TW312844B - - Google Patents

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Publication number
TW312844B
TW312844B TW085102110A TW85102110A TW312844B TW 312844 B TW312844 B TW 312844B TW 085102110 A TW085102110 A TW 085102110A TW 85102110 A TW85102110 A TW 85102110A TW 312844 B TW312844 B TW 312844B
Authority
TW
Taiwan
Prior art keywords
carrier
item
patent application
module
integrated circuit
Prior art date
Application number
TW085102110A
Other languages
English (en)
Chinese (zh)
Inventor
Manabu Bonkohara
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12476134&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW312844(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW312844B publication Critical patent/TW312844B/zh

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Classifications

    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W90/00—
    • H10W70/60—
    • H10W70/63—
    • H10W72/072—
    • H10W72/073—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W72/877—
    • H10W74/00—
    • H10W74/142—
    • H10W90/288—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW085102110A 1995-02-24 1996-02-24 TW312844B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7036664A JP2944449B2 (ja) 1995-02-24 1995-02-24 半導体パッケージとその製造方法

Publications (1)

Publication Number Publication Date
TW312844B true TW312844B (index.php) 1997-08-11

Family

ID=12476134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085102110A TW312844B (index.php) 1995-02-24 1996-02-24

Country Status (5)

Country Link
US (1) US6188127B1 (index.php)
EP (1) EP0729184A3 (index.php)
JP (1) JP2944449B2 (index.php)
KR (1) KR100231366B1 (index.php)
TW (1) TW312844B (index.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397155B (zh) * 2009-12-24 2013-05-21 力成科技股份有限公司 形成矽穿孔之多晶片堆疊過程
TWI512862B (zh) * 2013-03-25 2015-12-11 東芝股份有限公司 Manufacturing method of semiconductor device

Families Citing this family (172)

* Cited by examiner, † Cited by third party
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US6188127B1 (en) 2001-02-13
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