JP5739020B1 - 電子機器 - Google Patents
電子機器 Download PDFInfo
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- JP5739020B1 JP5739020B1 JP2013551824A JP2013551824A JP5739020B1 JP 5739020 B1 JP5739020 B1 JP 5739020B1 JP 2013551824 A JP2013551824 A JP 2013551824A JP 2013551824 A JP2013551824 A JP 2013551824A JP 5739020 B1 JP5739020 B1 JP 5739020B1
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- Prior art keywords
- circuit board
- opening
- electronic device
- housing
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims description 40
- 238000003825 pressing Methods 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000004048 modification Effects 0.000 description 33
- 238000012986 modification Methods 0.000 description 33
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000006163 transport media Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本実施形態では、図1に例示されるように、電子機器1は、例えば、筐体2(第一の筐体、第一の部分)と筐体3(第二の筐体、別の筐体、第二の部分)とを備える。筐体2は、表示装置4を支持している。筐体3には、回路基板10が収容されている。また、筐体3には、キーボード6や、タッチパッド7、クリックボタン8等が設けられている。キーボード6や、タッチパッド7、クリックボタン8等は、入力部、入力受付部、入力操作部の一例である。また、タッチパッド7や、クリックボタン8等は、ポインティングデバイスの一例である。
本変形例にかかる電子機器1は、図6に示される開口部10dの形状が異なる以外、上記実施形態と同様の構成を有する。本変形例によっても、上記実施形態と同様の構成に基づく同様の効果(結果)が得られる。
本変形例にかかる電子機器1は、図7に示される開口部10dの形状が異なる以外、上記実施形態と同様の構成を有する。本変形例によっても、上記実施形態と同様の構成に基づく同様の効果(結果)が得られる。
本変形例にかかる電子機器1は、図8に示される開口部10dの形状が異なる以外、上記実施形態と同様の構成を有する。本変形例によっても、上記実施形態と同様の構成に基づく同様の効果(結果)が得られる。
本変形例にかかる電子機器1は、図9に示される開口部10dの形状が異なる以外、上記実施形態と同様の構成を有する。本変形例によっても、上記実施形態と同様の構成に基づく同様の効果(結果)が得られる。
Claims (7)
- 第一の面と当該第一の面とは反対側の第二の面とを有し、前記第一の面と前記第二の面との間で貫通する開口部と当該開口部の縁部で当該開口部の中心から離れる側に延びた切欠部とが設けられた第一の回路基板と、
第三の面と当該第三の面とは反対側の第四の面とを有し、当該第四の面と前記第一の面とが互いに面した状態で前記第一の回路基板と重なるとともに当該第一の回路基板と電気的に接続され、前記開口部を覆った第二の回路基板と、
前記第三の面に設けられ前記第二の回路基板と電気的に接続された第一の電子部品と、
少なくとも一部が前記開口部に収容された状態で前記第四の面に設けられ前記第二の回路基板と電気的に接続された第二の電子部品と、
を備え、
前記第一の面と前記第四の面との間には、前記第一の回路基板と前記第二の回路基板とを電気的に接続する複数の導体部が配置され、
前記切欠部は、前記第一の回路基板の厚さ方向から見て、互いに隣接する二つの前記導体部の間に位置された、電子機器。 - 前記開口部は四つの隅部を有した四角形状に形成され、
前記切欠部は、少なくとも一つの前記隅部に設けられた、請求項1に記載の電子機器。 - 前記開口部は四つの隅部と四つの辺部とを有した四角形状に形成され、
前記切欠部は、少なくとも一つの前記隅部に設けられ、当該隅部に隣接した二つの前記辺部の双方と交差した方向に延びた、請求項1に記載の電子機器。 - 前記開口部は四つの辺部を有した四角形状に形成され、
前記切欠部は、少なくとも一つの前記辺部の両端部に設けられた、請求項1に記載の電子機器。 - 前記開口部は短辺部と長辺部とを有する長方形状に形成され、
前記切欠部は、前記短辺部の端部に設けられた、請求項1に記載の電子機器。 - 前記切欠部は、前記第一の面と直交する方向の視線で、前記開口部に隣接するとともに互いに隣接する二つの導体部の間で、それら二つの導体部の前記開口部の中心に近い側の外接線と重なる位置よりも当該中心から遠い側まで延びた、請求項1に記載の電子機器。
- さらに、前記第一の回路基板に固定され、前記第一の電子部品を前記第一の回路基板側に押しつける押部材を備えた、請求項1に記載の電子機器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/068438 WO2015001653A1 (ja) | 2013-07-04 | 2013-07-04 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5739020B1 true JP5739020B1 (ja) | 2015-06-24 |
JPWO2015001653A1 JPWO2015001653A1 (ja) | 2017-02-23 |
Family
ID=52132658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013551824A Active JP5739020B1 (ja) | 2013-07-04 | 2013-07-04 | 電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9280173B2 (ja) |
JP (1) | JP5739020B1 (ja) |
CN (1) | CN104412385A (ja) |
WO (1) | WO2015001653A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140328018A1 (en) * | 2013-05-03 | 2014-11-06 | Nvidia Corporation | Fanless notebook computer structure providing enhanced graphics performance and form factor |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221218A (ja) * | 1994-02-03 | 1995-08-18 | Toshiba Corp | 半導体装置 |
JP2001024290A (ja) * | 1999-07-13 | 2001-01-26 | Kyocera Corp | 電子部品用セラミックス基板 |
JP2007123457A (ja) * | 2005-10-27 | 2007-05-17 | Nec Electronics Corp | 半導体モジュール |
JP2011138958A (ja) * | 2009-12-28 | 2011-07-14 | Toshiba Corp | 電子機器 |
JP2011138959A (ja) * | 2009-12-28 | 2011-07-14 | Toshiba Corp | 電子機器 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11150219A (ja) * | 1997-11-18 | 1999-06-02 | Nikko Co | 半導体集積素子用のパッケージと、その実装方法 |
JP3710649B2 (ja) * | 1999-06-28 | 2005-10-26 | 富士通株式会社 | マルチプロセッサシステム |
US6274474B1 (en) * | 1999-10-25 | 2001-08-14 | International Business Machines Corporation | Method of forming BGA interconnections having mixed solder profiles |
TW585387U (en) * | 2000-04-20 | 2004-04-21 | Foxconn Prec Components Co Ltd | Heat sink locking device |
TW562166U (en) * | 2002-02-22 | 2003-11-11 | Hon Hai Prec Ind Co Ltd | Assembly of back plate fixing device |
JP2005129570A (ja) | 2003-10-21 | 2005-05-19 | Matsushita Electric Ind Co Ltd | 配線基板および半導体装置 |
JP2005322844A (ja) | 2004-05-11 | 2005-11-17 | Sony Corp | 回路基板及び半導体装置 |
US7870888B2 (en) * | 2005-08-26 | 2011-01-18 | Illinois Tool Works Inc. | Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same |
JP2007080592A (ja) * | 2005-09-12 | 2007-03-29 | Fujitsu Component Ltd | 半導体装置実装用ソケット |
JP2007242890A (ja) | 2006-03-08 | 2007-09-20 | Nec Electronics Corp | テープ状配線基板及び半導体装置 |
US7292447B2 (en) * | 2006-03-22 | 2007-11-06 | Fu Zhun Precision Industry (Shen Zhen) Co. Ltd. | Back plate assembly for a board |
JP4894347B2 (ja) | 2006-04-28 | 2012-03-14 | 凸版印刷株式会社 | 半導体集積回路素子搭載用基板および半導体装置 |
JP4799296B2 (ja) * | 2006-06-30 | 2011-10-26 | 株式会社東芝 | 電子機器 |
CN201115185Y (zh) * | 2007-05-22 | 2008-09-10 | 富士康(昆山)电脑接插件有限公司 | 散热器模组 |
JP2009151367A (ja) * | 2007-12-18 | 2009-07-09 | Toshiba Corp | 電子機器 |
JP2010021379A (ja) * | 2008-07-11 | 2010-01-28 | Sony Corp | 電子機器 |
JP4802272B2 (ja) | 2009-09-30 | 2011-10-26 | 株式会社東芝 | 電子機器 |
JP4823375B1 (ja) | 2010-05-28 | 2011-11-24 | 株式会社東芝 | 電子機器 |
-
2013
- 2013-07-04 WO PCT/JP2013/068438 patent/WO2015001653A1/ja active Application Filing
- 2013-07-04 CN CN201380003942.9A patent/CN104412385A/zh active Pending
- 2013-07-04 JP JP2013551824A patent/JP5739020B1/ja active Active
-
2014
- 2014-04-10 US US14/250,189 patent/US9280173B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221218A (ja) * | 1994-02-03 | 1995-08-18 | Toshiba Corp | 半導体装置 |
JP2001024290A (ja) * | 1999-07-13 | 2001-01-26 | Kyocera Corp | 電子部品用セラミックス基板 |
JP2007123457A (ja) * | 2005-10-27 | 2007-05-17 | Nec Electronics Corp | 半導体モジュール |
JP2011138958A (ja) * | 2009-12-28 | 2011-07-14 | Toshiba Corp | 電子機器 |
JP2011138959A (ja) * | 2009-12-28 | 2011-07-14 | Toshiba Corp | 電子機器 |
Also Published As
Publication number | Publication date |
---|---|
WO2015001653A1 (ja) | 2015-01-08 |
JPWO2015001653A1 (ja) | 2017-02-23 |
US9280173B2 (en) | 2016-03-08 |
US20150009609A1 (en) | 2015-01-08 |
CN104412385A (zh) | 2015-03-11 |
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