US8350187B2 - Method and apparatus for laser machining - Google Patents
Method and apparatus for laser machining Download PDFInfo
- Publication number
- US8350187B2 US8350187B2 US12/413,531 US41353109A US8350187B2 US 8350187 B2 US8350187 B2 US 8350187B2 US 41353109 A US41353109 A US 41353109A US 8350187 B2 US8350187 B2 US 8350187B2
- Authority
- US
- United States
- Prior art keywords
- laser
- feature
- workpiece
- pulse
- curved path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Definitions
- This invention relates to methods and apparatus for laser machining workpieces.
- it relates to laser machining trenches or guides in the surface of electronic substrates which can be subsequently processed in order to form conductors or waveguides.
- it relates to laser machining trenches or guides in the surface of electronic substrates with consistent cross-sections in order to control the electrical and optical properties of the subsequently formed conductors or waveguides.
- Directed and focused laser energy is used for a variety of manufacturing tasks requiring precision material removal such as drilling of blind and through vias in electronic circuit substrates, repair or modification of semiconductor circuits, dicing or scribing of circuit assemblies for singulation, or other complex tasks involving drilling, cutting machining, or exposure of photosensitive materials.
- Materials process range from organic circuit substrate materials such as FR-4 or ABT, semiconductor wafers of silicon or sapphire, metals or metal foils or various types of plastic or glass.
- the machining is accomplished by focusing a laser beam or laser pulses into a small focal spot proximate to the workpiece, thereby concentrating the laser energy into a focal spot which is imaged onto or near the surface of a workpiece in order to vaporize, ablate or otherwise cause the removal of material.
- This type of laser focal spot machining is particularly useful in the manufacture of electronic substrates.
- the manufacturers of electrical and electro-optic assemblies continue to strive for higher density, faster circuitry and greater integration of components in order to deliver greater value to the consumer.
- manufacturers are seeking to improve methods of interconnecting devices on substrates including electrical and electro-optic devices.
- Components are typically interconnected by attaching them to possibly multilayer substrates that have had circuit patterns applied to the surfaces of the substrates using additive or subtractive etching along with photosensitive resist applications.
- the first is that as circuit switching speeds increase, the electrical properties of the conductors on the substrate become a significant factor in limiting the speed at which the circuits can be clocked. Forming planar conductors on the surface of a substrate can exacerbate this problem. As currents and switching speeds increase, the shape of the cross-section of the conductor can become a significant factor in the electrical performance of the circuit in it occurs. In particular, changes in the cross-sectional shape of the conductor can cause unwanted changes in the conductor's impedance, which can cause reflections and signal loss. In addition, the density with which circuits can be applied to the substrate is partially a function of the size of conductors on the surface of the substrate.
- the cross-sectional topology of the channel or trench forming the waveguide is critical.
- parts of the channel in addition to acting as a waveguide, parts of the channel can be used as optical elements such as mirrors.
- the topology and the surface texture are critical elements of the channel feature in addition to the topology of the waveguide itself.
- a prior art method of forming circuits interconnects on a substrate by laser machining trenches or channels in the surface of the substrate, sometimes referred to a laser direct ablation or LDA is given in U.S. Pat. No. 7,014,727 METHOD OF FORMING HIGH RESOLUTION ELECTRONIC CIRCUITS ON A SUBSTRATE, Christopher Wargo, et. al., inventors, describing a method of forming conductors on organic-based substrates such as FR-4.
- the method described uses a laser to machine channels in a layer of resist material applied to the surface of a substrate.
- the method also describes machining this channel into the substrate. These channels are subsequently filled with conducting material to form conductors.
- This patent discloses the need to form the channels in the substrate with appropriate size, shape and depth but does not disclose or discuss any particular way to achieve this. In particular this reference does not discuss maintaining the size and shape of channels as the path is changed in direction and shape.
- channels in an electronic circuit substrate can also be used as optical waveguides.
- a description of optical waveguides is found in “Laser Ablation and Laser Direct Writing as Enabling Technologies for the Definition of Micro-Optical Elements”, by Nina Hendrickx, et. al., published in Integrated Optics: Theory and Applications, edited by Tadeusz Pustelny et. al., Proceedings of the SPIE Vol. 5956 pp 5961B-1-5961B-10.
- the authors describe using a laser to machine waveguides in substrates in order to integrate electro-optic components such as laser diodes with electronic components more closely.
- the article discusses the need to form waveguides with surface textures appropriate to optical devices and how it can be achieved, but does not discuss in detail how the shape and size of the waveguide can be controlled while laser machining.
- a problem with laser machining channels to form conductors or waveguides in electronic substrates is that in general, these channels have to change direction on the surface of the substrate in order to connect desired points. This requires that the laser machine shapes such as curves in the surface of the substrate. Machining curves in the surface using prior art laser spots will cause the channel to vary in depth as it is machined. For example Gaussian profile beam will, on translation, leave a super-Gaussian profiled groove. A round-flat profile (Top Hat profile) beam will leave a cosine-shaped groove and a square-flat profile will leave a flat square groove.
- FIG. 1 is a schematic diagram of a channel laser machined with a top hat profile beam.
- a channel 10 is laser machined into a substrate 12 with a pulsed laser beam (not shown) with a top hat or “round-flat” profile.
- the overlapped circles 14 represent positions of the laser pulses.
- the laser is indexed or moved smoothly and continuously along the path of the channel to be machined as the laser is pulsed, thereby machining a smooth and continuous feature in the substrate.
- the actual number of positions will vary depending upon the size of the laser spot, the desired width of the channel and the energy per pulse delivered to the substrate, and hence the amount of material removed per pulse.
- the number of pulse positions shown is much reduced from actual practice to show the positions more clearly.
- the amount of material removed is calculated from the cumulative dose received at each point in the channel from the multiple pulses each point receives as the pulsed beam is translated down the predetermined path that the channel will follow. All these examples would apply equally well if the laser were continuous wave (CW) rather than pulsed.
- FIG. 2 shows a diagram of a rectangular cross section channel 20 laser machined in a substrate 22 by a laser beam with a square flat focal spot, one of which is shown 24 .
- the over lapping squares, 26 represent successive positions of the laser focal spot as the channel 20 is machined.
- the number of overlapping laser focal spot positions shown is schematic and may vary in actual practice depending upon laser repetition rate, laser pulse energy, pulse size, and other laser parameters. Note that since the laser energy is distributed evenly over a square focal spot, the calculated cumulative dose received by each point in the channel is equal as the laser spot moves along the desired machining path, causing the resulting channel to have a flat bottom with square edges. This is quite often desirable in LDA applications. Note that this analysis works with both pulsed and CW lasers.
- FIG. 3 shows a diagram of a prior art laser machining system designed to machine vias in multilayer electronic substrates.
- a laser 30 which may be a pulsed, solid state UV laser emits, at the direction of the controller 32 , laser pulses 34 which are shaped by the beam shaping optics 36 which may be holographic or diffractive, which are then steered by the beam steering optics 38 , which may be multi-stage, at the direction of controller 32 , to the scan optics 40 which may be an f-theta lens, onto the workpiece 42 which may be a multilayer electronic substrate, which is fixured on a motion control unit 44 which moves the workpiece 42 in relation to the laser pulses 34 at the direction of the controller 32 and in cooperation with the beam steering optics 36 to cause the laser pulses 34 to machine the desired feature in the workpiece 42 .
- Exemplary systems employing these elements to machine features in electronic substrates are the Si5330 and the ICP5650 laser processing systems, manufactured by Electro Scientific Industries, Portland, Oreg., and the assignee of the instant invention.
- FIG. 4 is a simulation of the result of using a prior art laser machining system as described in FIG. 3 to machine a curved channel in a substrate 50 .
- a laser processing system (not shown) directs a series of square-flat laser pulses 52 onto a substrate 50 starting at pulse 54 and ending at pulse 56 , following path 57 .
- One goal of the instant invention is to describe a method and apparatus for laser machining features in electronic substrates with consistent size, depth and shape despite changes in feature path direction and shape.
- Another goal of the instant invention is to describe a method and apparatus for laser machining features with consistent size, depth and shape despite changes in feature path direction and shape by changing the shape of the focal spot in real time as the feature is being laser machined.
- FIG. 5 shows an embodiment of the instant invention that changes the shape of the laser pulse focal spot on the fly as the laser pulses machine a workpiece and thereby overcome the above-described short comings of the prior art.
- Desired laser focal spot shapes are calculated based on the shape of features being machined. Given a particular shape to be machined, a shape is chosen which, when translated and rotated through the desired feature envelope, leaves the sides and bottom of the feature in a desired smoothness and shape and maintains a desired cross-section when laser machined with the appropriate laser pulse parameters and relative motion parameters between the laser pulses and the workpiece.
- FIG. 6 shows a more detailed view of a programmable beam shaping optics assembly.
- This embodiment inserts a programmable deformable mirror into the optical path of a laser machining system to allow the system to programmably alter the focal spot shape and energy distribution of the laser pulses in real time as the system machines channels in a workpiece.
- the embodiment works by receiving the laser pulses, optionally expanding the beam out and projecting them onto the surface of a deformable mirror.
- the deformable mirror is composed of an array of actuators attached to a flexible mirror. The mirror can either be segmented to allow the actuators to move the section of mirror attached to it individually or continuous, where the actuator can move the surface of a deformable mirror up and down even though it is a continuous surface. We chose the continuous model for this embodiment.
- the mirror shapes the laser pulse by introducing phase shifts that alter the shape of the pulse much like a hologram.
- the laser light striking the surface of the mirror is collimated to have a planar wavefront as it reaches the mirror.
- the variations introduced into the surface of the deformable mirror introduce phase shifts into the wavefront that, when focused into a spot, yield particular distributions of laser energy directly related to the perturbations introduced by the deformable mirror.
- the light reflecting off the mirror is directed either to beam steering optics and then a scan lens to focus the spot down to a working size spot.
- the light reflected from the mirror is sent though optional output optics in the case where the deformable mirror is at a distance from the beam steering and scan optics and a relay lens is required to maintain beam quality.
- the deformable mirror is programmed to reflect the desired shape of the laser pulse signal to the scan lens via beam steering optics and optional relay optics, thereby creating the desired shape of the laser pulse focal spot within the resolution of the mirror.
- the deformable mirror is altering the laser pulse wavefront, it is possible to create any shape with any grayscale density possible within the resolution of the mirror.
- the system can be programmed to reflect a “grayscale” mask, where the amount of laser light projected onto the substrate can take values between 0 and 100% of the input light at any point in the laser focal spot. In this way the cumulative dose of laser radiation that an individual point in the feature receives can be accurately programmed, making complex feature shapes possible.
- This also allows the resulting focal spot to be rotated, since rotating the pattern programmed into the deformable mirror will rotate the resulting focal spot shape.
- This embodiment uses the fact that the deformable mirror is programmable and can be completely reconfigured in a little as 100 microseconds to shape the laser pulses in a completely different shape. This allows the deformable mirror to change the laser pulse focal spot shape on the fly as the feature is being machined. Calculations are made to determine how many different shapes would be required to machine a feature with the desired allowable deviations from the nominal shape and at which points the shapes should change. The system then calculates the laser parameters required to machine the feature, including number of pulses, laser repetition rate, pulse duration and pulse energy and then coordinates the pulsing of the laser with the updating of the deformable mirror and the beam steering optics to laser machine the feature.
- a feature such as a path segment for a channel to be laser machined, is examined to determine what laser focal spot shape or shapes will be used to machine the feature.
- the information can come from CAD data associated with the substrate and subsequently analyzed to extract known path segments to match up with predetermined shapes. Once the sequence of shapes is selected, the laser pulse parameters and the motion control parameters are selected to machine the feature with the desired size, shape and surface smoothness.
- the laser system then instructs the motion control subsystem and the laser pulse steering optics to move the substrate into position relative to the laser pulse axis and begins pulsing the laser.
- the deformable minor causes the laser pulse focal spot to assume the desired shape as the motion control subsystem and the laser pulse steering optics combine to change the substrate position relative to the laser pulses.
- the deformable mirror updates the shape of the laser focal spot and thereby causes the laser pulses to machine the feature with the desired consistent topology and surface finish, thereby overcoming the previously stated shortcomings of the prior art.
- FIG. 1 is a diagram showing prior art laser machining with circular-flat laser pulses.
- FIG. 2 is a diagram showing prior art laser machining with square-flat laser pulses.
- FIG. 3 is a diagram of a prior art laser machining system.
- FIG. 4 is a diagram of a curved feature machining in a substrate by a prior art system.
- FIG. 5 is a diagram of a laser machining system constructed according to an embodiment of the instant invention.
- FIG. 6 is a diagram of a programmable beam shaper constructed according to an embodiment of the instant invention.
- FIG. 7 is a diagram of a curved feature laser machined by an embodiment of the instant invention.
- FIG. 8 is a diagram of a curved feature laser machined by an embodiment of the instant invention.
- FIG. 9 is a diagram of a curved feature laser machined by an embodiment of the instant invention.
- FIG. 5 shows an embodiment of the instant invention, with a laser 70 , which may be a pulsed, solid state UV laser, emits, at the direction of a controller 72 , laser pulses 74 which are shaped by the collimating optics 76 which creates a larger, collimated pulse from the pulses emitted from the laser 70 .
- the collimating optics 76 collimates the laser pulses and expands them into the desired beam size.
- the laser pulses 74 have an effective diameter of a few millimeters at this point.
- the laser pulses 74 are then passed to the focal spot shaping optics 77 which shape the laser pulse focal spot into a desired shape at the direction of controller 72 .
- the pulses are then directed to the pulse steering optics 78 , which may be multi-stage and also controlled by the controller 72 , then on to the scan optics 80 which may be an f-theta lens, which focuses and directs the laser pulses 74 onto the workpiece 82 which may be an electronic substrate, which is fixured on a motion control assembly 84 which moves the workpiece 82 in relation to the laser pulses 74 at the direction of the controller 72 and in cooperation with the beam steering optics 78 to cause the laser pulses 74 to be directed at a desired point on the workpiece 82 , thereby machining the desired feature in the workpiece 82 .
- FIG. 6 shows details of the focal spot shaping optics 77 .
- the laser pulses 74 are received by the optional input optics 90 where the collimated pulses are magnified if necessary and projected onto the surface of the deformable mirror 92 which has a clear aperture of about 9.6 mm.
- the deformable mirror under control of the controller (not shown) modulates and shapes the laser pulses 74 before reflecting them to the optional output optics 94 , which relays the laser pulses onto the pulse steering optics 78 .
- the output optics 94 are used to relay the output of the deformable mirror 92 in cases where the mirror 92 and the pulse steering optics 78 are separated by more than a few centimeters.
- the deformable mirror 92 is constructed by attaching each actuator in an array of actuators to the back of a single flexible mirror. As the actuators move up and down they deform the surface of the mirror.
- the resolution of the actuators is such that deformable mirrors of this type can interact with the laser pulse by creating a programmable shift in the laser beam wavefront, thereby creating hologram-like interference patterns in the laser pulse, where the constructive and destructive interference of the waves shape the laser focal spot.
- One possible way to program the mirror is to calculate a series of coefficients proportional to the real, positive portion of the Fourier transform of the focal spot shape desired and use them to program the mirror.
- An exemplary deformable mirror assembly is the Kilo-DM, manufactured by Boston Micromachines Corporation, Cambridge, Mass.
- This device comprises a 32 ⁇ 32 array of mirror elements with up to 1.5 micron stroke per mirror element, with up to a 9.6 mm clear aperture.
- This device can update the entire array at a frame rate of up to 10 kHz, meaning that the laser pulse focal spot can change completely in 100 microseconds.
- FIG. 7 is a simulation of the result of using an embodiment of the instant invention as described in FIG. 5 to machine a curved channel in a substrate 100 .
- the laser processing system (not shown) directs a series of shaped laser pulses which have a basic laser pulse focal shape 101 to the substrate 100 , rotating the basic shape as required to match the curve of the channel.
- the pulses 102 are directed onto the substrate 100 starting at pulse 104 and ending at pulse 106 , following path 107 .
- the cross sections 108 , 112 and 116 of the resulting channel, taken along lines 110 , 114 and 118 , respectively, correspond to the cumulative laser radiation dose along lines 110 , 114 and 118 , respectively. Note that all cross sections 108 , 112 and 116 are acceptable, meaning that the resulting channel will have a square-sided, flat-bottomed cross section through its entire length, a desired result.
- FIG. 8 is a simulation of another embodiment of the instant invention.
- the laser processing system (not shown) directs a series of shaped laser pulses which have the basic laser focal spot shape 120 .
- this focal spot shape has been programmed to have tailored distribution of intensities across the focal spot.
- Cross section line 122 on laser focal spot shape 120 has the intensity distribution, and hence laser radiation dose 124 .
- the intensity distribution is the same for all cross sections parallel with line 122 .
- Cross section line 126 taken at right angles to cross section 122 , shows an even distribution of intensity 128 across the focal spot shape. This tailored distribution of laser energy permits this shape to machine a feature with rectangular cross section.
- FIG. 8 shows how the tailored focal spot shapes are used to machine a feature in a substrate.
- the laser pulse focal spot shapes one of which is indicated at 132 are directed onto the substrate 130 starting at pulse 134 and ending at pulse 136 , following path 137 .
- FIG. 9 shows results from another embodiment of the instant invention.
- a substrate 150 is laser machined with a laser pulse focal spot shape 151 that has edges that follow the contour of the desired feature (not shown).
- This laser focal spot shape 151 will be rotated and translated along path 157 starting at position 154 and ending at 156 .
- the laser pulse focal spots, one of which is indicated 152 will be translated and rotated to fit the desired path 157 .
- the cross sections 158 , 160 and 162 of the resulting channel, taken along lines 164 , 166 and 168 , respectively, correspond to the cumulative laser radiation dose along lines 164 , 166 and 168 , respectively. Note that all cross sections 158 , 160 and 162 are acceptable, meaning that the resulting channel will have a square-sided, flat-bottomed cross section through its entire length, a desired result.
Abstract
Description
Claims (8)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/413,531 US8350187B2 (en) | 2009-03-28 | 2009-03-28 | Method and apparatus for laser machining |
JP2012502298A JP2012521890A (en) | 2009-03-28 | 2010-03-26 | Improved method and apparatus for laser processing |
PCT/US2010/028884 WO2010117683A2 (en) | 2009-03-28 | 2010-03-26 | Improved method and apparatus for laser machining |
KR1020117022685A KR20120004426A (en) | 2009-03-28 | 2010-03-26 | Improved method and apparatus for laser machining |
TW099109058A TW201043373A (en) | 2009-03-28 | 2010-03-26 | Improved method and apparatus for laser machining |
CN2010800174075A CN102405122A (en) | 2009-03-28 | 2010-03-26 | Improved method and apparatus for laser machining |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/413,531 US8350187B2 (en) | 2009-03-28 | 2009-03-28 | Method and apparatus for laser machining |
Publications (2)
Publication Number | Publication Date |
---|---|
US20100243626A1 US20100243626A1 (en) | 2010-09-30 |
US8350187B2 true US8350187B2 (en) | 2013-01-08 |
Family
ID=42782835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/413,531 Active 2030-11-13 US8350187B2 (en) | 2009-03-28 | 2009-03-28 | Method and apparatus for laser machining |
Country Status (6)
Country | Link |
---|---|
US (1) | US8350187B2 (en) |
JP (1) | JP2012521890A (en) |
KR (1) | KR20120004426A (en) |
CN (1) | CN102405122A (en) |
TW (1) | TW201043373A (en) |
WO (1) | WO2010117683A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9346130B2 (en) | 2008-12-17 | 2016-05-24 | Electro Scientific Industries, Inc. | Method for laser processing glass with a chamfered edge |
US9828278B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
CN104136967B (en) * | 2012-02-28 | 2018-02-16 | 伊雷克托科学工业股份有限公司 | For the article for separating the method and device of reinforcing glass and being produced by the reinforcing glass |
US10357850B2 (en) | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
WO2013130608A1 (en) | 2012-02-29 | 2013-09-06 | Electro Scientific Industries, Inc. | Methods and apparatus for machining strengthened glass and articles produced thereby |
WO2014038241A1 (en) * | 2012-09-05 | 2014-03-13 | 三菱電機株式会社 | Laser processing device |
WO2016080347A1 (en) | 2014-11-20 | 2016-05-26 | 日本ゼオン株式会社 | Method for manufacturing optical film |
JP6922899B2 (en) | 2016-04-28 | 2021-08-18 | 日本ゼオン株式会社 | Optical film manufacturing method |
US11260472B2 (en) * | 2016-12-30 | 2022-03-01 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4417393A (en) | 1981-04-01 | 1983-11-29 | General Electric Company | Method of fabricating high density electronic circuits having very narrow conductors |
US4487993A (en) | 1981-04-01 | 1984-12-11 | General Electric Company | High density electronic circuits having very narrow conductors |
US4710253A (en) | 1984-06-04 | 1987-12-01 | Somich Technology Inc. | Method for manufacturing a circuit board |
JPH05261578A (en) | 1992-01-13 | 1993-10-12 | Maho Ag | Process and device for machining workpiece by means of laser radiation emitted from laser |
US5576073A (en) | 1994-04-23 | 1996-11-19 | Lpkf Cad/Cam Systeme Gmbh | Method for patterned metallization of a substrate surface |
US5798927A (en) | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
JPH10263872A (en) | 1997-03-24 | 1998-10-06 | Komatsu Ltd | Laser beam machine |
US5925271A (en) * | 1994-02-09 | 1999-07-20 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Laser beam shaping device and process including a rotating mirror |
US6143356A (en) | 1999-08-06 | 2000-11-07 | Parelec, Inc. | Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards |
US6163957A (en) | 1998-11-13 | 2000-12-26 | Fujitsu Limited | Multilayer laminated substrates with high density interconnects and methods of making the same |
US6222156B1 (en) | 1997-06-12 | 2001-04-24 | International Business Machines Corporation | Laser repair process for printed wiring boards |
US6433301B1 (en) | 1999-05-28 | 2002-08-13 | Electro Scientific Industries, Inc. | Beam shaping and projection imaging with solid state UV Gaussian beam to form vias |
US20020158052A1 (en) * | 2001-03-29 | 2002-10-31 | Ehrmann Jonathan S. | Method and system for processing one or more microstructures of a multi-material device |
US6635848B2 (en) * | 1999-12-11 | 2003-10-21 | Schott Glas | Method and device for cutting flat work pieces of a brittle material |
US6811069B2 (en) * | 1999-12-31 | 2004-11-02 | Schott Glas | Method and device for the separation of flat workpieces made from a brittle material |
US6909735B2 (en) | 2003-04-10 | 2005-06-21 | Hitachi Via Mechanics, Ltd. | System and method for generating and controlling multiple independently steerable laser beam for material processing |
US7014727B2 (en) | 2003-07-07 | 2006-03-21 | Potomac Photonics, Inc. | Method of forming high resolution electronic circuits on a substrate |
US7164099B2 (en) | 2002-12-17 | 2007-01-16 | Hitachi Via Mechancis Ltd. | Multi-axis laser machine, method for machining with the same, and recording medium recording computer program for controlling the same |
WO2007044798A2 (en) | 2005-10-11 | 2007-04-19 | Gsi Group Corporation | Optical metrological scale and laser-based manufacturing method therefor |
US7511247B2 (en) * | 2004-03-22 | 2009-03-31 | Panasonic Corporation | Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0262225A4 (en) * | 1986-03-26 | 1988-12-12 | Ni Ts Tekh Lazeram An | Installation for laser treatment of materials. |
JPS6384788A (en) * | 1986-09-29 | 1988-04-15 | Nippon Steel Corp | Method and device for controlling projection of laser beam |
JP2006007257A (en) * | 2004-06-24 | 2006-01-12 | Matsushita Electric Ind Co Ltd | Laser beam machining apparatus |
-
2009
- 2009-03-28 US US12/413,531 patent/US8350187B2/en active Active
-
2010
- 2010-03-26 JP JP2012502298A patent/JP2012521890A/en not_active Ceased
- 2010-03-26 TW TW099109058A patent/TW201043373A/en unknown
- 2010-03-26 WO PCT/US2010/028884 patent/WO2010117683A2/en active Application Filing
- 2010-03-26 CN CN2010800174075A patent/CN102405122A/en active Pending
- 2010-03-26 KR KR1020117022685A patent/KR20120004426A/en unknown
Patent Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4487993A (en) | 1981-04-01 | 1984-12-11 | General Electric Company | High density electronic circuits having very narrow conductors |
US4417393A (en) | 1981-04-01 | 1983-11-29 | General Electric Company | Method of fabricating high density electronic circuits having very narrow conductors |
US4710253A (en) | 1984-06-04 | 1987-12-01 | Somich Technology Inc. | Method for manufacturing a circuit board |
JPH05261578A (en) | 1992-01-13 | 1993-10-12 | Maho Ag | Process and device for machining workpiece by means of laser radiation emitted from laser |
US5925271A (en) * | 1994-02-09 | 1999-07-20 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Laser beam shaping device and process including a rotating mirror |
US5576073A (en) | 1994-04-23 | 1996-11-19 | Lpkf Cad/Cam Systeme Gmbh | Method for patterned metallization of a substrate surface |
US5798927A (en) | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
JPH10263872A (en) | 1997-03-24 | 1998-10-06 | Komatsu Ltd | Laser beam machine |
US6222156B1 (en) | 1997-06-12 | 2001-04-24 | International Business Machines Corporation | Laser repair process for printed wiring boards |
US6163957A (en) | 1998-11-13 | 2000-12-26 | Fujitsu Limited | Multilayer laminated substrates with high density interconnects and methods of making the same |
US6433301B1 (en) | 1999-05-28 | 2002-08-13 | Electro Scientific Industries, Inc. | Beam shaping and projection imaging with solid state UV Gaussian beam to form vias |
US6143356A (en) | 1999-08-06 | 2000-11-07 | Parelec, Inc. | Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards |
US6635848B2 (en) * | 1999-12-11 | 2003-10-21 | Schott Glas | Method and device for cutting flat work pieces of a brittle material |
US7014082B2 (en) * | 1999-12-31 | 2006-03-21 | Schott Ag | Method and device for cutting flat work pieces made of a brittle material |
US6811069B2 (en) * | 1999-12-31 | 2004-11-02 | Schott Glas | Method and device for the separation of flat workpieces made from a brittle material |
US6777645B2 (en) * | 2001-03-29 | 2004-08-17 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US6989508B2 (en) * | 2001-03-29 | 2006-01-24 | Gsi Group Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US20020158052A1 (en) * | 2001-03-29 | 2002-10-31 | Ehrmann Jonathan S. | Method and system for processing one or more microstructures of a multi-material device |
US20060207975A1 (en) * | 2001-03-29 | 2006-09-21 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US7148447B2 (en) * | 2001-03-29 | 2006-12-12 | Gsi Group Corporation | Method and apparatus for laser marking by ablation |
US20070075058A1 (en) * | 2001-03-29 | 2007-04-05 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US7164099B2 (en) | 2002-12-17 | 2007-01-16 | Hitachi Via Mechancis Ltd. | Multi-axis laser machine, method for machining with the same, and recording medium recording computer program for controlling the same |
US6909735B2 (en) | 2003-04-10 | 2005-06-21 | Hitachi Via Mechanics, Ltd. | System and method for generating and controlling multiple independently steerable laser beam for material processing |
US7014727B2 (en) | 2003-07-07 | 2006-03-21 | Potomac Photonics, Inc. | Method of forming high resolution electronic circuits on a substrate |
US7511247B2 (en) * | 2004-03-22 | 2009-03-31 | Panasonic Corporation | Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization |
WO2007044798A2 (en) | 2005-10-11 | 2007-04-19 | Gsi Group Corporation | Optical metrological scale and laser-based manufacturing method therefor |
Non-Patent Citations (2)
Title |
---|
International Preliminary Report on Patenttability of PCT/US2010/028884. |
International Search Report of PCT/US2010/028884. |
Also Published As
Publication number | Publication date |
---|---|
WO2010117683A3 (en) | 2011-01-13 |
TW201043373A (en) | 2010-12-16 |
JP2012521890A (en) | 2012-09-20 |
WO2010117683A2 (en) | 2010-10-14 |
US20100243626A1 (en) | 2010-09-30 |
KR20120004426A (en) | 2012-01-12 |
CN102405122A (en) | 2012-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8350187B2 (en) | Method and apparatus for laser machining | |
JP4551086B2 (en) | Partial machining with laser | |
CN105562688B (en) | Production of components by selective laser melting | |
KR101115643B1 (en) | Multiple beam micro-machining system and method | |
EP1659438B1 (en) | Optical system with electronic spot size control and focus control optics | |
US6407363B2 (en) | Laser system and method for single press micromachining of multilayer workpieces | |
US11045907B2 (en) | System and method for additively manufacturing by laser melting of a powder bed | |
US20020190435A1 (en) | Laser segmented cutting | |
EP2514553A2 (en) | Method of manufacturing a component | |
KR20150005939A (en) | Method and device for machining a workpiece using laser radiation | |
JP2004528991A5 (en) | ||
JP6516722B2 (en) | Control based on laser emission of beam positioner | |
TWI637803B (en) | Laser processing apparatus and method for processing a workpiece by operation of a laser tool | |
JPH03133588A (en) | High-accuracy through hole opening method using laser beam generator and device | |
WO2004011187A1 (en) | System and method of laser drilling using a continuously optimized depth of focus | |
KR102511400B1 (en) | Laser beam positioning system, laser processing device and control method | |
KR20160127462A (en) | Laser apparatus and method of manufacturing the same | |
KR20170096812A (en) | Multi-functional laser processing apparatus and laser processing method using the laser processing apparatus | |
US5438441A (en) | Method and apparatus for material processing with a laser controlled by a holographic element | |
JP2008168297A (en) | Apparatus and method for laser beam machining | |
JP2008137058A (en) | Laser beam machining apparatus and method | |
CN100448594C (en) | Device and method for processing electric circuit substrates by laser | |
KR20170096415A (en) | Laser cleaning method and laser processing method and apparatus using the laser cleaning method | |
EP1525069A1 (en) | System and method of laser drilling using a continuously optimized depth of focus | |
EP4353690A1 (en) | System and method for processing a transparent material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ELECTRO SCIENTIFIC INDUSTRIES, OREGON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BALDWIN, LEO;REEL/FRAME:022701/0295 Effective date: 20090408 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
AS | Assignment |
Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK Free format text: PATENT SECURITY AGREEMENT (ABL);ASSIGNORS:ELECTRO SCIENTIFIC INDUSTRIES, INC.;MKS INSTRUMENTS, INC.;NEWPORT CORPORATION;REEL/FRAME:048211/0312 Effective date: 20190201 Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK Free format text: PATENT SECURITY AGREEMENT (TERM LOAN);ASSIGNORS:ELECTRO SCIENTIFIC INDUSTRIES, INC.;MKS INSTRUMENTS, INC.;NEWPORT CORPORATION;REEL/FRAME:048211/0227 Effective date: 20190201 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |
|
AS | Assignment |
Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE U.S. PATENT NO. 7,919,646 PREVIOUSLY RECORDED ON REEL 048211 FRAME 0227. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT (TERM LOAN);ASSIGNORS:ELECTRO SCIENTIFIC INDUSTRIES, INC.;MKS INSTRUMENTS, INC.;NEWPORT CORPORATION;REEL/FRAME:055006/0492 Effective date: 20190201 Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE U.S. PATENT NO.7,919,646 PREVIOUSLY RECORDED ON REEL 048211 FRAME 0312. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT (ABL);ASSIGNORS:ELECTRO SCIENTIFIC INDUSTRIES, INC.;MKS INSTRUMENTS, INC.;NEWPORT CORPORATION;REEL/FRAME:055668/0687 Effective date: 20190201 |
|
AS | Assignment |
Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, ILLINOIS Free format text: SECURITY INTEREST;ASSIGNORS:MKS INSTRUMENTS, INC.;NEWPORT CORPORATION;ELECTRO SCIENTIFIC INDUSTRIES, INC.;REEL/FRAME:061572/0069 Effective date: 20220817 |
|
AS | Assignment |
Owner name: ELECTRO SCIENTIFIC INDUSTRIES, INC., OREGON Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC;REEL/FRAME:063009/0001 Effective date: 20220817 Owner name: NEWPORT CORPORATION, MASSACHUSETTS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC;REEL/FRAME:063009/0001 Effective date: 20220817 Owner name: MKS INSTRUMENTS, INC., MASSACHUSETTS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC;REEL/FRAME:063009/0001 Effective date: 20220817 Owner name: ELECTRO SCIENTIFIC INDUSTRIES, INC., OREGON Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC;REEL/FRAME:062739/0001 Effective date: 20220817 Owner name: NEWPORT CORPORATION, MASSACHUSETTS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC;REEL/FRAME:062739/0001 Effective date: 20220817 Owner name: MKS INSTRUMENTS, INC., MASSACHUSETTS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC;REEL/FRAME:062739/0001 Effective date: 20220817 |