JP2944449B2 - 半導体パッケージとその製造方法 - Google Patents

半導体パッケージとその製造方法

Info

Publication number
JP2944449B2
JP2944449B2 JP7036664A JP3666495A JP2944449B2 JP 2944449 B2 JP2944449 B2 JP 2944449B2 JP 7036664 A JP7036664 A JP 7036664A JP 3666495 A JP3666495 A JP 3666495A JP 2944449 B2 JP2944449 B2 JP 2944449B2
Authority
JP
Japan
Prior art keywords
carrier
semiconductor package
package according
conductor
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7036664A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08236694A (ja
Inventor
直治 仙波
勇三 嶋田
和明 内海
健市 得能
郁志 森▲崎▼
明裕 銅谷
學 盆子原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12476134&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2944449(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7036664A priority Critical patent/JP2944449B2/ja
Priority to US08/604,115 priority patent/US6188127B1/en
Priority to EP96102773A priority patent/EP0729184A3/en
Priority to TW085102110A priority patent/TW312844B/zh
Priority to KR1019960004523A priority patent/KR100231366B1/ko
Publication of JPH08236694A publication Critical patent/JPH08236694A/ja
Application granted granted Critical
Publication of JP2944449B2 publication Critical patent/JP2944449B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W90/00—
    • H10W70/60—
    • H10W70/63—
    • H10W72/072—
    • H10W72/073—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W72/877—
    • H10W74/00—
    • H10W74/142—
    • H10W90/288—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP7036664A 1995-02-24 1995-02-24 半導体パッケージとその製造方法 Expired - Lifetime JP2944449B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP7036664A JP2944449B2 (ja) 1995-02-24 1995-02-24 半導体パッケージとその製造方法
US08/604,115 US6188127B1 (en) 1995-02-24 1996-02-20 Semiconductor packing stack module and method of producing the same
EP96102773A EP0729184A3 (en) 1995-02-24 1996-02-23 Semiconductor package stack module and method of producing the same
TW085102110A TW312844B (index.php) 1995-02-24 1996-02-24
KR1019960004523A KR100231366B1 (ko) 1995-02-24 1996-02-24 반도체 패키지 스택 모듈 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7036664A JP2944449B2 (ja) 1995-02-24 1995-02-24 半導体パッケージとその製造方法

Publications (2)

Publication Number Publication Date
JPH08236694A JPH08236694A (ja) 1996-09-13
JP2944449B2 true JP2944449B2 (ja) 1999-09-06

Family

ID=12476134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7036664A Expired - Lifetime JP2944449B2 (ja) 1995-02-24 1995-02-24 半導体パッケージとその製造方法

Country Status (5)

Country Link
US (1) US6188127B1 (index.php)
EP (1) EP0729184A3 (index.php)
JP (1) JP2944449B2 (index.php)
KR (1) KR100231366B1 (index.php)
TW (1) TW312844B (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383840B1 (en) 1999-07-22 2002-05-07 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device

Families Citing this family (173)

* Cited by examiner, † Cited by third party
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