JP4109707B1 - 半導体装置およびその製造方法、ならびにディスプレイ装置およびその製造方法 - Google Patents
半導体装置およびその製造方法、ならびにディスプレイ装置およびその製造方法 Download PDFInfo
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- JP4109707B1 JP4109707B1 JP2007243306A JP2007243306A JP4109707B1 JP 4109707 B1 JP4109707 B1 JP 4109707B1 JP 2007243306 A JP2007243306 A JP 2007243306A JP 2007243306 A JP2007243306 A JP 2007243306A JP 4109707 B1 JP4109707 B1 JP 4109707B1
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Abstract
【解決手段】可撓性を有する絶縁基材1の表面に導電パターン3を形成し、その導電パターンに接続して絶縁基材の表面に半導体7を搭載する半導体装置16において、半導体7のまわりを一部残して半導体を取り囲むように、絶縁基材にスリット5を形成して半導体保持部位30を設ける。ここで、スリット5は、例えば、外形が四角い半導体7の三辺を取り囲むように、コの字状に形成する。
【選択図】図4
Description
半導体装置116は、フィルム状の絶縁基材101の表面に導電パターン103を形成し、その導電パターン103の半導体接続用端子部103Aと外部接続用端子部103Bを除く所定の領域に、可撓性に優れたソルダーレジスト106を設ける。導電パターン103の半導体接続用端子部103Aには、半導体107に設けられた金バンプ108を接続してフリップチップ実装し、絶縁基材101上に半導体107を搭載する。そして、絶縁基材101と半導体107との間に封止樹脂114を充填して加熱硬化させることにより、半導体107を樹脂封止していた。
図示するように、半導体装置116は、絶縁基材101の表面を内側として湾曲し、その導電パターン103の外部接続用端子部103Bを接続してガラス基板118に連結し、他方の外部接続用端子部103Bをプリント配線板117に接続して連結することにより組み付けていた。図中119は表示ガラス、122はバックライトである。
半導体装置201aは、半導体素子205が設置された表面とは反対の裏面を内側としてフィルム基材202が折り返され、フィルム基材202同士が接近し、アウターリード204bが形成された表面が、裏側を向くような形状とされる。そして、表示板であるガラス基板211および透明基板である表示ガラス209が順次積層されており、ガラス基板211の表示ガラス209側に形成された透明電極212上に異方性導電フィルム213等が形成され、半導体装置201aが実装される。半導体装置201aは、フィルム基材202が裏面を内側として折り返された形状である。半導体装置201aのアウターリード204bとガラス基板211の透明電極212が、異方性導電フィルム213を介して接合され、電気的に接続されている。
図1(A)ないし(F)には、この発明の半導体装置の製造に用いる、フレキシブルプリント配線板の製造工程を示す。
スリット5は、半導体7のまわりを一部残して半導体7を取り囲むように、スリット形成領域に形成する。例えば、図示例のように、外形が四角い半導体7の三辺を取り囲むようにコの字状に形成して、半導体搭載部位30を設けてなる。
2 導電体
3 導電パターン
3A 半導体接続用端子部
3B 外部接続用端子部
3C 補強部
4 フォトレジスト膜
5 スリット
5A 第1の切れ目
5B 第2の切れ目
6 ソルダーレジスト
7 半導体
7A 半導体搭載領域
8 金バンプ
9 ボンディングツール
10 加熱ステージ
11 スプロケットホール
12 フレキシブルプリント配線板
13 塗布用ノズル
14 封止樹脂
15 エッチングレジスト
16 半導体装置
16A 半導体装置
17 プリント配線板
18 ガラス基板
19 表示ガラス
20 第1の筐体部材
21 第2の筐体部材
22 バックライト
23 高熱伝導材料
24 接着剤
30 半導体保持部位
40 ディスプレイ装置
a 所定の距離
b 折り曲げ範囲
L スリットの両端を通って絶縁基材を横切る直線
M 直線Lと平行な直線
Claims (14)
- 第1の外部接続用端子部と第2の外部接続用端子部とを設ける導電パターンを、可撓性を有する絶縁基材の表面に形成するフレキシブルプリント配線板の、前記第1の外部接続用端子部と前記第2の外部接続用端子部との間に、前記導電パターンの半導体接続用端子部に接続して半導体を搭載する半導体装置において、
前記半導体のまわりを一部残してその半導体を取り囲むように、前記絶縁基材にスリットを形成して半導体保持部位を設けてなり、
その半導体保持部位を除いて前記絶縁基材を、表面を内側として折り返し、前記第1の外部接続用端子部および前記第2の外部接続用端子部を各々他の部品に接続するとき、搭載された前記半導体を前記絶縁基材の裏面から突出させるように、前記スリットが形成されていることを特徴とする半導体装置。 - 外形が四角い前記半導体の三辺を取り囲むように、コの字状に前記スリットを形成してなることを特徴とする、請求項1に記載の半導体装置。
- 前記スリットの両端を通って前記絶縁基材を横切る直線とそれと平行な直線との間の折り曲げ範囲で、前記絶縁基材を裏面を内側として湾曲して前記半導体保持部位を折り返すことができるように、前記スリットの両端を通って前記絶縁基材を横切る直線と前記半導体とを所定間隔離してなることを特徴とする、請求項1または2に記載の半導体装置。
- 前記折り曲げ範囲で、前記半導体保持部位を、裏面を内側として折り返して、対向する前記絶縁基材間を貼り合せてなることを特徴とする、請求項3に記載の半導体装置。
- 前記スリットの両端を通って前記絶縁基材を横切る直線とそれと平行な直線との間の折り曲げ範囲で湾曲して、前記半導体保持部位を除いて前記絶縁基材を、表面を内側として折り返し、前記導電パターンの前記第1の外部接続用端子部および前記第2の外部接続用端子部を他の部品に接続して、請求項1ないし4のいずれか1に記載の半導体装置を実装してなることを特徴とするディスプレイ装置。
- 前記半導体を、高熱伝導材料を介して筐体部材に接着してなることを特徴とする、請求項5に記載のディスプレイ装置。
- 前記半導体保持部位を、前記折り曲げ範囲で湾曲して、裏面を内側として折り返してなることを特徴とする、請求項5または6に記載のディスプレイ装置。
- 前記半導体保持部位を、裏面を内側として折り返して、対向する前記絶縁基板間を貼り合わせてなることを特徴とする、請求項7に記載のディスプレイ装置。
- 可撓性を有する絶縁基材の表面に形成した導電パターンであって、第1の外部接続用端子部と第2の外部接続用端子部とを設ける導電パターンの半導体接続用端子部に接続して、フレキシブルプリント配線板の、前記第1の外部接続用端子部と前記第2の外部接続用端子部との間に半導体を搭載し、
次いで、その半導体のまわりを一部残して前記半導体を取り囲むように、前記絶縁基材にスリットを形成して半導体保持部位を設け、かつその半導体保持部位を除いて前記絶縁基材を、表面を内側として折り返し、前記第1の外部接続用端子部および前記第2の外部接続用端子部を各々他の部品に接続するとき、搭載された前記半導体を前記絶縁基材の裏面から突出させるように、前記スリットを形成し、
その後またはそれと同時に、前記フレキシブルプリント配線板を単位導電パターンごとに打ち抜く、
ことを特徴とする半導体装置の製造方法。 - 可撓性を有する絶縁基材の表面に、第1の外部接続用端子部と第2の外部接続用端子部とを設ける導電パターンを形成したフレキシブルプリント配線板を搬送するとき、そのフレキシブルプリント配線板に付与するテンションが前記導電パターンの半導体接続用端子部の端子間ピッチに影響を及ぼさないように、前記絶縁基材に第1の切れ目を設け、
その後、前記半導体接続用端子部に接続して、前記フレキシブルプリント配線板の、前記第1の外部接続用端子部と前記第2の外部接続用端子部との間に半導体を搭載し、
次いで、前記第1の切れ目を含んでまたは前記第1の切れ目に接続して第2の切れ目を設け、前記半導体のまわりを一部残してその半導体を取り囲むように、前記絶縁基材にスリットを形成して半導体保持部位を設け、かつその半導体保持部位を除いて前記絶縁基材を、表面を内側として折り返し、前記第1の外部接続用端子部および前記第2の外部接続用端子部を各々他の部品に接続するとき、搭載された前記半導体を前記絶縁基材の裏面から突出させるように、前記スリットを形成し、
その後またはそれと同時に、前記フレキシブルプリント配線板を単位導電パターンごとに打ち抜く、
ことを特徴とする半導体装置の製造方法。 - 前記スリットの両端を通って前記絶縁基材を横切る直線とそれと平行な直線との間の折り曲げ範囲で、前記半導体保持部位を、裏面を内側として折り返してなる、ことを特徴とする、請求項9または10に記載の半導体装置の製造方法。
- 請求項9ないし11のいずれか1に記載の製造方法により半導体装置を形成し、
次いで、前記スリットの両端を通って前記絶縁基材を横切る直線とそれと平行な直線との間の折り曲げ範囲で、前記半導体保持部位を除いて前記絶縁基材を、表面を内側として折り返し、前記導電パターンの前記第1の外部接続用端子部および前記第2の外部接続用端子部を他の部品に接続してなる、
ことを特徴とするディスプレイ装置の製造方法。 - 前記半導体を、高熱伝導材料を介して筐体部材に接着してなることを特徴とする、請求項12に記載のディスプレイ装置の製造方法。
- 前記半導体保持部位を、前記折り曲げ範囲で湾曲して、裏面を内側として折り返してなることを特徴とする、請求項12または13に記載のディスプレイ装置の製造方法。
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JP2007243306A JP4109707B1 (ja) | 2007-05-30 | 2007-09-20 | 半導体装置およびその製造方法、ならびにディスプレイ装置およびその製造方法 |
PCT/JP2008/058841 WO2008146603A1 (ja) | 2007-05-30 | 2008-05-14 | 半導体装置およびその製造方法、ならびにディスプレイ装置およびその製造方法 |
US12/600,585 US20100148207A1 (en) | 2007-05-30 | 2008-05-14 | Semiconductor device, and manufacturing method thereof, and display device and its manufacturing method |
CN2008800178721A CN101689535B (zh) | 2007-05-30 | 2008-05-14 | 半导体装置及其制造方法,以及显示装置及其制造方法 |
KR1020097018872A KR20100024381A (ko) | 2007-05-30 | 2008-05-14 | 반도체 장치와 그 제조방법, 및 디스플레이 장치와 그 제조방법 |
EP08752712A EP2151862A1 (en) | 2007-05-30 | 2008-05-14 | Semiconductor device and its manufacturing method, and display and its manufacturing method |
TW097118747A TW200913177A (en) | 2007-05-30 | 2008-05-21 | Semiconductor device and its manufacturing method, and display and its manufacturing method |
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US8120921B2 (en) * | 2007-07-19 | 2012-02-21 | Nec Corporation | Device having electronic components mounted therein and method for manufacturing such device |
WO2010128614A1 (en) | 2009-05-02 | 2010-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP5466966B2 (ja) * | 2010-02-16 | 2014-04-09 | 新藤電子工業株式会社 | 配線板、半導体装置、半導体モジュール及びディスプレイ装置 |
JP2011199090A (ja) * | 2010-03-23 | 2011-10-06 | Shindo Denshi Kogyo Kk | フレキシブルプリント配線板の製造方法、半導体装置の製造方法、ディスプレイ装置の製造方法、フレキシブルプリント配線板、半導体装置及びディスプレイ装置 |
KR102055194B1 (ko) | 2013-05-06 | 2019-12-12 | 삼성전자주식회사 | 표시 장치 |
KR20150080878A (ko) * | 2014-01-02 | 2015-07-10 | 삼성전자주식회사 | 디스플레이 모듈 및 이를 갖춘 디스플레이 장치 |
US9335231B2 (en) * | 2014-03-25 | 2016-05-10 | Mks Instruments, Inc. | Micro-Pirani vacuum gauges |
US9195358B1 (en) * | 2014-04-16 | 2015-11-24 | Eastman Kodak Company | Z-fold multi-element substrate structure |
TWI477216B (zh) * | 2014-06-09 | 2015-03-11 | Chipbond Technology Corp | 可撓式基板 |
US9379355B1 (en) * | 2014-12-15 | 2016-06-28 | Lg Display Co., Ltd. | Flexible display device having support layer with rounded edge |
KR20160110861A (ko) * | 2015-03-13 | 2016-09-22 | 삼성디스플레이 주식회사 | 연성 회로 기판 및 이를 포함하는 표시 장치 |
US10177347B2 (en) * | 2015-07-01 | 2019-01-08 | Sharp Kabushiki Kaisha | Method for manufacturing display device |
CN204884440U (zh) * | 2015-08-27 | 2015-12-16 | 京东方科技集团股份有限公司 | 柔性显示面板和柔性显示装置 |
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JP6817862B2 (ja) * | 2017-03-24 | 2021-01-20 | 株式会社ジャパンディスプレイ | 表示装置 |
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CN113570975A (zh) * | 2020-04-29 | 2021-10-29 | 深圳市柔宇科技有限公司 | 面板组件及电子设备 |
CN112349206B (zh) * | 2020-11-09 | 2022-07-12 | 厦门天马微电子有限公司 | 一种可折叠显示装置 |
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TW200913177A (en) | 2009-03-16 |
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