KR20170096415A - Laser cleaning method and laser processing method and apparatus using the laser cleaning method - Google Patents

Laser cleaning method and laser processing method and apparatus using the laser cleaning method Download PDF

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Publication number
KR20170096415A
KR20170096415A KR1020160017761A KR20160017761A KR20170096415A KR 20170096415 A KR20170096415 A KR 20170096415A KR 1020160017761 A KR1020160017761 A KR 1020160017761A KR 20160017761 A KR20160017761 A KR 20160017761A KR 20170096415 A KR20170096415 A KR 20170096415A
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KR
South Korea
Prior art keywords
laser beam
laser
line
cutting
coating material
Prior art date
Application number
KR1020160017761A
Other languages
Korean (ko)
Inventor
서기홍
신준엽
Original Assignee
주식회사 이오테크닉스
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Publication date
Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020160017761A priority Critical patent/KR20170096415A/en
Publication of KR20170096415A publication Critical patent/KR20170096415A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B23K26/0066—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Abstract

Disclosed are a laser cleaning method and a laser processing method, and an apparatus using the laser cleaning method. The disclosed laser cleaning method is to remove a coating material applied to particles generated around a cutting line of an object to be processed and the object to be processed with a laser beam, comprising: a step of defocusing the laser beam to be irradiated around the cutting line of the object to be processed; and a step of removing particles and the coating material at the same time by moving the defocused laser beam along the cutting line to be line-irradiated.

Description

TECHNICAL FIELD The present invention relates to a laser cleaning method and a laser processing method and apparatus using the same,

More particularly, the present invention relates to a laser cleaning apparatus for simultaneously removing particles generated when a workpiece is cut by using a laser and a coating material for protecting an object by using a laser, and To a laser cleaning method using the laser.

As a method for removing impurities remaining on the surface of a material, conventionally, a method of using electrolysis, a method of chemically removing by using a chemical agent, a method of mechanically removing high-pressure water by spraying, and the like have been used. However, these methods require the use of chemicals harmful to human body, and there is a risk that the product may be damaged in the process of removing the impurities, and it is difficult to completely remove the impurities.

In recent years, a laser de flash technique for eliminating impurities remaining on the surface of a material by using a laser has been spotlighted in order to overcome such a problem. The laser de flushing technology is advantageous in that the laser is used to remove impurities, so that it is natural-friendly, the processing speed is high, and the maintenance cost is low.

One embodiment of the present invention is a laser cleaning apparatus capable of simultaneously removing generated particles and a coating material for protecting an object by using a laser when cutting an object using a laser, and a laser cleaning method .

According to an embodiment of the present invention, there is provided a laser cleaning method for removing particles generated around a cutting line of a workpiece and a coating material applied to the workpiece using a laser beam, defocusing the object to be cut and irradiating the object around the cutting line; And line scanning the defocused laser beam while moving along the cutting line to simultaneously remove the particles and the coating material.

And adjusting the frequency of the laser beam.

The particles can be generated by cutting the object using a laser beam for cutting.

The defocused laser beam may have the same wavelength as the laser beam for cutting.

The defocused laser beam may be adjusted to have a lower frequency than the laser beam for cutting.

The defocused laser beam may be line-scanned a plurality of times around the cut line of the object along the cut line.

According to one embodiment, a method of laser processing comprises: applying a coating material on a workpiece; Cutting the object using a first laser beam; Defocusing the second laser beam and irradiating the laser beam around the cutting line of the object; And simultaneously scanning the line of the defocused laser beam while moving along the cutting line to simultaneously remove the particles and the coating material generated around the cutting line of the object to be processed.

And adjusting the frequency of the second laser beam.

The object to be processed can be cut by focusing the first laser beam on the object to be processed and then moving along the line to be cut.

The first and second laser beams are emitted from the same laser light source and can have the same wavelength.

The second laser beam may be adjusted to have a lower frequency than the first laser beam.

The defocused laser beam may be line-scanned a plurality of times around the cut line of the object along the cut line.

In the case of processing an object by using a laser, a coating material is applied around the cut area to protect the object to be processed. According to the embodiment of the present invention, particles and coating material generated at the time of cutting an object to which a coating material is applied can be simultaneously removed by using a laser, thereby preventing damage to the object and speeding up the processing speed.

1 schematically shows a laser processing apparatus according to an embodiment of the present invention.
2A to 2E schematically show a laser cleaning method according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between . Also, when an element is referred to as "comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.

Fig. 1 schematically shows a laser machining apparatus 100 according to an embodiment of the present invention. The laser machining apparatus 100 shown in Fig. 1 performs a process of cutting the object W and a process of removing particles and coating material generated in the cutting process of the object W as described later .

Referring to FIG. 1, the laser processing apparatus according to the present embodiment includes a laser light source 110, a mirror 120, a focusing lens 140, and a control unit 150. Here, the laser light source 110 emits a laser beam for cutting or a laser beam for deflashing, which will be described later. Specifically, the laser light source 110 emits the first laser beam L1, that is, the laser beam for cutting in the process of cutting the object W. The object to be processed W may include, for example, copper or the like, and may include various other metal materials. The laser light source 110 is a process of removing particles and coating material generated in the cutting process of the object W, that is, in the laser de-flash process, the second laser beam L2, Can be released.

As the first and second laser beams L1 and L2, for example, a pulsed laser beam having a relatively short pulse width can be used. However, the present invention is not limited thereto, and a continuous wave laser beam may be used. The first and second laser beams L1 and L2 emitted from the laser light source 110 when the object W includes copper may be pulsed laser beams having a wavelength of, for example, approximately 532 nm .

The path of the laser beams L1 and L2 emitted from the laser light source 110 can be changed by the mirror 120 to a desired position. The laser beam reflected by the mirror 120 is irradiated to the position to be processed of the object W loaded on the stage S via the focusing lens 140. Here, a beam expanding telescope (BET) 130 may be further provided on the optical path between the mirror 120 and the focusing lens 140 to enlarge the size of the laser beam.

In the laser cutting process, the focusing lens 140 focuses the first laser beam L1 emitted from the laser light source 110 onto the surface of the object W to irradiate the object. In this way, the first laser beam L1 is focused by the focusing lens 140 to be irradiated on the surface of the object W, and then moved along the line along which the object is intended to be cut to cut the object W .

In the process of removing the particles and the coating material generated in the cutting process of the object W, that is, the laser deflash process, the focusing lens 140 moves the second laser beam L2 emitted from the laser light source 110, Defocusing the object to be processed to irradiate the coating material applied to the object W and particles generated in the cutting process. This defocusing of the second laser beam L2 can be performed by moving the focusing lens 140. [ That is, the defocusing of the second laser beam L2 can be performed by moving the focusing lens 140 by a certain distance in the direction opposite to the object W. [ Thus, the second laser beam L2 is defocused by the focusing lens 140 to be irradiated around the particles and the coating material generated in the cutting process of the object W, and then line-scanned along the cutting line A process of removing the particles and the coating material generated around the cutting line of the object W is performed.

The laser processing apparatus according to the present embodiment may further include a controller 150 for controlling the laser beams L1 and L2. The controller 150 can control the wavelengths and frequencies of the laser beams L1 and L2 to a desired value.

2A to 2E schematically show a laser cleaning method according to an embodiment of the present invention.

Referring to FIGS. 2A and 2B, a coating material 210 is applied onto a workpiece W. FIG. The object to be processed W may include, for example, copper or the like, and may include various other metal materials. The coating material 210 may prevent the portion other than the cut region from being processed when the object W is cut.

When the coating material 210 is applied to the object W, a stamp coating method may be used. The stamp coating can apply the coating material 210 to only a selected region of the object to be processed through a stamp coating in such a manner that the coating material 210 is printed on a portion of the object W to be coated. Accordingly, it is possible to prevent unnecessary consumption of the coating material 210 to be applied, and to remove only the coating material 210 applied to the selected area during the laser cleaning, the laser cleaning time can be shortened.

Next, referring to FIG. 2C, a first laser beam L1 is irradiated from the laser processing apparatus 100 shown in FIG. 1 to the cut region of the object W to which the coating material 210 is applied, that is, The focusing lens 140 is used. Next, when the first laser beam L1 is scanned along the line along which the object W is to be cut, the object W can be cut. In this laser cutting process, particles 220 may be deposited on the coating material 210 around the cutting line 230 due to the laser plasma phenomenon. These particles 220 may degrade the quality of the product and need to be removed.

Referring now to Figures 2d and 2e, to remove particles 220 deposited on the coating material 210 around the cutting line 230, the laser processing apparatus 100 shown in Figure 1, And irradiates the beam L2, that is, the deflashing laser beam, around the cutting line 230 of the object W. [ In this process, the second laser beam L2 can be defocused by the focusing lens 140 and irradiated around the cutting line 230 of the object W. The defocusing of the second laser beam L2 may be performed by shifting the focusing lens 140 by a predetermined distance in the direction away from the object W. [

Meanwhile, in the laser deflash process according to the present embodiment, the frequency of the second laser beam L2, which is a de-flashing laser beam, can be adjusted by the control unit 150 and used. Specifically, the second laser beam L2 can be adjusted to have a lower frequency than the first laser beam L1. For example, when the object W includes copper, the first and second laser beams L1 and L2 emitted from the laser light source 110 may be pulsed laser beams having a wavelength of approximately 532 nm . In another embodiment, the first laser beam L1 and the second laser beam L2 may have the same frequency, depending on the type and characteristics of the object W. Alternatively, the first laser beam L1 and the second laser beam L2 may be the same frequency, but different laser beams may be used. In this case, the laser beam may be a pulsed laser beam.

When the frequency is adjusted so that the second laser beam L2 defocused around the cutting line 230 of the object W is line-scanned along the cutting line 230, the coating material around the cutting line 230 210 and the coating material 210 deposited on the substrate 210 can be simultaneously reduced or eliminated.

Particles 220 deposited on the coating material 210 around the cutting line 230 are adjusted in frequency so that the second laser beam L2 defocused around the cutting line 230 of the object W May be removed by a single line scan or a plurality of line scan along the cut line 230.

As described above, when the object to be processed is cut using a laser, particles can be deposited on the coating material around the cut line. However, these particles and the coating material can be removed at the same time by defocusing the frequency-controlled deflazing laser beam around the cutting line, and then performing line scanning at least once. Therefore, the object to be processed can be prevented from being damaged in the laser deglash process according to the present embodiment. In addition, the process speed is high and the cost can be reduced.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

100 ... Laser processing equipment
110 ... Laser light source
120 ... mirror
130 ... Beam expander
140 ... Focusing lens
150 ... The control unit
210 ... Coating material
220 ... particle
230 ... Cutting line
L1 ... The first laser beam
L2 ... The second laser beam
W ... Object to be processed
S ... stage

Claims (10)

A laser cleaning method for removing particles generated around a cut line of a work and a coating material applied to the work using a laser beam,
Defocusing the laser beam and irradiating the laser beam around a cutting line of the object; And
And simultaneously scanning the defocused laser beam while moving along the cutting line to remove the particles and the coating material at the same time. The method according to claim 1,
And adjusting the frequency of the laser beam. 3. The method of claim 2,
Wherein the particles are generated by cutting the object using a laser beam for cutting. The method of claim 3,
Wherein the defocused laser beam has the same wavelength as the cutting laser beam. The method according to claim 1,
And the defocused laser beam is scanned in a line around the cut line of the object a plurality of times along the cut line. Applying a coating material on the object to be processed;
Cutting the object using a first laser beam;
Defocusing the second laser beam and irradiating the laser beam around the cutting line of the object; And
And simultaneously scanning the laser beam while moving the defocused laser beam along the cutting line to simultaneously remove the particles and the coating material generated around the cutting line of the object to be processed. The method according to claim 6,
And adjusting the frequency of the second laser beam. The method according to claim 6,
Wherein the object to be processed is cut by focusing the first laser beam on the object and then moving along the line to be cut. 8. The method of claim 7,
Wherein the first and second laser beams are emitted from the same laser light source and have the same wavelength. The method according to claim 6,
Wherein the defocused laser beam is scanned in a line around the cut line of the object a plurality of times along the cut line.
KR1020160017761A 2016-02-16 2016-02-16 Laser cleaning method and laser processing method and apparatus using the laser cleaning method KR20170096415A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107671289A (en) * 2017-11-01 2018-02-09 南京航空航天大学 A kind of process control method of the rare earth modified enhancing aluminium alloy laser 3D printing of low melting loss of elements
RU2768086C1 (en) * 2020-11-03 2022-03-23 Общество с ограниченной ответственностью "Технологический центр "Лазарт" (ООО "ТЦЛ") Method for wet laser cleaning of hard surfaces
KR20220067868A (en) * 2020-11-18 2022-05-25 제너셈(주) Object processing method
KR102536286B1 (en) 2022-12-20 2023-05-26 ㈜ 엘에이티 Coating Layer Removal Method using Laser

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107671289A (en) * 2017-11-01 2018-02-09 南京航空航天大学 A kind of process control method of the rare earth modified enhancing aluminium alloy laser 3D printing of low melting loss of elements
CN107671289B (en) * 2017-11-01 2019-09-10 南京航空航天大学 A kind of process control method of the rare earth modified enhancing aluminium alloy laser 3D printing of low melting loss of elements
RU2768086C1 (en) * 2020-11-03 2022-03-23 Общество с ограниченной ответственностью "Технологический центр "Лазарт" (ООО "ТЦЛ") Method for wet laser cleaning of hard surfaces
KR20220067868A (en) * 2020-11-18 2022-05-25 제너셈(주) Object processing method
KR102536286B1 (en) 2022-12-20 2023-05-26 ㈜ 엘에이티 Coating Layer Removal Method using Laser

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