JP2014229761A - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP2014229761A JP2014229761A JP2013108729A JP2013108729A JP2014229761A JP 2014229761 A JP2014229761 A JP 2014229761A JP 2013108729 A JP2013108729 A JP 2013108729A JP 2013108729 A JP2013108729 A JP 2013108729A JP 2014229761 A JP2014229761 A JP 2014229761A
- Authority
- JP
- Japan
- Prior art keywords
- deformation suppressing
- deformation
- suppressing member
- pcb
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】一つの実施の形態に係る電子機器は、基板と、部品と、変形抑制部材とを備える。前記基板は、複数の導電部を有する。前記部品は、前記複数の導電部に接続されるとともに第1の方向に並ぶ複数の第1の端子を有する。前記変形抑制部材は、前記複数の導電部から離れて前記基板に取り付けられ、前記第1の方向に延びる。前記変形抑制部材は、前記複数の第1の端子の列に対して前記第1の方向と直交する方向に並ぶとともに、前記第1の方向において前記複数の第1の端子の列の少なくとも一方の端よりも延出する。
【選択図】 図3
Description
Claims (5)
- 複数の導電部を有する基板と、
前記複数の導電部に接続されるとともに第1の方向に並ぶ複数の第1の端子を有する部品と、
前記複数の導電部から離れて前記基板に取り付けられ、前記第1の方向に延びる変形抑制部材と、
を具備し、
前記変形抑制部材は、前記複数の第1の端子の列に対して前記第1の方向と直交する方向に並ぶとともに、前記第1の方向において前記複数の第1の端子の列の少なくとも一方の端よりも延出する、電子機器。 - 前記部品は、前記導電部に接続されるとともに前記第1の方向と交差する第2の方向に並ぶ複数の第2の端子を有し、
前記変形抑制部材の一部は、前記第1の方向に並ぶ前記複数の第1の端子の列と前記第2の方向に並ぶ前記複数の第2の端子の列との角が向く方向に存する、請求項1に記載の電子機器。 - 前記基板を収容する筐体と、
前記基板を前記筐体に固定する固定部材と、
をさらに具備し、
前記変形抑制部材は、前記基板の前記固定部材によって前記筐体に固定された部分と、前記複数の第1の端子の列と、の間に位置する請求項1に記載の電子機器。 - 前記複数の導電部は、前記基板において、前記基板の前記固定部材によって前記筐体に固定された部分と、前記変形抑制部材の両端と、を結んだ仮想線によって規定される範囲内に位置する、請求項3に記載の電子機器。
- 前記変形抑制部材は、前記基板において、前記複数の第1の端子の列の延長線によって区切られた一方の領域のみに存する、請求項1に記載の電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013108729A JP2014229761A (ja) | 2013-05-23 | 2013-05-23 | 電子機器 |
US14/059,839 US20140347828A1 (en) | 2013-05-23 | 2013-10-22 | Electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013108729A JP2014229761A (ja) | 2013-05-23 | 2013-05-23 | 電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014229761A true JP2014229761A (ja) | 2014-12-08 |
Family
ID=51935265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013108729A Pending JP2014229761A (ja) | 2013-05-23 | 2013-05-23 | 電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20140347828A1 (ja) |
JP (1) | JP2014229761A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020157793A1 (ja) * | 2019-01-28 | 2020-08-06 | 三菱電機株式会社 | 基板アセンブリ及び空気調和装置 |
WO2020188758A1 (ja) * | 2019-03-19 | 2020-09-24 | 三菱電機株式会社 | 回路基板 |
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JP2011035330A (ja) * | 2009-08-05 | 2011-02-17 | Nec Lighting Ltd | 電子回路基板及びその製造方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020157793A1 (ja) * | 2019-01-28 | 2020-08-06 | 三菱電機株式会社 | 基板アセンブリ及び空気調和装置 |
JPWO2020157793A1 (ja) * | 2019-01-28 | 2021-10-14 | 三菱電機株式会社 | 基板アセンブリ及び空気調和装置 |
JP7058772B2 (ja) | 2019-01-28 | 2022-04-22 | 三菱電機株式会社 | 基板アセンブリ及び空気調和装置 |
WO2020188758A1 (ja) * | 2019-03-19 | 2020-09-24 | 三菱電機株式会社 | 回路基板 |
JPWO2020188758A1 (ja) * | 2019-03-19 | 2021-11-18 | 三菱電機株式会社 | 回路基板 |
JP7123236B2 (ja) | 2019-03-19 | 2022-08-22 | 三菱電機株式会社 | 回路基板 |
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US20140347828A1 (en) | 2014-11-27 |
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