IT1291779B1 - Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti - Google Patents

Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti

Info

Publication number
IT1291779B1
IT1291779B1 IT97FI000023A ITFI970023A IT1291779B1 IT 1291779 B1 IT1291779 B1 IT 1291779B1 IT 97FI000023 A IT97FI000023 A IT 97FI000023A IT FI970023 A ITFI970023 A IT FI970023A IT 1291779 B1 IT1291779 B1 IT 1291779B1
Authority
IT
Italy
Prior art keywords
printed circuits
realization
procedure
printed
circuits
Prior art date
Application number
IT97FI000023A
Other languages
English (en)
Inventor
Antonio Canova
Original Assignee
Magnetek Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnetek Spa filed Critical Magnetek Spa
Publication of ITFI970023A0 publication Critical patent/ITFI970023A0/it
Priority to IT97FI000023A priority Critical patent/IT1291779B1/it
Priority to EP98905612A priority patent/EP0974249B1/en
Priority to DE69803664T priority patent/DE69803664T2/de
Priority to ES98905612T priority patent/ES2170477T3/es
Priority to PCT/IT1998/000026 priority patent/WO1998036625A1/en
Priority to DK98905612T priority patent/DK0974249T3/da
Publication of ITFI970023A1 publication Critical patent/ITFI970023A1/it
Application granted granted Critical
Publication of IT1291779B1 publication Critical patent/IT1291779B1/it
Priority to US09/374,971 priority patent/US6401332B1/en
Priority to US10/043,002 priority patent/US6858806B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Burglar Alarm Systems (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
IT97FI000023A 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti IT1291779B1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti
PCT/IT1998/000026 WO1998036625A1 (en) 1997-02-17 1998-02-16 Process for producing printed circuits and printed circuits thus obtained
DE69803664T DE69803664T2 (de) 1997-02-17 1998-02-16 Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten
ES98905612T ES2170477T3 (es) 1997-02-17 1998-02-16 Procedimiento para fabricar circuitos impresos y circuitos impresos obtenidos con el mismo.
EP98905612A EP0974249B1 (en) 1997-02-17 1998-02-16 Process for producing printed circuits and printed circuits thus obtained
DK98905612T DK0974249T3 (da) 1997-02-17 1998-02-16 Fremgangsmåde til fremstilling af trykte kredsløb og således fremstillede trykte kredsløb
US09/374,971 US6401332B1 (en) 1997-02-17 1999-08-16 Processing printed circuits and printed circuits thus obtained
US10/043,002 US6858806B2 (en) 1997-02-17 2002-01-09 Process for producing printed circuits and printed circuits thus obtained

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti

Publications (3)

Publication Number Publication Date
ITFI970023A0 ITFI970023A0 (it) 1997-02-17
ITFI970023A1 ITFI970023A1 (it) 1998-08-17
IT1291779B1 true IT1291779B1 (it) 1999-01-21

Family

ID=11351938

Family Applications (1)

Application Number Title Priority Date Filing Date
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti

Country Status (7)

Country Link
US (2) US6401332B1 (it)
EP (1) EP0974249B1 (it)
DE (1) DE69803664T2 (it)
DK (1) DK0974249T3 (it)
ES (1) ES2170477T3 (it)
IT (1) IT1291779B1 (it)
WO (1) WO1998036625A1 (it)

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ITRM20020138U1 (it) * 2002-07-31 2004-02-01 Dmg Spa Pulsantiere di ascensore con pulsanti precablati.
US20050247761A1 (en) * 2004-05-04 2005-11-10 Albanese Patricia M Surface mount attachment of components
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
WO2008097664A1 (en) 2007-02-11 2008-08-14 Map Pharmaceuticals, Inc. Method of therapeutic administration of dhe to enable rapid relief of migraine while minimizing side effect profile
WO2009121697A1 (de) * 2008-04-01 2009-10-08 Continental Automotive Gmbh Stromführungsbauteil mit einem träger, leiterbahnen und leiterplättchen
DE102011004526B4 (de) 2011-02-22 2021-05-06 Vitesco Technologies GmbH Leiterplatte mit hoher Stromtragfähigkeit und Verfahren zur Herstellung einer solchen Leiterplatte
JP2014229761A (ja) * 2013-05-23 2014-12-08 株式会社東芝 電子機器
KR102059610B1 (ko) * 2015-12-18 2019-12-26 주식회사 엘지화학 고전도성 방열 패드를 이용한 인쇄회로기판의 방열 시스템
JP6412051B2 (ja) * 2016-04-18 2018-10-24 ファナック株式会社 プリント板の自動組み立ての歩留りを向上する自動組立システム及び自動組立方法

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US4873764A (en) 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
DE3813097A1 (de) 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen auf leiterplatten
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Also Published As

Publication number Publication date
ES2170477T3 (es) 2002-08-01
EP0974249A1 (en) 2000-01-26
ITFI970023A1 (it) 1998-08-17
DE69803664D1 (de) 2002-03-14
WO1998036625A1 (en) 1998-08-20
EP0974249B1 (en) 2002-01-30
US6401332B1 (en) 2002-06-11
US20020056571A1 (en) 2002-05-16
ITFI970023A0 (it) 1997-02-17
US6858806B2 (en) 2005-02-22
DE69803664T2 (de) 2002-10-24
DK0974249T3 (da) 2002-05-06

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Legal Events

Date Code Title Description
0001 Granted