明説明(9 ) 構如第1%至19(1圖,一金屬鏈接件100係在一記憶元 卜 目 戸 ’、 長方形剖面)相匹配藉以將雷射能量有效率地 搞合至目標(亦即第19c圖),同時降低背景輻照(譬如矽基 材)及潛在伴隨的損害。可能經由不對準(第刚圖)或經由 幸田妝一相鄰鏈接件時溢出一圓形點區(第19 a圖)導致發生 這些損害。雖然第19a圖的情形係呈現極端狀況,但熟悉此 鏈接件吹製技藝者可暸解:數微米的鏈接件間距並不罕 見,甚至不希望具有達到或超過點區102的13%(l/e**2)之 能量。鏈接件通常可能具有8 : 1的尺寸比,並具有小於雷 射處理波長或可相比較之狹窄尺寸。譬如,一鍵接件可能 為〇·6微米x5微米尺寸並其中具有小於i微米的厚度。 第2 1圖係進一步支持使用非圓形點區來吹製或切斷 鏈接件,當一鏈接件及點區如第19d圖所示並不對準時,聚 焦在基材上的入射能係增大光子通量(能量密度,譬如焦耳 =方公分)造成可能的損冑,圓形點區的不匹配(105為偏 口 〇6為對準)係具有明顯的效果,一偏移的橢圓形107 可降低損害的危險,經聚焦的線1〇8及橢圓形109均提供低 度的損害危險。 藉由相對於熔線幾何結構配合改變點區的尺寸比並 將點區軸線定向以盡量加大吸收並盡量減少側向及基材損 °將可利用可控制式橢圓形點區來吹製熔線。本發明可 谷易且快速地容納具有改變定向之熔線的幾何結構。 可依據目標區域中一雷射材料交互作用的靠模加工 來選擇或可控制式調整一點區的空間性特徵。譬如,、可能 辦紙張尺度準⑽)A4“T^97公釐)-〜---
(請先閱讀背面之注意事項再填寫本頁) 1271904 A7 ----— B7____ 五、發明説明(10 ) 利用一熱罪杈加工來評估一給定脈衝能量所移除的材料量 及/或伴隨損害的程度。可能使用或修改一以電腦為基礎的 靠模加工(其中包括雷射脈衝的熱擴散),使得所移除材料 與點區形狀產生關聯。在吹製具有更細間距且偏離1 ··淡 區尺寸比的鏈接件之應用中,以靠模加工為基礎將點區定 型之方式可能特別有益。對於此靠模加工輸入之示範性點 區形狀可能係沿長度為橢圓形高斯式“高,,帽並沿寬度為高 斯式、或為其他形狀。DRAM製造的趨勢係朝向增加密度 (鏈接件/面積)及減小間距。 同樣地,可能需要在一特定方向(譬如平行於電流方向) 中主動修整元件及控制電子電路的“咬合尺寸,,或切縫寬 度,以將這些電路修整成為所需要的數值。同樣地,可能 需要依據與一所量測電子參數的比較而動態地控制所移除 的材料量。同樣地,為了在材料中將孔進行微加工且其中 孔的幾何結構必須符合特定形狀規格(包括立體規格),對 於點區輻照輪廓的動態控制可能為有利的方式。 可能使用如第12至13圖所示跨過切縫的軸線中之一 I1牛低的點區尺寸以及沿著切割方向的軸線中之增大的點區 尺寸來改善處理速度。現在考慮一項使用標稱30微米點區 來切割一線(如第12a圖所示)之範例,若點區修改成一 2〇微 米乘以45微米的橢圓形點區,點區面積將保持固定,工件 上光子通量亦將保持固定。若45微米軸線的定向係沿著切 口J方向,而與3 0微米點區的情形具有相同脈衝率及咬合尺 寸,則切割速度係增大50%。切縫寬度係成比例地降低 .祕紙張尺度適用中國國家標準(CNS) M規格⑵㈣97公幻 13
•訂_ (請先閲讀背面之注意事項再填寫本頁) i 1271904 五、發明説明(11 ) 33%。由此可容易地看出:相較於圓形點區的情形(如第m 及⑶圖所示),五個順序性橢圓形脈衝係產生增大的線長 度。 藉由-可控制式點區定向,可微加工呈現曲線性及多 段式的線(如第1域i3b圖所外此範财,制形的定 向可旋轉90度而以較慢掃描速率生成一寬線,可利用受控 制的點區特徵來改善U型切割、L型切割及其他修整切割形 狀的修整速度。 在點區定向具有固定位置的應用中,亦可改良加工速 度。第13c圖顯示:在設有一連串的平行切縫之一修整應用 中可以如何改良加工速度同時降低切縫寬度,較多數量 的分段若設有增大的長度,將具有更大利益。 亚且,藉由點區特徵的動態控制,可進行對於加工“咬 合尺寸”的更細微控制。 約' 15或略為更大的示範性尺寸比係可望顯著改 善加工速度及系統產出率。 、用方、私除扣確材料量之特定的雷射蝕刻應用係可能 因為對於所需要的點區特徵組之時變式控制( — e-V — ng control)而獲益。 現在芩第24&至24(1圖,可將橢圓形的最大曲率半徑 又疋為人所而要的目標特性的局部凹形半徑相等且重 豐。此一系列沿著-彎曲路徑的點區係屬合形成一即使在 使用大咬合尺寸時大致仍無扇貝邊緣缺陷㈣% scalloping defect)之精密外部半徑。可以一系列精密的同心圈來加工 07 本紙張 S 家
(請先閱讀背面之注意事項再填寫本頁) 14 五、發明説明(丨2 ) 一具高邊緣品質之有效率的孔。 〃在需要一高度對稱圓束的應用中,可利用本發明—杏 把例將特定㈣尺寸轉換成—更理想的輪廓。對於二 或橢圓形輪人束’部份點區形狀不規難射歸因於光學 :統:斤引起的各種效果’其中部份包括譬如像散性等像 與基材法向所呈現之入射束偏離的餘弦誤差、及具有 ΝΑ>0·5的極快偏振光學系統之向量衍射效果。利用一橢圓 形產生光學系統將一輸入束加以預定型’藉以補償上述不 規則性’使得成像在工件上的點區係具有大致理想 性特徵。 根據本發明,可能經由一受控制的定向及/或尺寸比變 化來轉換入射雷射束的尺寸比。同樣地,可能譬如連同定 向控制及/或深寬控制來修改雷射束的振幅及相位輪廊,藉 以產生一高斯性或非高斯性點區輪廓,其譬如為一 “高帽 (top hat),此南帽係具有諸如橢圓形、長方形或不對稱形 狀等具有深寬及/或定向的受控制變化之受控制形狀。 隨後對於束輻照及點區輪廓的轉換提供數項示範性 貫施例,可單獨使用或合併使用這些實施例,且其特定適 用但不限於使用在自動系統中。 擴圓束的成像係為一種利用高斯束傳播來生成一橢 圓形點區形狀之方式,此束之寬的‘‘快,,軸線將產生一狹窄 的束腰部而較小的“慢,,軸線將產生一較大腰部,故導致一 橢圓形良好.聚焦的點區。此技藝最常用來產生橢圓束形狀 之兩種習知技術係為使用歪像稜鏡或圓柱形束放大望遠鏡 五 發明説明(η ) 此技術具有高效率且不會在側向或 將歪像束放大或壓縮, 軸向導入非高斯性產物 習知的束定型及點區定型技術—般係產生一固定式 焦點區尺寸比,可藉由傾斜的相位板或孔徑或者調整歪像 稜鏡部使得這些元件成為可變式,如美國專利5刀4,彻、 4,〇59,343及6,225,595號所示。或者,在本發明的—實施例 中,可使用-歪像束放大器或I缩器的圓柱形元件的變焦 來調整點區形狀’此調整程度係可符合—材料處理操作之 精密度要求。 根據本發明,任何上述束定型及點區定型元件的旋轉 將皆可提供可變式點以向。或者,元件可保持固定且可 利用-影像旋轉H來轉動此束且將點區形狀對準至處理特 性。傳統上係由一旋轉的道威稜鏡(Dove prism)或等效性光 學系統來施加影像旋#,影像旋轉係具有《學横桿的優 點,使得影像係以旋轉器元件的二倍速度旋轉。因此,對 於180度的影像旋轉只需要9〇度的機械動作。若無影像旋轉 器,影像旋轉速率通常係等於元件的旋轉,所以18〇度旋轉 將需要180度的機械動作。一般而言,影像旋轉亦會導致偏 振旋轉,此偏振旋轉可能造成對於材料處理不利之可變式 傳輸損失。並且,一光學系統中偏離束軸線之構件旋轉係 造成不良的束環繞(beam clipping)及工件上之點區的位置 誤差。 一種使用一對未偏移歪像束放大器之可變式束補償 光學系統係揭露於美國專利6,219,169號中。可藉由兩放大 1271904 發明説明(14 态獨立热關地%轉來提供量值調整並補償與輸入束的對 準。一種二稜鏡折射性未偏離棱鏡配置係顯示於美國專利 4/擊號(亦即本文的第_中,亦揭露其他類錄 难配置’美國專利4,623,252號係顯示—種單件配置,美國 專利4风號係顯示—種包括⑽表面之複雜的配置, 吴國專利4,580,879號顯示_種包括一摺疊鏡面之裝置(亦 即本文的第7圖),且美國專利4,627,69〇號顯示一種雙重 TIR平行輸出稜鏡對。 可如同美國專利5,632,083號般地使用一像散性高斯 束來生成橢圓形點區,此像散性束係具有在z軸線分離之兩 個束腰部。在各個腰部上,束為橢圓开》,且腰部代表次要 軸線。各腰部的橢圓形係為正交定向,改變一像散性束的 聚焦將會改變點區的尺寸比,像散性束係廣泛地使用於聚 焦偵測用途。 一種束補償光學系統係揭露於美國專利6,219,169 唬,其中詳細描述為了補償而採用一對歪像束之實施例, 此系統雖然預定將一橢圓束修改成一圓束,但此型系統亦 了適用在本發明的一貫施例中控制一輸入束的空間性特 徵。 本發明的一較佳實施例中,可連續改變兩個束放大器 的相對定向藉以在丨與M2之間實行一種可調式尺寸比。兩 歪像束放大器之級聯及獨立旋轉係將生成具有可變式尺寸 比及旋轉之一受控制的點區。放大器的相對定向係提供尺 寸比,且此對的絕對旋轉係決定點區軸線的定向。若兩放 L:彝紙張尺度適用中_家標準(⑽)Μ規格⑵㈣97公董) 17 (請先閲讀背面之注意事項再填寫本頁) 、可丨 身- 1271904 五、發明説明( ==大率Μ相等且放大軸線以9。度相交,則達 =!之:對稱性放大及-圓形束。若放大轴線重合, 改者一條轴線具有一放大率μ2,且藉由 改束的尺寸比。 b 束的偏離較佳係受到控制,使得元件旋轉並不會 ==置誤差或束的環繞。描述於美國專利6,取169號並 =弟8圖之二構件式圓柱形束放大器及歪像稜鏡並不 …會造成束轉向之未放大軸線中的楔構件誤差。因 精密應用中較佳係採用高精確度構件。不敏感化及/ =可觸、償U件亦有利於較高的精密度,熟悉此光學設 之精密度要求/者係月b夠评鑑出對於特定點區放置需求 具有一個反射表面的束放大器係可提供束轉向能力 以利错由機械式調整加以對準。為了降低對於傾斜的敏感 度,可提供-第二反射表面以盡量減低束轉向的影響。 當選擇令最大放大率比所需要值更高時,可顯著地降 低束放大器的動作範圍。降低束放大器的旋轉係將會降低 束放大益中的束轉向所造成之指向性誤差貢獻,譬如,對 於防反射用之接近布魯斯特角⑻㈣如,s叫⑷使用的歪 像稜鏡而言,大的旋轉將令布魯斯特角判別標準受挫而導 致隨者偏而行因變之大的反射損失。對於10至20度範圍内 j "疋轉’反射知失變化只局限於數個百分點。對於放大 器具有不對準的偏振敏感性轴線之設計,可在束放大器之 間使用-譬如半波板等偏振旋轉構件來改善效率。 2 i i本紙張尺細中國國μ規格 (請先閲讀背面之注意事項再填寫本頁) tT— 五、發明説明(l6 ) 當高放大束方文大器從一橢圓束形旋轉經過圓形並回 到橢圓形時H11圖所示,第二㈣形軸線係大約與第 -橢圓形呈正交,這可使橢圓形呈現正交定向而不需要束 放大器之大的角度旋轉。可藉由小的矯正性束放大器旋轉 來控制橢圓形定向的小幅非線性。當以—束定型過滤器來 產生此束日τ彳使用光學補償來橋正定向非線性並降低潛 在的束扭曲。便利情形中,對於高放大性束放大器,只用 小於180度的束旋轉譬如使用⑽度旋轉即可達成任意的擴 圓定向。 可與一固定式歪像束放大器一起使用一影像旋轉 器,此實施例中,束放大器則可能係屬於諸如單一透射性 楔稜鏡或如美國專利4,759,616號具有TIR的稜鏡等偏移且 偏離的類型。對於-具有—第二偏振敏感性歪像束放大器 之可變式放大系統,影像旋轉器可能造成透射變化,已知 一個旋轉的半波板係可有效作為偏振旋轉器,使用一個牦 度的波板作為90度的偏振旋轉器,但是譬如為3〇度的一波 板將使偏振旋轉60度。偏振旋轉〜係為波板旋轉^的兩 倍。可在影像旋轉器之後安裝一半波板且使得此板的光學 軸線對準至旋轉器的輸入偏振軸線而隨著影像旋轉器旋轉 ,入射在波板之經旋轉的偏振0以系為波板^旋轉之兩 倍,所以波板將使偏振反轉回到輸入定向,可對於歪像稜 鏡的各種構造一起使用此偏振保存影像旋轉器或相等物。 可能具有許多種具有相等或不同放大率之束放大器 放大組合,譬如可使用一對束塵縮器、或一放大器與一壓 1271904 A7 B7 五、發明説明(17 縮器。總共具有四種可能的光學置換方式:放大器/放大 為、放大器/聚光器、聚光器/放大器、及聚光器/聚光器。 可使用一具有放大率M的歪像束放大器以及一具有壓縮率 1 /M的束壓知§為’此情形中’係在放大及壓縮軸線對準時 > 達成放大率1,並在軸線相交時達成尺寸比M2,聚光器 放大器之組合係提供比放大器=> 聚光器更小的一束足 跡,這將可減輕在製造方面的要求並提供較小的光學裝置。 本發明的另一實施例中,可使用譬如可變形鏡面等一 對轉接性光學元件來改變束的尺寸比,各元件係生成一圓 柱形構件,構件的相對光學功率係決定了歪像放大,轉接 性光學元件可能改變其圓柱形軸線的定向以決定出放大軸 線的定向。 當使用圓柱形元件時,可能使兩元件的光學構件相交 錯,以提供一種更不佔體積的光學系統。分別考慮具有構 件Al、A2及Bl、B2之元件八及3,沿著光學軸線的系列將 為Al、A2、B1及B2,一交錯的方式係使用一系列的A1、 B卜A 2、B 2,-嵌套狀方式亦可能生成—不佔體積的系統。 此情形中,此系列的構件係可為A1、Bi、B2、A2。所有 情形中,元件構件A1及A2彼此係保持其各別的相對旋轉定 向,構件B1與B2亦然。 面 對
广請光閲讀背面之漆意事項符璘寫本頁J 熟悉此雷射處理技藝者係瞭解:一般利用某些形式的 相對動作來定位目標及雷射束。在平移階級及/或旋轉鏡 之許多微加工系統組合中,譬如使用電流計(“gaW〇s”)。… 於疋位咸置的組合係可施用本發明的可控制式空間性特 多紙張尺細家標準(_ A4規^ 五 發明説明(l8 ) 谜。如第13圖所示,在遵循逐漸旋轉的曲線期間,橢圓轉 速的要求係受到限制。一般而言,最嚴苛的需求係發生在 ^角轉動時’這通常係與階級或電流計之最高需求同時發 田本發明使用TEM⑽高斯束時,產生具有高斯輪廓之 可义尺寸比橢圓形點區。此等實施例亦可能包括一過濾器 構件以在產生步驟中修改束的振幅及/或相位分佈,並藉以 修改點區形狀及輻照輪廓。譬如,使用一諸如寇丁里 (Cordingley)的相位板等過濾器,藉以生成一導致高帽點區 形狀之束輪廓。在產生束的步驟中包括此過濾器時,施加 至束的定型係連同束的尺寸比一起將過濾器壓印定型,因 此*,經過濾的點區形狀係具有可變的尺寸比及定向,正常 圓形的高帽將轉變為一可控制式橢圓形高帽點區。 利用旋轉性對稱過濾器來生成類似圓高帽形等對稱 點區。可使用並非旋轉對稱性的其他過濾器來生成標稱非 旋轉對稱性點區。可連同空值擴大(null expansi〇n)使用具 有4摺對稱性的過濾器,藉以大致沿著正交軸線生成可變^ 二區。譬如,一產生正方形點區形狀(亦即第16圖)的過濾 器係可產生與如第17及1 8圖所示之過濾器定向對準之可變 式規則點區。高斯束定型的理論描述請見福瑞德m.迪齊, =考特C.(Fred M· Dickey,Scott C.)所編之“雷射束定型:理 淪及技術,,浩斯魏德(Holswade),紐約,Marcel Dekker 2〇〇〇 的第三章。 ’ 在一種直線束轉換過濾器的情形中,較佳係矯正旋轉 '、紙張尺度適用中國國家標準(CNS) A4規格(2歉297公茇) Ϊ271904 A7 ' ^---------- B7 _ 五、發明説明(j/) " ~ 的非''、泉丨生以維持經過一可變範圍所定型的點區對於目標之 且對於中間非正交點區定向而言,影像旋轉係為 較佳方式。 熟悉此技藝者瞭解:可能有其他種未對準的定向,譬 如,正方形點區可能變成一可變菱形,當然可使用其他對 稱與不對稱性過濾器來生成具有可控制式空間性特徵的點 區热悉光學過濾技藝者已習知如以下各案揭露的各種替 代方式·美國專利5,300,756號(寇丁里);美國專利5,864,430 號(迪齊);及美國專利5,917,845號(撒立司(Sales)等人)。 本發明的一實施例中可採用諸如步進馬達及伺服馬 達等許多類型的旋轉式致動器,藉以動態地控制束放大器 的疋向、因而動態地控制雷射尺寸比大小及定向。當需要 兩速操作日守,光學裝置的轉動慣量可能降低,且可能使用 閉迴路伺服控制式致動器。較佳將歪像束放大施加於光束 路徑中具有較小束徑的一點,使用一聚光器/放大器配置亦 有助於卩牛低光學裝置的慣量。影像旋轉領域的改良(尤其在 同速致動器及(零慣量)固態元件)將可望對於本發明提供 直接利益。 一傳播束係入射在一第一歪像束放大器、一第二歪像 束放大器及一包括一物鏡的掃描系統上,第一束放大器係 將束的輻照圖型轉接至一具有預定尺寸比的第一橢圓上, 一第一束旋轉構件係控制第一橢圓束輻照圖型的定向,第 -橢圓束係人射在H像束放A器上且其巾橢圓軸線 係定向為與第二歪像束放大器呈現預定的定向。第二歪像 24夺紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 22 (請先閲讀背面之注意事項再填寫本頁) 訂- 1271904 、發明説明(2〇 束放大器係將第一橢圓束輻照圖型轉接至-第二橢圓輕照 圖型,一第二束旋轉器係控制第二橢圓束的定向。 第及第一歪像束放大器較佳係為相同的光學元 車乂 ^第正像束放大器相對於第二歪像束放大器之 旋轉係包含第-束旋轉器,且第一及第二歪像束放大器的 旋轉係包含第一束旋轉器。熟悉此技藝者瞭解:可使用一 或兩個分離的影像轉子來取代旋轉的歪像束放大器其中任 一者或兩者。 較佳,各歪像裝置的放大係大於MG.5,其中Μ為所需 要的歪像放大率。 一項實施例中,各束放大器係為如第1圖所示藉由 SF14玻璃製成之一對3〇_6〇-9〇度稜鏡1〇、12、14、16所組 成。稜鏡面A、Β、C係分別相對構成30、60、90度角。各 束放大器以下述方式運作,第一稜鏡係作為使束折射的3〇 度楔件’第一表面B與輸入束呈法向並具有防反射塗覆, 第一表面C係接近布魯斯特角(Brewster,s angie)以降低反 射損失’折射束係與光學軸線偏離約6〇度角,第二稜鏡的 定向可使得斜邊C平行於輸入束轴線且使得面a與背離第 一稜鏡之束呈法向。束係透射通過AR塗覆面a並約以60度 角入射在件邊C上,入射角係足以產生TIr反射,偏離的束 此時係受到反射而反向回行,此束現在傳播至第二稜鏡的 面B並以大約接近布魯斯特角的3 〇度角入射,將稜鏡設定 相對位置以使得此束大致在輸入光學軸線的高度與面B交 會。此束在光學軸線上的一點從面B折射時係沿著光學轴 [漆紙張尺度適用中國國家標準(CNS) M規格(21〇χ297公釐) 23 (請先閲讀背面之注意事項再填寫本頁) 訂— 1271904 A7
1271904 A7 -------- —__B7 五、發明説明(22 ) 系統介面、一動力介面及驅動器。 系統控制器產生控制訊號,控制訊號係依據代表譬如 目標材料的預定位置及定向等目標特徵的參考資料藉以控 制雷射源及χ,γ掃描系統並且亦控制產生器及旋轉器。 本發明的另一實施例中,複數個光學路徑具有一光學 開關以在光學路徑之間作切換,各光學路徑係包含一組獨 特的光學構件。譬如,兩路徑各包括歪像光學裝置以控制 點區尺寸比並對準此點區軸線的定向。兩光學路徑之束的 疋向係可使得各點區的主要軸線對準至一正交的目標特 性。譬如美國專利3,753,608號所揭露(聚焦用)之一種多路 徑、以偏振為基礎之光學開關係在正交的點區狀態之間提 供快速切換。當在兩或更多種固定狀態之間作正交切換 時,各路徑係包括固定式歪像放大,但可藉由本發明揭露 的歪像光學裝置來達成具有任意定向之可變式尺寸比點 區。 弟22圖顯示一項此種實施例,一經偏振輸入束12〇可 能係為一偏振旋轉器的輸出,譬如為一電腦控制液晶裝 置。讓渡予本發明受讓人並以引用方式整體併入本文之美 國專利6,1 81,728號中係描述一種偏振控制器以及使用經 疋向的偏振束來處理結構物。輸入偏振可能譬如為兩種正 交偏振中的一者,束分光器121將如圖示沿著兩光學路徑 122、123使束通過,各路徑包括各種摺疊鏡面124及歪像光 學構件125藉以改變束的尺寸比及定向,隨後將束重新導向 偏振束分光器 '组合件”126藉以使束回到原始路徑。隨後可 2;|許紙張尺度適用中國國家標準(CNS) Μ規格(21〇χ297公愛) (請先閱讀背面之注意事項再填寫本頁) 訂— 25 五、發明説明(23 ) 能使用-第二偏振旋轉器」 2 後將,tl·由认、、, 木k擇束128的輸出偏振,然 ' win子系統並聚焦 出偏振構件127可处炎. 上 A者,輸 板絲以轉變—》形偏振或光 =:t偏振的輸送束,熟悉此技藝者瞭解亦可 以利對:::的^化方式’且可將各種組件添加至子系統 以利對準及提供長期指向性的穩定度。 ,切換作用可能係介於傳遞不同束旋轉量之路徑之 此構造巾’至少—光學路徑的偏絲線可能變得鱼歪 ^束轴線並㈣準,彻—❹個四分之—波板對於特定 ^徑將偏振軸線與束重新對準。美國專利4,3i8,59i號揭 路-種正交偏振切換式影像旋轉器,藉以相對於 點區軸線維持此偏振軸線。 形 ―可能以串列方式使用兩或更多個切換式路徑,其中提 供第-複數個束路徑以控制—點區特性,且第二複數個束 路杈係遵循第一複數個束路徑以控制一第二特性。譬如, 一第-偏振束開關係以不同的歪像束放大量來切換兩個路 徑,譬如2倍及3倍尺寸比。並利用—第二偏振束來切 倍及3倍尺寸比束,藉以控制正交定向。 、 目私特彳政可能係包括定向、尺寸(亦即長度、寬度、厚 度)、以及譬如所測得電阻等量測特徵。特徵可能係為預定 或在雷射處理操作時所測得並藉由程序回饋加以監測。 第15圖類似第14圖,但差異在於裝置丨及2代表本發明 之先前描述、的較佳實施例,其中驅動器係驅動用於轉動歪 像裝置之致動器。 1271904 A7 ---—-----—__ B7__ 五、發明説明(Μ) ""-- 本發明係適用於㈢及脈衝式雷射處理操作,亦可以 毫微微秒雷射處理系統來施用本發明,其中可藉由一精密 控:式燒錄臨界值進行選擇性材料移除;或者施用為微微 秒耗圍之類#的狹窄脈衝系、统,此應用中,在選擇光學組 件時係考慮到光學構件的分散。 實際上,經修改的點區係定位於沿著目標的各點上, -項實施例中,可藉由雷射束及目標與_低慣量束定位系 統之相對定位來達成領域中之高速度、順序性的點區定 位s如,可使用如下案描述並為熟悉雷射處理技藝者所 瞭解之一固態束偏向器或電流測定性掃描系統:歐佛貝克 (Overbeek)之美國專利 5 飘 759、4 532,術、up·號。 已熟知對於向量及隨機存取掃描採用電流計及/或聲_ 光偏向為',其他實施例可能係包括微鏡面、輕重量衍射光 學構件或沿著一或多個軸線的活動鏡片。同樣地,可選擇 一組合件進行多軸線式掃描。 讓渡予本發明受讓人的美國專利5,998,759號亦揭 露·在電腦控制下,使用一外部調變器依需要提供雷射脈 衝,各雷射脈衝係與一目標位置相關聯。藉由此方式,一 般係可以包含:在領域(譬如一指定標示代碼或者一橫行或 直列之一連串的選定微觀目標結構)内從一連串重疊點區 形成一線(譬如雷射切縫)一直到任意圖型等等各種可能 性。 另一實.施例中,可能如美國專利6344,^ 8號所示利用 雷射處理裝置的粗略動作以及精密平移階級動作之一組合 1271904 五、發明説明(μ 件來進仃經修改的雷射束及目標之相對定位,其中細微階 級係支撐一個半導體晶圓。這可合併使用,759號專利所描 述的卩通廷脈衝(pulse on demand),,方式來移除鏈接件或處 理其他微型結構。 ,可使用各種組合件,美國專利5,847,960及5,751,585號 係描述使用高速度束定位器(譬如電流計)與緩慢的平移階 、’及之、、且a件之雷射束的相對定位之各種實施例。 第2 3圖以抓私方塊圖提供本發明之一種方法所使用 的各種處理步驟之總結。 這些技術不論單獨使用或合併使用均適用於包括以 下的微加工應用:雷射鑽製、修整、半導體鏈接件吹製、 屏罩修理及其他。 雖然已經圖示及描述本發明之實施例,這些實施例並 未顯示及描述本發明所有可能的形式。而是,說明書採用 的文字僅供示範而非限制性質,並瞭解可作出各種改變而 不脫離本發明之精神與範圍。
(請先閲讀背面之注意事項再填寫本頁) 28 1271904 A7 B7 五、發明説明(26 ) 10、12、14、16···棱鏡 100…金屬鏈接件 102···點區 105…偏移 10 6…對準 10 7…偏移的橢圓形 108···經聚焦的線 109···橢圓形 120···經偏振輸入束 121···束分光器 122···光學路徑 123···光學路徑 元件標號對照 124…摺疊鏡面 125…歪像光學構件 126…偏振束分光器“組合件” 127···第二偏振旋轉器 128…束 A…AR塗覆面 Al、A2及Bl、B2···構件 B…第一表面 C…第二表面 0 b…偏振旋轉 <9r···波板旋轉 (請先閲讀背面之注意事項再填寫本頁)
222本紙張尺度適用中國國家標準(0^) M規格(210X297公釐) 29

Claims (1)

1271904 }iL太 六、申請專利範圍 第91106212號專利申請案申請專利範圍修正本 95.3.17 1 · 一種高速度、精密度及以雷射為基礎在一領域内處理 至少一目標的材料之方法,該方法包含: 沿著一傳播路徑產生一雷射束; 可控制式修改该雷射束’以獲得一經修改的雷射 束;及 在該領域内將該經修改的雷射束順序性及相對性 定位在各目標上之至少一點區中以處理各目標的材 料,其中該至少一點區係具有藉由該可控制式修改步 驟所獲得之一組所需要的空間性特徵,其中包括一可 調式尺寸比。 如申請專利範圍第丨項之方法,其中該至少一點區係 ^有-對軸線’且其中該經修改的雷射束係聚焦在該 等兩軸線中的一大致共同點上。 如申請專利範圍第1項之方法 係大於0 · 1但小於10。 如申请專利範圍第1項之方法 位於該領域内。 如申請專利範圍第1項之方法 性定位步驟係包括向量掃描該經修改的雷之 驟。 如申請專利範圍第W之方法,其中係在該順序性及 該經修改的雷射束之步驟期間重覆該可 k制式修改該雷射束之步驟,使得該至少―點區且有 2. 3. 4. 5. 6. 其中該可調式尺寸比 其中該等多個目標係 其中該順序性及相對 30 1271904 六、申請專利範圍 至少一第二組所需要的空間性特徵。 7·如申請專利範圍第1項之方半,甘士〆 去其中係依據各目標的 至少-目標特徵來決定該組所需要的空間性特徵。 如申請專利範圍第㈣之方法,其中係依據各目標的 至少一目標材料性質來決定該組所需要的空間性特 徵。 如t請專利範圍第1項之方法,其中係依據至少-程 序變數來決定該組所需要的空間性特徵。 1〇.如申請專利範圍第1項之方法,其中係依據至少-所 需要的雷射材料處理特徵來決定該組所需要的空間 性特徵。 如”專利範圍第旧之方法,其中該產生步驟係包 括足型”射束之步驟,藉以改變該尺寸比及獲得一 具有-弟-長形輻照圖型之經修改的束,該第一長形 2照圖型係具有一第一定向,且其中該經修改的束係 輸送並聚焦至該至少一點區中。 12·如申請專利範圍第η項之方法,其中該產生步驟係包 括進-步定型該經修改的雷射束之步驟,藉以獲得一 具有-第二長形輕照圖型之雷射束,該第二長形幸畐照 圖型係具有一第二定向。 13. 如申請專利範圍第12項之方法,其中該可控制式修改 步驟係依據目標定向來控制該等第_及第二定向之 絕對定向。 14. 如申請專利範圍第12項之方法,其中該定型步驟係進 8. 9. 11
3] 1271904 、申請專利範圍 驟 步包括控制該等第一及第二定向的相對定向之步 15·如:請專利範圍第!項之方法,其中該順序性及相對 性定位步驟係將該束輸送及聚焦在沿著一雷射處理 路,伸之複數個點區中’其中各該等點區的尺寸比 1及定向係依據各目標的預定尺寸及目標定向而定。 6·如申請專利範圍第15項之方法,其中該雷射處理路徑 係為一曲線路徑。 17. 2中請專利範圍第15項之方法,其中各該等點區係為 :具有一主要軸線的長形點區,且其中至少一該等點 區的主要軸線係與該雷射處理路徑相對準。 如申凊專利範圍第丨5項之方法 _ 刃泰其中各該等點區係為 一具有一主要軸線的長形點區,且其中至少一該等 區的主要轴線係與該雷射處理路徑呈橫向。/、 • 2申請專利範圍第1項之方法,其中依據各目標的 疋尺寸及目標定向來控制該至少一點區的定向及 尺寸比。 2〇·=請專利範圍第】項之方法,其中該產生步驟係 括過濾該雷射束以獲得一 于、、工仞步修改的點區形狀 步驟。 21. 如申請專利範圍第2 ,^ 万去,其中該產生步驟係 括過濾該雷射束以獲得一細 廓之步驟。 、-初步修改的點區輻照輕 22. 如申請專利範圍第】項 7 β,其中該處理係為微加
18. 點 預 包 之 包
32 1271904 申請專利範圍 工 23.如申請專利範圍 導細負之方法,其中该處理係包括半 夕除、f射修整、雷射鑽製或雷射钱刻。 25 .。專利範圍第1項之方法,其中該順序性及相對 性疋位步驟係將該經修改的束輸送及聚焦在沿著一 田=處理路fe掃描之_點區中,其中該點區的尺寸比 及疋向係依據各目標的預定尺寸及目標定向而定。 如申j專利範圍第1:[員之方法,其中該經修改的束係 /、有#圓形南斯束的一輻照圖型。 I如申:專利祀圍第1項之方法,其中該經修改的束係 具有-種在-方向呈一高帽式且在與該方向正交的 一方向呈高斯式之輻照圖型。 27. 一種高速度、精密度及在—領域内處理具有預定尺寸 及一特徵的至少—目標的材料之系統,該系統包含: 一㈣源’其用於沿著-傳播路#產生—雷射束 並具有-輻照圖型,該輕照圖型係在與該傳播路徑大 致垂直的一平面中具有一尺寸比及一定向; -控制器,其用於依據該特徵產生包括定向控制 訊號之控制訊號; -第-子系統’其配置於該傳播路徑中以依據該 等預定尺寸來定型該雷射束,藉以改變該尺寸比及獲 得一經修改的束; 一第二子系統,其用於依據該等定向控制訊號來 可控制式改變該輻照圖型的定向;及 1271904
六、申請專利範圍 束輸送及水焦子糸統’其用於將該經修改的束 順序性定位及聚焦在各目標的至少一點區中以處理各 目標的材料。 28·如申請專利範圍第27項之系統,其中該第一子系統係 包括一用於定型該雷射束之第一歪像光學元件,藉以 獲得一具有一第一長形輻照圖型之經初步修改的雷 射束’該第一長形輻照圖型係具有一第一定向。
29·如申請專利範圍第28項之系統,其中該第一子系統係 包括一用於進一步定型該經初步修改的雷射束之第 二歪像光學元件,藉以獲得該具有一第二長形輻照圖 里之經修改的束,該第二長形輻照圖型係具有一第二 疋向。 30·如申請專利範圍第29項之系統,其中該第二子系統係 包括至少一用於移動該等歪像光學元件之致動器,藉 以回應該等定向控制訊號來控制該等元件之絕對定 向。
31·如申請專利範圍第3〇項之系統,其中一致動器係移動 ▲:違寺歪像光學元件,卩回應該等控制訊號來控制 该等元件的相對定向。 如申睛專利範圍第27項之系統,其中該束輸送及聚焦 系、、'先係將遠經修改的束順序性定位及聚焦至沿著 的田射處理路徑延伸之複數個點區’其中各該等點區 尺寸比及定向係依據該等預定尺寸及目標定向而 定。 34 1271904 、申請專利範圍 其中該雷射處理路徑 33 ·如申請專利範圍第32項之系統 係為一曲線路徑。 34. 36. 如申請專利範圍第32項 丹平各該等點區係為 具有一主要軸線的長形點區,且其中至少一該等點 區的主要軸線係與該雷射處理路徑相對準。 ” ^申請專利範圍第32項之线,其中各該等點區係為 。具有一主要軸線的長形點區,且其中至少一該等點 區的主要軸線係與該雷射處理路徑呈橫向。 如申請專利範圍第27項之系統,纟中該第—子系統係 包括-橢圓產生器,且其中該經修改的束之輻照圖案 係為一橢圓形輻照圖型,且該至少一點區係為至少一 橢圓形點區。 37·如申請專利範g第36項之系統,其中該第二子系統係 包括一束旋轉器以轉動該經修改的束。 38·如申請專利範圍第27項之系統,#中依據該等預ϋ 寸及目標定向來控制該至少一點區的定向及一尺寸 比。 39·如申請專利範圍第27項之系統,其中該處理係為微加 工° 40.如申請專利範圍第27項之系統,其中該處理係包括半 導體鏈接件移除、雷射修整、雷射鑽製或雷射蝕刻。 41·如申請專利範圍第27項之系統,其中該系統係補償將 導致一偏離圓形或一偏離橢圓形狀況之系統誤差。 42.如申請專利範圍第27項之系統,其中該第一子系統係 1271904
43. 44. 45. 2 乂直列式或補償式偏移光學路徑為基礎之一 口疋式放大器/旋轉器。 如申請專利範圍第27項之系統,丨中該第-子系統係 匕括複數個未偏移稜鏡對。 申明專利圍第27項之系統,其中該第—子系統係 包括一多構件式球形-圓柱形放大器。 如申請專利範圍第27項之系統,其進_步包含一用於 過濾該雷射束之過濾器,藉以獲得一經初步修改的點 區形狀。 饭如申請專利範圍第27項之系統,其中該第二子系統係 包括一轉接性光學構件。 47.如申請專利範圍第27項之系統,其中該第一子系統係 包括一轉接性光學構件。 48·如申請專利範圍第27項之系統,其進一步包含一用於 過濾該雷射束之過濾器,藉以獲得一經初步修改的點 區幸S照輪廓。 49·如申請專利範圍第27項之系統,其中該束輸出及聚焦 子系統係將該經修改的束順序性定位及聚焦在一點 區中’該點區係沿著一雷射處理路徑受到掃描,其中 該點區的尺寸比及定向係依據該預定尺寸及目標定 向而定。 5 0.如申s月專利範圍弟2 7項之糸統’其中該轄照圖型係為 一橢圓形高斯束。 51.如申請專利範圍第2 7項之系統,其中該_照圖型係在
-36 - 1271904 六、申清專利範圍 一方向為一高帽且在與該方向正交的一方向為高斯 52· —種兩速度、精密度及以雷射為基礎在一領域内處理 至少一目標的材料之方法,該方法包含: a) 沿著一傳播路徑產生一雷射束; b) 可控制式修改該雷射束,以獲得一經修改的雷 射束; c)在該領域内將該經修改的雷射束順序性定位在 目私上之至少一點區中以處理該目標的材料,其中 該至少一點區係具有藉由該步驟b)所獲得之一組所需 要的空間性特徵,其中包括一可調式尺寸比;及 目標的材料均受到處理為止 53. 54. 55. 如申請專利範圍第52項之方法,其進—步包含:心 :程序、材料及目標特徵其中至少—者藉以獲得資 枓’其中該步驟b)係以該資料為基礎。 、 如申晴專利範圍第5 3項之方法,甘ώ外土 各曰貝之方去’其中該步驟句係對於 各目私重覆步驟a)至c)及步驟e)直到 標的材料均受到處理為止。 〃所有目 如申請專利範圍第3項之方法,其中該 係大於0.33但小於3。 ⑼工尺寸比 該微結構係為一 部份,該至少一 指定區域,該方 一種用於處理至少一微結構之方法, 含有複數個微結構之多材料元件的一 U結構係具有用於移除目標材料之一 37 56. 1271904 =、申請專利範圍 法包含: 產生一雷射束;
修改該雷射束,以獲得—經修改的雷射束;及 將该經修改的雷射束順序性與相對性定位在該指 定區域上之至少一非圓形點區中,該至少一非圓形點 區具有-預定的非圓形能量分佈,藉以移除該指定區 域中的目標材料,其中該預定的非圓形能量分佈係覆 蓋該指定區域的一面積,所以相較於-覆蓋相同面積 的圓形能量分佈所耗合入該指定區域中之能量,該非 圓形能量分佈係將能量更有效率地耗合入該指定區域 中。 π ^請專利範圍第56項之方法,其中該狀非圓形能 置分佈係包括以下預先指定的特徵:一尺寸比、—聚 焦的點區尺寸、一定向、聚焦深度及—聚焦的輻照分 佈。
58.如申請專利範圍第56項之方法,其中該至少-微結構 係為一具有一長度之鏈接件結構且該多材料元件係 為一半導體元件,且其甲該指定區域係位於其間作並 不包括對於該鏈接件結構之電接觸部。 59·如申請專利範圍第58項之方法’其中該指定區域係小 於9亥寺接觸部之間的鏈接件結構長度之80%。 6〇·如申請專利範圍第58項之方法,其中該至少-非圓形 點區係具有與該鏈接件結構長度對準之一主要輛線^ .如申請專利範圍第60項之方法,其中該至少一非圓形 38 1271904 六、申請專利範圍 點區係具有大於約1 ·2之一尺寸比。 62. 如申請專利範圍第60項之方法,其中該至少一非圓形 點區係具有大於約L2且小於該鏈接件結構長度的約 80%之一尺寸比。 63. 如申請專利範圍第6〇項之方法,其中該至少一非圓形 點區係具有大於1 · 5之一尺寸比。 64·如申請專利範圍第56項之方法,其中該至少一微結構
係具有-長方形,該長方形的窄邊係具有小Μ微求 的尺寸。 认如申請專利範圍第56項之方法,其中該至少一微結構 係具有一長方形,該長方形的窄邊係具有小於0.8微米 的尺寸。 66·如申請專利範圍第 〆 貝之H其中該至少-微結構 〃有I方开/ „玄長方形的窄邊係具有小於微米 的尺寸。
π如申請專利範圍第56項之方法,其中該至少一微結構 係在该指定區域中具有至少為4 ··丨之_尺寸比。 68·如申請專利範圍第% 、方法,其中該等微結構係位 方、忒70件的一半導體基材上。 其中δ亥非圓形能量分 其中該非圓形能量分 69·如申請專利範圍第56項之方法 佈係為橢圓形高斯式。 70·如申請專利範圍第56項之方法 大 —維度中為-高帽且在;該::: 又的一弟二維度中為高斯式。 39 1271904 Γ、申請專利範圍 7Ι· Π:專利範圍第7°項之方法,其㈣-維度係沿 者该至少一微結構的一長度。 72H#·"56項之方法’其中重覆該定位步 複數二Γ具有相對應複數個預定非圓形能量分佈之 73 1 形點區來處理—領域中的複㈣微結構。 有如申料利範_之方法,其中各非圓形點區具 ^向且各微結構具有4向,且其中該定位步驟 之向等非圓形點區的定向對準至該等微結構 74 理利耗圍弟73項之方法,其令該等複數個受處 里的嘁結構之定向係為正交定向。 構利耗圍弟73項之方法,其中依據預定的微結 構疋向來自動地控制該對準步驟。 76·==利範圍第75項之方法,其中該等預定的微結 構疋向係包含在一晶圓修理檔案中。 77.=利範圍第72項之方法,其中該等喻 、、Ό構係為_多材料冗餘記憶體元件之金屬鍵接件。 包 括使β亥至少一非圓形點區的一軸線與該至少 I如申請專利範圍第56項之方法,其中該定 括使該δ小_ Α㈤^ — — . . ^ 微結 構對準之步驟 79·如申請專利範圍第78項之方法,其中該對準步驟係自 動地進行,且其中該對準步驟係包括將該雷射束切換 至複數個光學路徑其中的一者。 、 80.如申請專利範圍第79項之方法,其中該雷射束受到偏 40 1271904
振’且其中該切換步驟係包括可控制式修改該雷射束 的偏振。 A如申請專利範圍第79項之方法,其中該切換步驟係包 括错由-歪像光學系統可控制式地修改該雷射束。 I如申請專利範圍第78項之方法,其中該對準步驟係包 括至少半自動地調整該至少一非圓形點區的一主要
83·如申請專利範圍第78項之方法,其中該對準步驟係包 括提供電腦產生的訊號,藉以自動調整該至少__ 形點區的一主要軸線。 84·如申請專利範圍第83 一 ^貝之方法,其中該對準步驟係進 -步包括回應於定向控制訊號而自動地移動一光學 85. 86. 87. 如申請專利範圍第84項之方法,其中該移動光學子李 統之步驟係、包括移動該子系統之—歪像光學板件 如申請專利範圍第56項之方法,纟中該元件中所包含 之微結構係以橫列與直行規則地配置。 如甲请專利範圍第56項之方法,#中該預定的非s 能量分佈係依據使該指定區域的_剖面與該至少 非圓形點區的形狀產生關聯之一種輻 用的靠模加工。 其中該靠模加工係為 其中該靠模加工係為
88·如申請專利範圍第87項之方法 一熱靠模加工。 89.如申請專利範圍第87項之方法 41 1271904
42 1271904
、申請專利範圍 量並未降低。 97·如申請專利範圍第56項 ^^f ^ ,、 法,其中係乾淨地移除該 才曰疋s域中之目標材料。 98.如申請專利範圍第% . g,a ,,,、之方法,其中係移除該指定區 A T之目;f示材料而不俊 從材抖不良地改變到達該元# 的相鄰微結構。 又』運Θ兀件 "·如申請專利範圍第56項 ^ ^ 、之方法,其中係移除該指定區 的鋪覆層。 材枓不良地改變到達該元件 100·如申請專利範圍第56項之 ,.. 方去’其中係移除該指定區 或中之目標材料而不使材 '斗不良地改變到處達該元 件的一基材。 101·如申請專利範圍第56項 仗# θ ^决’其中該非圓形能量分 布係具有與該至少一微姓 冓的一邊緣相平行之一邊 緣輪廓。 102.如申請專利範圍第98項之方 其進一步包含增加該 至 一非圓形點區的最大能量之步驟。 1〇3.如申請專利範圍第99項之方法,甘、 其進一步包含增加該 至夕一非圓形點區的最大能量之步驟。 4.如申晴專利範圍第1⑽項之 _ n 貝<万去,其進一步包含增加 忒至少一非圓形點區的最大 l〇c , ^ 犯里之步驟。 • ϋ申晴專利範圍第97項之方法, 其進一步包含減少該 主 >、一非圓形點區的最小能量 | <步驟。 43
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