CN209319015U - A kind of laser processing device with cleaning function - Google Patents
A kind of laser processing device with cleaning function Download PDFInfo
- Publication number
- CN209319015U CN209319015U CN201821923241.3U CN201821923241U CN209319015U CN 209319015 U CN209319015 U CN 209319015U CN 201821923241 U CN201821923241 U CN 201821923241U CN 209319015 U CN209319015 U CN 209319015U
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- laser beam
- laser
- workpiece
- workbench
- processing device
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Abstract
The utility model discloses a kind of laser processing devices with cleaning function, for being laser machined on workpiece, laser light source including being emitted first laser beam and second laser beam, it is connected with laser light source to control the control unit of laser beam output, for loading the workbench of workpiece, and the optical path change moved it on workpiece for deflecting laser beam running track, it is equipped between the optical path change and workbench for first laser beam to be focused to the condenser cut on workpiece, the condenser can generate the second laser beam defocused relative to movable workbench, and it is moved along the cutting line on workpiece using the second laser beam defocused to remove the particle generated around cutting line.The utility model can be cleaned while workpiece cuts and completes, and greatly accelerate process speed, cleaning effect is good, and cost is relatively low.
Description
Technical field
The utility model relates to a kind of laser processing devices with cleaning function.
Background technique
During being cut using laser processing device to workpiece, due to laser plasma phenomenon, cut
It will increase particle around secant, these particles can reduce the quality of workpiece, it is therefore necessary to remove.Traditional cleaning side
Method is generally included the method electrically decomposed, the method for chemical removal is carried out using chemicals, sprays high pressure water progress machinery
The method etc. removed, these methods are all the secondary cleanings again after completing laser processing, extend cleaning time；And need using
The drug being harmful to the human body, workpiece may be damaged；Clean whole process is slow and is extremely difficult to thoroughly clean
Purpose, cleaning effect is poor, and input cost is also higher.
Summary of the invention
The technical issues of the utility model solves is to provide a kind of laser processing device with cleaning function.
The technical solution of the utility model is: a kind of laser processing device with cleaning function, in processing object
It is laser machined on object, including being emitted the laser light source of first laser beam and second laser beam, being connected with laser light source to control
The control unit of controlling laser beam output and makes the workbench for loading workpiece for deflecting laser beam running track
It is moved to the optical path change on workpiece, is equipped between the optical path change and workbench for by first laser
Beam focuses to the condenser cut on workpiece, and the condenser can be produced relative to movable workbench
The raw second laser beam defocused is simultaneously moved using the second laser beam defocused along the cutting line on workpiece to remove and cut
The particle generated around secant.
Further, the frequency of second laser beam described in the utility model is lower than the frequency of first laser beam.
Further, optical path change described in the utility model includes one or more reflective mirrors.
Further, it is also configured in the laser path between reflective mirror and condenser described in the utility model for adjusting
Save the beam expanding telescope of laser beam size.
Compared with the prior art, the utility model has the following advantages:
1) in the utility model, the first laser beam of laser light source outgoing is used for cutting processing object, second laser beam
The particle generated when for cutting is purged, since condenser can pass through relative to movable workbench, second laser beam
Condenser defocuses, and is radiated at around cutting line mobile using the second laser beam defocused to achieve the purpose that remove particle, this
Kind laser processing device can be cleaned while workpiece cuts and completes, and greatly accelerate process speed, be cleaned
Effect is good, and cost is relatively low.
2) it in the utility model, in order to shorten the time of laser cleaning, can be coated in the cutting region of workpiece
For the coating of particle attachment, using first laser beam, cutting processing object and coating, the particle of generation are attached to coating simultaneously
On, and then cated region can be coated by the second laser beam irradiation defocused, particle and coating are removed simultaneously, thus
Process speed, save the cost can be further speeded up on the basis of preventing workpiece from damaging.
3) in the utility model, control unit can control the output of laser beam according to the machine process of workpiece, make
The frequency for obtaining second laser beam is lower than the frequency of first laser beam, is damaged when workpiece being avoided to clean, guarantees processing quality.
Detailed description of the invention
The utility model is further described with reference to the accompanying drawings and embodiments:
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the schematic diagram of the utility model cutting processing object；
Fig. 3 is that the utility model carries out clean schematic diagram to workpiece；
Fig. 4 is that the utility model completes clean schematic diagram to workpiece.
Wherein: 110, laser light source；120, reflective mirror；130, beam expanding telescope；140, condenser；150, control unit；L1,
First laser beam；L2, second laser beam；W, workpiece；S, workbench；210, coating；220, particle；230, cutting line.
Specific embodiment
Embodiment:
It is shown a kind of specific embodiment of the laser processing device with cleaning function of the utility model in conjunction with attached drawing,
The laser processing device mainly includes outgoing first laser beam L1 and for being laser machined on workpiece W
The laser light source 110 of dual-laser beam L2 is connected to control the control unit 150 of laser beam output, for loading with laser light source 110
The workbench S of workpiece W and the optical path moved it on workpiece W for deflecting laser beam running track
Changing unit.
Wherein, control unit 150 is used to control the frequency of 110 shoot laser beam of laser light source, in the present embodiment, laser light source
The frequency of the second laser beam L2 of 110 outgoing is lower than the frequency of first laser beam L1.
The optical path change includes a reflective mirror 120, and the laser beam of outgoing is reflected by reflective mirror 120.
It is equipped between the reflective mirror 120 and workbench S enterprising for first laser beam L1 to be focused to workpiece W
The condenser 140 of row cutting, is also configured in the laser path between the reflective mirror 120 and condenser 140 sharp for adjusting
The beam expanding telescope 130 of beam size.
The condenser 140 can generate the second laser beam L2 defocused and benefit relative to workbench S movement
It is moved with the second laser beam L2 defocused along the cutting line 230 on workpiece W to remove the generation of 230 surrounding of cutting line
Particle 220.
When the present embodiment specific works, in conjunction with shown in Fig. 2 to Fig. 4, workpiece W is placed on workbench S, is processed
Object W is metallics, and cutting region is coated with the coating 210 adhered to for particle 220, and control unit 150 controls laser light
Source 110 is emitted the higher first laser beam L1 of frequency, and first laser beam L1 passes through beam expanding telescope after being reflected by reflective mirror 120
130, then pass through 210 region of coating that condenser 140 focuses to workpiece W, it is cut simultaneously along scheduled cutting line 230
Workpiece W and coating 210, the particle 220 for cutting generation are attached on coating 210；Then, control unit 150 controls laser
Light source 110 is emitted the lower second laser beam L2 of frequency, at the same by condenser 140 away from workbench S direction to moving up
Dynamic, second laser beam L2 is defocused after being reflected by reflective mirror 120 by beam expanding telescope 130, then by condenser 140, is defocused
Second laser beam L2 is radiated on coating 210, is moved along cutting line 230, and coating 210 and particle 220 are removed simultaneously.
This laser processing device can be cleaned while workpiece W cuts and completes, and prevent processing object
Object W is damaged, and greatly accelerates process speed, and cleaning effect is good, and cost is relatively low, in addition, by workpiece W
Upper applying coating 210, when laser cleaning, can remove the particle 220 being attached on coating 210 as long as removing coating 210 simultaneously,
The time for substantially reducing laser cleaning, further save cost.
Certainly the above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with this
The people of technology can understand the content of the utility model and implement accordingly, and the protection model of the utility model can not be limited with this
It encloses.Any modifications made in accordance with the spirit of the main technical solutions of the utility model should all cover the guarantor in the utility model
Within the scope of shield.
Claims (4)
1. a kind of laser processing device with cleaning function, for being laser machined on workpiece (W), feature
Be: including outgoing first laser beam (L1) and second laser beam (L2) laser light source (110), with laser light source (110) phase
Connect to control the control unit (150) of laser beam output, the workbench (S) for loading workpiece (W) and for deflecting
Laser beam running track moves it to the optical path change on workpiece (W), the optical path change and workbench (S)
Between be equipped with for first laser beam (L1) to focus to the condenser (140) cut on workpiece (W), it is described poly-
Light microscopic (140) can be mobile so as to generate the second laser beam defocused (L2) and using defocusing relative to workbench (S)
Second laser beam (L2) is mobile to remove generation around cutting line (230) along the cutting line (230) on workpiece (W)
Particle (220).
2. a kind of laser processing device with cleaning function according to claim 1, it is characterised in that: described second swashs
The frequency of light beam (L2) is lower than the frequency of first laser beam (L1).
3. a kind of laser processing device with cleaning function according to claim 1, it is characterised in that: the optical path becomes
More portion includes one or more reflective mirrors (120).
4. a kind of laser processing device with cleaning function according to claim 3, it is characterised in that: the reflective mirror
(120) beam expanding telescope for adjusting laser beam size is also configured in the laser path between condenser (140)
(130).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821923241.3U CN209319015U (en) | 2018-11-21 | 2018-11-21 | A kind of laser processing device with cleaning function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821923241.3U CN209319015U (en) | 2018-11-21 | 2018-11-21 | A kind of laser processing device with cleaning function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209319015U true CN209319015U (en) | 2019-08-30 |
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ID=67710943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821923241.3U Active CN209319015U (en) | 2018-11-21 | 2018-11-21 | A kind of laser processing device with cleaning function |
Country Status (1)
| Country | Link |
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| CN (1) | CN209319015U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2768086C1 (en) * | 2020-11-03 | 2022-03-23 | Общество с ограниченной ответственностью "Технологический центр "Лазарт" (ООО "ТЦЛ") | Method for wet laser cleaning of hard surfaces |
-
2018
- 2018-11-21 CN CN201821923241.3U patent/CN209319015U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2768086C1 (en) * | 2020-11-03 | 2022-03-23 | Общество с ограниченной ответственностью "Технологический центр "Лазарт" (ООО "ТЦЛ") | Method for wet laser cleaning of hard surfaces |
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