ES2170477T3 - Procedimiento para fabricar circuitos impresos y circuitos impresos obtenidos con el mismo. - Google Patents

Procedimiento para fabricar circuitos impresos y circuitos impresos obtenidos con el mismo.

Info

Publication number
ES2170477T3
ES2170477T3 ES98905612T ES98905612T ES2170477T3 ES 2170477 T3 ES2170477 T3 ES 2170477T3 ES 98905612 T ES98905612 T ES 98905612T ES 98905612 T ES98905612 T ES 98905612T ES 2170477 T3 ES2170477 T3 ES 2170477T3
Authority
ES
Spain
Prior art keywords
printed circuits
procedure
same
manufacturing
conductive track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98905612T
Other languages
English (en)
Inventor
Antonio Canova
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Magnetek SpA
Original Assignee
Magnetek SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnetek SpA filed Critical Magnetek SpA
Application granted granted Critical
Publication of ES2170477T3 publication Critical patent/ES2170477T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Burglar Alarm Systems (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Abstract

La invención se refiere a un procedimiento que permite producir circuitos impresos que comprenden un soporte (¡) laminar, al menos una pista (7) eléctricamente conductora situada sobre dicho soporte, y al menos un elemento (21) conductor auxiliar soldado a dicha pista conductora (7). La invención trata del montaje de dicho elemento auxiliar mediante un dispositivo que permite componentes a montar en superficie.
ES98905612T 1997-02-17 1998-02-16 Procedimiento para fabricar circuitos impresos y circuitos impresos obtenidos con el mismo. Expired - Lifetime ES2170477T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti

Publications (1)

Publication Number Publication Date
ES2170477T3 true ES2170477T3 (es) 2002-08-01

Family

ID=11351938

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98905612T Expired - Lifetime ES2170477T3 (es) 1997-02-17 1998-02-16 Procedimiento para fabricar circuitos impresos y circuitos impresos obtenidos con el mismo.

Country Status (7)

Country Link
US (2) US6401332B1 (es)
EP (1) EP0974249B1 (es)
DE (1) DE69803664T2 (es)
DK (1) DK0974249T3 (es)
ES (1) ES2170477T3 (es)
IT (1) IT1291779B1 (es)
WO (1) WO1998036625A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITRM20020138U1 (it) * 2002-07-31 2004-02-01 Dmg Spa Pulsantiere di ascensore con pulsanti precablati.
US20050247761A1 (en) * 2004-05-04 2005-11-10 Albanese Patricia M Surface mount attachment of components
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
WO2008097664A1 (en) 2007-02-11 2008-08-14 Map Pharmaceuticals, Inc. Method of therapeutic administration of dhe to enable rapid relief of migraine while minimizing side effect profile
WO2009121697A1 (de) * 2008-04-01 2009-10-08 Continental Automotive Gmbh Stromführungsbauteil mit einem träger, leiterbahnen und leiterplättchen
DE102011004526B4 (de) 2011-02-22 2021-05-06 Vitesco Technologies GmbH Leiterplatte mit hoher Stromtragfähigkeit und Verfahren zur Herstellung einer solchen Leiterplatte
JP2014229761A (ja) * 2013-05-23 2014-12-08 株式会社東芝 電子機器
KR102059610B1 (ko) * 2015-12-18 2019-12-26 주식회사 엘지화학 고전도성 방열 패드를 이용한 인쇄회로기판의 방열 시스템
JP6412051B2 (ja) * 2016-04-18 2018-10-24 ファナック株式会社 プリント板の自動組み立ての歩留りを向上する自動組立システム及び自動組立方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560437B1 (fr) * 1984-02-28 1987-05-29 Citroen Sa Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions
EP0315799B1 (de) 1987-11-10 1992-05-06 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Bestücken von Leiterplatten mit Bauelementen
US4873764A (en) 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
DE3813097A1 (de) 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen auf leiterplatten
DE3813096A1 (de) 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen, insbesondere smd-bauelementen, auf leiterplatten
JPH01303793A (ja) * 1988-05-31 1989-12-07 Pfu Ltd プリント配線板の製造方法及び配線板
US4982376A (en) 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
DE3935930A1 (de) 1989-10-27 1991-05-02 Adalbert Fritsch Bestueckungsgeraet
US5157734A (en) 1989-12-19 1992-10-20 Industrial Technology Research Institute Method and apparatus for picking and placing a surface mounted device with the aid of machine vision
EP0434135B1 (en) 1989-12-20 1994-06-01 Koninklijke Philips Electronics N.V. Method of positioning and soldering of SMD components
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
US5195154A (en) 1990-04-27 1993-03-16 Ngk Insulators, Ltd. Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board
JPH0429338A (ja) * 1990-05-24 1992-01-31 Nippon Mektron Ltd Ｉｃの搭載用回路基板及びその搭載方法
DE4028556C1 (es) * 1990-09-08 1992-04-02 Robert Bosch Gmbh, 7000 Stuttgart, De
KR960015906B1 (ko) 1991-03-18 1996-11-23 후지쓰 가부시끼가이샤 프린트 배선판 유니트 제조시스템 및 제조방법
EP0509582B1 (en) 1991-04-16 1996-09-04 Koninklijke Philips Electronics N.V. SMD-resistor
DE69300850T2 (de) 1992-07-01 1996-03-28 Yamaha Motor Co Ltd Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
JPH06196851A (ja) * 1992-12-25 1994-07-15 Taiyo Yuden Co Ltd 回路基板に金属部材を取り付けるはんだ付け方法
US5410801A (en) 1993-02-08 1995-05-02 Automated Production Systems Apparatus for manually controlled placement of components on circuit boards
US5323528A (en) 1993-06-14 1994-06-28 Amistar Corporation Surface mount placement system
JPH0715122A (ja) * 1993-06-23 1995-01-17 Matsushita Electric Ind Co Ltd 接合用フィルム構体および電子部品実装方法
US5349504A (en) 1993-07-12 1994-09-20 Dialight Corporation Multi-level lightpipe design for SMD LEDs
DE4425803A1 (de) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Leiterplatte
FR2712454B3 (fr) * 1993-11-08 1996-03-22 Nicomatic Composant conducteur passif pour montage en surface sur une carte de circuit imprimé.
US5373111A (en) * 1993-11-19 1994-12-13 Delco Electronics Corporation Bond pad having a patterned bonding surface
DE4339551C1 (de) 1993-11-19 1994-10-13 Heusler Isabellenhuette Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand
US5974661A (en) 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US5578874A (en) * 1994-06-14 1996-11-26 Hughes Aircraft Company Hermetically self-sealing flip chip
DE4433565A1 (de) 1994-09-20 1996-03-21 Blaupunkt Werke Gmbh Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen
WO1997001263A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication
US5886877A (en) * 1995-10-13 1999-03-23 Meiko Electronics Co., Ltd. Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
US5729896A (en) * 1996-10-31 1998-03-24 International Business Machines Corporation Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
US5896081A (en) 1997-06-10 1999-04-20 Cyntec Company Resistance temperature detector (RTD) formed with a surface-mount-device (SMD) structure
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6457234B1 (en) * 1999-05-14 2002-10-01 International Business Machines Corporation Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond

Also Published As

Publication number Publication date
EP0974249A1 (en) 2000-01-26
ITFI970023A1 (it) 1998-08-17
DE69803664D1 (de) 2002-03-14
WO1998036625A1 (en) 1998-08-20
EP0974249B1 (en) 2002-01-30
US6401332B1 (en) 2002-06-11
IT1291779B1 (it) 1999-01-21
US20020056571A1 (en) 2002-05-16
ITFI970023A0 (it) 1997-02-17
US6858806B2 (en) 2005-02-22
DE69803664T2 (de) 2002-10-24
DK0974249T3 (da) 2002-05-06

Similar Documents

Publication Publication Date Title
CO4560406A1 (es) Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construccion electronicos en las superficies de la placa conductora
PE20030029A1 (es) Dispositivo y metodo para montar un modulo de proteccion contra sobre-voltaje sobre un riel de instalacion
ATE233434T1 (de) Optoelektronisches sensor-bauelement
IT1266653B1 (it) Macchina per eseguire il test elettrico simultaneo, sulle due facce di una piastra con circuiti stampati
DE59813502D1 (de) Kühler bzw. Wärmesenke für elektrische Bauelemente oder Schaltkreise sowie elektrischer Schaltkreis mit einer solchen Wärmesenke
ATE522122T1 (de) Gehäuse für stromwandler mit verbessertem transformatorbetrieb
ES2106257T3 (es) Procedimiento para fabricar un mazo de cableado plano.
ATE344471T1 (de) Elektrochrome anordnung
MX173068B (es) Tablero de circuitos impresos, metodo para su fabricacion y metodo para unir partes electronicas al mismo.
AR247316A1 (es) Un aparato para montar un transductor electroacustico en un alojamiento
ES2170477T3 (es) Procedimiento para fabricar circuitos impresos y circuitos impresos obtenidos con el mismo.
DE60232283D1 (de) Elektrische Schaltung für Zeilendruckkopfanordnung
KR910011113A (ko) 전기부품용 접속기
SE0100562D0 (sv) Jordningselement
NO893646L (no) Elektrisk kontakt for trykte kretser.
SE8102820L (sv) Anordning for fixering av elektriska anslutningselement pa kretskort
AT501081B1 (de) Led sowie led-lichtquelle
SE0001504D0 (sv) Elektrisk komponent och denna användande radioterminal
NO995488L (no) Halvlederkeramikk egnet for elektriske kretskomponenter
FR2887741B1 (fr) Bus de communication et tableau electrique comportant un tel bus
SE9800707D0 (sv) Motstånd
AR014492A1 (es) Soporte para una disposicion determinada de contactos electricos
EP0892593A3 (de) Befestigungsmittel für Abschirmgehäuse von elektrischen Leiterplatten und Verfahren zu seiner Herstellung
TW335595B (en) Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturiing such components
FR2781924B1 (fr) Procede de montage de circuits integres

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 974249

Country of ref document: ES