JP4975584B2 - 半導体装置及び半導体装置の製造方法。 - Google Patents
半導体装置及び半導体装置の製造方法。 Download PDFInfo
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- JP4975584B2 JP4975584B2 JP2007278310A JP2007278310A JP4975584B2 JP 4975584 B2 JP4975584 B2 JP 4975584B2 JP 2007278310 A JP2007278310 A JP 2007278310A JP 2007278310 A JP2007278310 A JP 2007278310A JP 4975584 B2 JP4975584 B2 JP 4975584B2
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
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- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Description
フレキシブル基板と、
前記フレキシブル基板の第1の主面上に形成され、半導体チップと電気的に接続された第1の熱伝導層と、
前記フレキシブル基板の第2の主面上に形成され、前記半導体チップと電気的に絶縁された第2の熱伝導層とを有し、
前記第2の熱伝導層は、長辺部及び短辺部を有する複数の導体パターンがストライプ状に形成されたものであり、
前記半導体チップに対応する前記フレキシブル基板の第2の主面は、当該フレキシブル基板が露出している半導体装置である。
以下、図面を参照して本発明の実施の形態について説明する。図1は、本発明の実施の形態1に関わる半導体装置(以下、TCPと称す)100の断面図である。図1に示すように、本実施の形態のTCP100は、フレキシブル基板(以下、単に基板とも称す)1、第1の熱伝導層(以下、第1の導体パターンと称す)2、第2の熱伝導層(以下、第2の導体パターンと称す)3、ソルダレジスト4、半導体チップ5、電極6を有している。
図1は、実施の形態1と同様、本実施の形態2の半導体装置200の断面を示す図である。また、図4(a)及び(b)はそれぞれ、半導体チップが搭載される表面、半導体チップが搭載される表面とは反対の面である裏面を示す図である。なお、図4において、図2と共通する構成に関しては、同一の符号を付し、その詳細な説明を省略する。図4では、図2に示した半導体装置100におけるTCPの第2の導体パターンがストライプ形状に形成されている。このストライプ形状は、長辺部及び短辺部を有する複数の導体パターンがチップ長辺部に沿う方向に並べられて形成されている。
2 第1の導体パターン
3 第2の導体パターン
4 ソルダレジスト
5 半導体チップ
6 電極(バンプ電極)
7 ボンディングステージ
8 ボンディングツール
9 スプロケットホール
100 TCP
Claims (2)
- フレキシブル基板と、
前記フレキシブル基板の第1の主面上に形成され、半導体チップと電気的に接続された第1の熱伝導層と、
前記フレキシブル基板の第2の主面上に形成され、前記半導体チップと電気的に絶縁された第2の熱伝導層とを有し、
前記第2の熱伝導層は、長辺部及び短辺部を有する複数の導体パターンがストライプ状に形成されたものであり、
前記半導体チップに対応する前記フレキシブル基板の第2の主面は、当該フレキシブル基板が露出している半導体装置。 - 前記複数の導体パターンの長辺部は、前記半導体チップの長辺部と同一方向に形成されていることを特徴とする請求項1に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007278310A JP4975584B2 (ja) | 2007-10-26 | 2007-10-26 | 半導体装置及び半導体装置の製造方法。 |
US12/285,743 US8102046B2 (en) | 2007-10-26 | 2008-10-14 | Semiconductor device and method of manufacturing the same |
CN2008101729206A CN101419957B (zh) | 2007-10-26 | 2008-10-24 | 半导体器件及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007278310A JP4975584B2 (ja) | 2007-10-26 | 2007-10-26 | 半導体装置及び半導体装置の製造方法。 |
Publications (2)
Publication Number | Publication Date |
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JP2009110980A JP2009110980A (ja) | 2009-05-21 |
JP4975584B2 true JP4975584B2 (ja) | 2012-07-11 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007278310A Expired - Fee Related JP4975584B2 (ja) | 2007-10-26 | 2007-10-26 | 半導体装置及び半導体装置の製造方法。 |
Country Status (3)
Country | Link |
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US (1) | US8102046B2 (ja) |
JP (1) | JP4975584B2 (ja) |
CN (1) | CN101419957B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5325684B2 (ja) * | 2009-07-15 | 2013-10-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2014229761A (ja) * | 2013-05-23 | 2014-12-08 | 株式会社東芝 | 電子機器 |
US9490226B2 (en) | 2014-08-18 | 2016-11-08 | Qualcomm Incorporated | Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal |
US9633950B1 (en) * | 2016-02-10 | 2017-04-25 | Qualcomm Incorporated | Integrated device comprising flexible connector between integrated circuit (IC) packages |
JP2018085522A (ja) * | 2017-12-21 | 2018-05-31 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
JPH06314724A (ja) * | 1993-04-28 | 1994-11-08 | Hitachi Cable Ltd | 半導体素子搭載用両面配線基板,及びそれを用いた半導 体装置 |
JPH0758239A (ja) * | 1993-06-30 | 1995-03-03 | Matsushita Electric Works Ltd | チップキャリア |
JPH11102937A (ja) * | 1997-09-26 | 1999-04-13 | Hitachi Cable Ltd | 両面配線tab用テープ |
US6002169A (en) * | 1998-06-15 | 1999-12-14 | Lsi Logic Corporation | Thermally enhanced tape ball grid array package |
TW455964B (en) * | 2000-07-18 | 2001-09-21 | Siliconware Precision Industries Co Ltd | Multi-chip module package structure with stacked chips |
JP2003068804A (ja) * | 2001-08-22 | 2003-03-07 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用基板 |
TW564533B (en) * | 2002-10-08 | 2003-12-01 | Siliconware Precision Industries Co Ltd | Warpage-preventing substrate |
JP4972306B2 (ja) * | 2004-12-21 | 2012-07-11 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及び回路装置 |
-
2007
- 2007-10-26 JP JP2007278310A patent/JP4975584B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-14 US US12/285,743 patent/US8102046B2/en not_active Expired - Fee Related
- 2008-10-24 CN CN2008101729206A patent/CN101419957B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2009110980A (ja) | 2009-05-21 |
CN101419957A (zh) | 2009-04-29 |
US8102046B2 (en) | 2012-01-24 |
CN101419957B (zh) | 2012-11-21 |
US20090108438A1 (en) | 2009-04-30 |
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