JP4014591B2 - 半導体装置および電子機器 - Google Patents
半導体装置および電子機器 Download PDFInfo
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- JP4014591B2 JP4014591B2 JP2004292435A JP2004292435A JP4014591B2 JP 4014591 B2 JP4014591 B2 JP 4014591B2 JP 2004292435 A JP2004292435 A JP 2004292435A JP 2004292435 A JP2004292435 A JP 2004292435A JP 4014591 B2 JP4014591 B2 JP 4014591B2
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Description
絶縁フィルムと、
この絶縁フィルムの一方の面上に配置された配線と、
上記絶縁フィルムの上記一方の面に対向するように配置された一つまたは複数の半導体素子と、
上記絶縁体フィルムの他方の面上に配置された放熱部材と
を備え、
上記放熱部材は、上記絶縁体フィルムの上記他方の面における上記半導体素子に対応する箇所に、少なくとも配置され、
上記放熱部材は、上記絶縁フィルムの上記他方の面上に直接配置されていることを特徴としている。
また、一実施形態の半導体装置は、上記放熱部材が、放熱板であり、上記放熱板の上記絶縁フィルム側の面の表面積は、上記絶縁フィルムの上記放熱板側の面の表面積よりも大きくなっている。
図1は、本発明の第1実施形態の半導体装置を示す図である。詳細には、図1(A)は、第1実施形態の半導体装置の断面図であり、図1(B)は、第1実施形態の半導体装置における半導体素子の搭載面を示す図であり、図1(C)は、第1実施形態の半導体装置の半導体素子が搭載されていない側の面を示す図である。
図3は、第2実施形態の半導体装置を示す図である。詳細には、図3(A)は、第2実施形態の半導体装置の断面図であり、図3(B)は、第1実施形態の半導体装置における半導体素子の搭載面と反対側の面を示す図である。
図4は、第3実施形態の半導体装置の絶縁フィルム43の半導体素子側と反対側の面を示す図である。
図5は、第4実施形態の半導体装置を示す図である。詳細には、図5(A)は、第4実施形態の半導体装置の断面図であり、図5(B)は、第4実施形態の半導体装置の半導体素子側の上面図であり、図5(C)は、第4実施形態の半導体装置の半導体素子側と反対側の上面図である。
図6は、第5実施形態の半導体装置を示す図である。詳細には、図6(A)は、第5実施形態の半導体装置の断面図であり、図6(B)は、第5実施形態の半導体装置の製造途中の絶縁フィルムにおける半導体素子側と反対側の表面を示す図である。また、図6(C)は、第5実施形態の半導体装置の絶縁フィルムにおける半導体素子側と反対側の表面を示す図である。
2,72 バンプ電極
3,73 絶縁フィルム
4,74 配線
5,75 ソルダーレジスト
6,76 封止樹脂
10,30,40,50,57 放熱板
66 樹脂薄膜
80,90 半導体装置
Claims (14)
- 絶縁フィルムと、
この絶縁フィルムの一方の面上に配置された配線と、
上記絶縁フィルムの上記一方の面に対向するように配置された一つまたは複数の半導体素子と、
上記絶縁体フィルムの他方の面上に配置された放熱部材と
を備え、
上記放熱部材は、上記絶縁体フィルムの上記他方の面における上記半導体素子に対応する箇所に、少なくとも配置され、
上記放熱部材は、上記絶縁フィルムの上記他方の面上に直接配置されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記放熱部材は、上記絶縁体フィルムの上記他方の面における上記配線に対応する箇所に、少なくとも配置されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記放熱部材は、互いに連続していない複数の部分から成ることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記半導体素子は、少なくとも2種類の半導体素子を含むことを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記半導体素子のバンプ電極と、上記配線とは、Au−Snの合金接合によって接続されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記半導体素子のバンプ電極と、上記配線とは、Au−Auの合金接合によって接続されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記半導体素子のバンプ電極と、上記配線とは、異方性導電接着フィルムによって接続されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記半導体素子のバンプ電極と、上記配線とは、異方性導電接着ペーストによって接続されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記半導体素子のバンプ電極と、上記配線とは、非導電性接着ペーストによって接続されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記半導体素子のバンプ電極と、上記配線とは、非導電性接着フィルムによって接続されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記絶縁フィルムの上に、受動素子を配置していることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記放熱部材の表面の一部または表面の全面に、絶縁性の薄膜樹脂が塗布されるか、または、上記放熱部材の表面の一部または表面の全面に、絶縁性のシート部材が貼り付けられていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
上記放熱部材は、放熱板であり、
上記放熱板の上記絶縁フィルム側の面の表面積は、上記絶縁フィルムの上記放熱板側の面の表面積よりも大きいことを特徴とする半導体装置。 - 請求項1に記載の半導体装置と、放熱用部品とを備える電子機器であって、
上記半導体装置の放熱部材と、上記放熱用部品とは、直接的に連結されていることを特徴とする電子機器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004292435A JP4014591B2 (ja) | 2004-10-05 | 2004-10-05 | 半導体装置および電子機器 |
CNB2005101291378A CN100385648C (zh) | 2004-10-05 | 2005-09-30 | 半导体器件以及电子设备 |
KR1020050092674A KR20060051982A (ko) | 2004-10-05 | 2005-10-01 | 반도체 장치 및 전자기기 |
TW094134686A TWI302736B (en) | 2004-10-05 | 2005-10-04 | Semiconductor device and electronic apparatus |
US11/241,972 US20060071325A1 (en) | 2004-10-05 | 2005-10-04 | Semiconductor device and electronic apparatus |
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JP5489394B2 (ja) * | 2006-07-20 | 2014-05-14 | 三星電子株式会社 | Cof型半導体パッケージ |
KR100785950B1 (ko) * | 2006-11-09 | 2007-12-14 | 스테코 주식회사 | Cof 패키지 및 그의 제조 방법 |
JP5096782B2 (ja) | 2007-04-19 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4109707B1 (ja) | 2007-05-30 | 2008-07-02 | 新藤電子工業株式会社 | 半導体装置およびその製造方法、ならびにディスプレイ装置およびその製造方法 |
KR101493869B1 (ko) | 2008-04-17 | 2015-02-23 | 삼성전자주식회사 | 방열 부재 테이프, 방열부재를 구비한 씨오에프(cof)형 반도체 패키지 및 이를 적용한 전자장치 |
JP5095460B2 (ja) * | 2008-01-17 | 2012-12-12 | シャープ株式会社 | 半導体装置および表示装置 |
JP5184115B2 (ja) | 2008-01-31 | 2013-04-17 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP5238274B2 (ja) * | 2008-01-31 | 2013-07-17 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
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JP5236377B2 (ja) * | 2008-07-16 | 2013-07-17 | シャープ株式会社 | 半導体装置および表示装置 |
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JP7086288B2 (ja) * | 2018-12-07 | 2022-06-17 | コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 自動車用途での自己発光ディスプレイ技術の場合における温度測定及び周囲光測定 |
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-
2004
- 2004-10-05 JP JP2004292435A patent/JP4014591B2/ja active Active
-
2005
- 2005-09-30 CN CNB2005101291378A patent/CN100385648C/zh active Active
- 2005-10-01 KR KR1020050092674A patent/KR20060051982A/ko active Search and Examination
- 2005-10-04 US US11/241,972 patent/US20060071325A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
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CN100385648C (zh) | 2008-04-30 |
CN1767177A (zh) | 2006-05-03 |
JP2006108356A (ja) | 2006-04-20 |
US20060071325A1 (en) | 2006-04-06 |
TWI302736B (en) | 2008-11-01 |
KR20060051982A (ko) | 2006-05-19 |
TW200629524A (en) | 2006-08-16 |
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