AU2001293288A1 - Laser processing of alumina or metals on or embedded therein - Google Patents

Laser processing of alumina or metals on or embedded therein

Info

Publication number
AU2001293288A1
AU2001293288A1 AU2001293288A AU9328801A AU2001293288A1 AU 2001293288 A1 AU2001293288 A1 AU 2001293288A1 AU 2001293288 A AU2001293288 A AU 2001293288A AU 9328801 A AU9328801 A AU 9328801A AU 2001293288 A1 AU2001293288 A1 AU 2001293288A1
Authority
AU
Australia
Prior art keywords
alumina
metals
embedded
laser processing
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001293288A
Inventor
Kevin P. Fahey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/803,382 external-priority patent/US20020033558A1/en
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of AU2001293288A1 publication Critical patent/AU2001293288A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Magnetic Heads (AREA)
AU2001293288A 2000-09-20 2001-09-19 Laser processing of alumina or metals on or embedded therein Abandoned AU2001293288A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US23391400P 2000-09-20 2000-09-20
US23391300P 2000-09-20 2000-09-20
US60233914 2000-09-20
US60233913 2000-09-20
US09803382 2001-03-09
US09/803,382 US20020033558A1 (en) 2000-09-20 2001-03-09 UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
PCT/US2001/042224 WO2002024395A1 (en) 2000-09-20 2001-09-19 Laser processing of alumina or metals on or embedded therein

Publications (1)

Publication Number Publication Date
AU2001293288A1 true AU2001293288A1 (en) 2002-04-02

Family

ID=27398489

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001293288A Abandoned AU2001293288A1 (en) 2000-09-20 2001-09-19 Laser processing of alumina or metals on or embedded therein

Country Status (3)

Country Link
US (1) US20020063361A1 (en)
AU (1) AU2001293288A1 (en)
WO (1) WO2002024395A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040134894A1 (en) * 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US7723642B2 (en) * 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US6281471B1 (en) 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US7838794B2 (en) 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US7671295B2 (en) * 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US20030222324A1 (en) * 2000-01-10 2003-12-04 Yunlong Sun Laser systems for passivation or link processing with a set of laser pulses
US20060141681A1 (en) * 2000-01-10 2006-06-29 Yunlong Sun Processing a memory link with a set of at least two laser pulses
US6972268B2 (en) 2001-03-29 2005-12-06 Gsi Lumonics Corporation Methods and systems for processing a device, methods and systems for modeling same and the device
US6650511B2 (en) * 2002-02-11 2003-11-18 International Business Machines Corporation Magnetic head assembly with electrostatic discharge (ESD) shunt/pads seed layer
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6960813B2 (en) * 2002-06-10 2005-11-01 New Wave Research Method and apparatus for cutting devices from substrates
US6949449B2 (en) * 2003-07-11 2005-09-27 Electro Scientific Industries, Inc. Method of forming a scribe line on a ceramic substrate
US20060027542A1 (en) * 2004-04-28 2006-02-09 Niraj Mahadev Method to eliminate defects on the periphery of a slider due to conventional machining processes
GB0518843D0 (en) * 2005-09-15 2005-10-26 Plastic Logic Ltd A method of forming interconnects using a process of lower ablation
US8624157B2 (en) * 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US20070272666A1 (en) * 2006-05-25 2007-11-29 O'brien James N Infrared laser wafer scribing using short pulses
CN103111762B (en) * 2013-01-29 2015-12-09 无锡鼎晶光电科技有限公司 A kind of method laser boring being applied to sapphire sheet punching
US8767351B1 (en) * 2013-01-31 2014-07-01 Seagate Technology Llc Ambient temperature ball bond
US10639746B1 (en) * 2014-06-20 2020-05-05 Apple Inc. Ceramic-based components having laser-etched markings
CN105108342B (en) * 2015-09-18 2017-03-22 南开大学 Method for preparing two-dimensional metallic photonic crystal structure in large area through femtosecond laser direct writing
CN105400514B (en) * 2015-11-12 2018-01-19 西安交通大学 A kind of orderly patterning remote fluorescence crystalline material and its production and use
US9691419B1 (en) * 2015-12-17 2017-06-27 Seagate Technology Llc ESD protection surface charge control recording head
US10989450B1 (en) * 2016-07-13 2021-04-27 Triad National Security, Llc Solid-state optical refrigerator for cryogenic cooling of payloads
CN107081530B (en) * 2016-12-28 2019-11-26 净化控股集团股份有限公司 A kind of experimental provision for nanoparticles prepared by laser ablation structural experiment
CN112783264A (en) 2019-11-11 2021-05-11 苹果公司 Biometric key including textured ceramic cover
US11113494B2 (en) 2019-11-11 2021-09-07 Apple Inc. Biometric key including a textured ceramic cover

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5465186A (en) * 1994-01-26 1995-11-07 International Business Machines Corporation Shorted magnetoresistive head leads for electrical overstress and electrostatic discharge protection during manufacture of a magnetic storage system
US5759428A (en) * 1996-03-15 1998-06-02 International Business Machines Corporation Method of laser cutting a metal line on an MR head
US5699212A (en) * 1996-05-01 1997-12-16 International Business Machines Corporation Method of electrostatic discharge protection of magnetic heads in a magnetic storage system
US6057180A (en) * 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output
US6146813A (en) * 1999-01-13 2000-11-14 Applied Kinetics Inc. Method and shunting and deshunting an electrical component and a shuntable/shunted electrical component

Also Published As

Publication number Publication date
WO2002024395A1 (en) 2002-03-28
US20020063361A1 (en) 2002-05-30

Similar Documents

Publication Publication Date Title
AU2001293288A1 (en) Laser processing of alumina or metals on or embedded therein
AU2001275164A1 (en) Direct selective laser sintering of metals
EP1241577A3 (en) Methods and arrangements for improved parity-stripe processing
AU2001244916A1 (en) Processing of documents
AU2001210146A1 (en) Determination of deformation of surgical tools
AUPR647801A0 (en) Chromatin segmentation
AU2002305523A1 (en) Dioxanes and uses thereof
AU2002338574A1 (en) Compensation-data processing
AU2002356409A1 (en) Distributed document processing
AUPR341001A0 (en) Data processing
AUPR317201A0 (en) Extraction of Metals
GB0119974D0 (en) Laser systems
WO2002080067A1 (en) Information processor
AU2002219900A1 (en) Minimal identification of features
AU2001280162A1 (en) Personal information protective method
GB0118913D0 (en) Recording surface relief microstructure
AU2002365354A1 (en) Case and case holder
AU2001229798A1 (en) Removal of metals from solution
AU2001295954A1 (en) Information processing system
AU2001274345A1 (en) Processing an object
AU2001238041A1 (en) Separate account processing
AUPR811501A0 (en) Voucher processing
AU4863901A (en) Data processing
AU2002304425A1 (en) Signal processing
AU2002227315A1 (en) Portable laser processing system