MX173068B - Tablero de circuitos impresos, metodo para su fabricacion y metodo para unir partes electronicas al mismo. - Google Patents

Tablero de circuitos impresos, metodo para su fabricacion y metodo para unir partes electronicas al mismo.

Info

Publication number
MX173068B
MX173068B MX023042A MX2304290A MX173068B MX 173068 B MX173068 B MX 173068B MX 023042 A MX023042 A MX 023042A MX 2304290 A MX2304290 A MX 2304290A MX 173068 B MX173068 B MX 173068B
Authority
MX
Mexico
Prior art keywords
circuit board
manufacture
printed circuit
same
electronic parts
Prior art date
Application number
MX023042A
Other languages
English (en)
Inventor
Youshichi Hagiwara
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grace W R & Co filed Critical Grace W R & Co
Publication of MX173068B publication Critical patent/MX173068B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La presente invención se refiere a un tablero de circuitos que comprende una circuitería eléctricamente conductora sobre un substrato, caracterizado en que la circuitería comprende placas terminales y estas placas terminales están revestidas con partículas o polvos eléctricamente conductores y con un adhesivo aislante y este adhesivo aislante cubre, cuando menos, dichas partículas o polvo eléctricamente conductores y dichas placas terminales.
MX023042A 1989-10-27 1990-10-26 Tablero de circuitos impresos, metodo para su fabricacion y metodo para unir partes electronicas al mismo. MX173068B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1281595A JPH03152992A (ja) 1989-10-27 1989-10-27 印刷回路板及びその製造方法

Publications (1)

Publication Number Publication Date
MX173068B true MX173068B (es) 1994-01-31

Family

ID=17641338

Family Applications (1)

Application Number Title Priority Date Filing Date
MX023042A MX173068B (es) 1989-10-27 1990-10-26 Tablero de circuitos impresos, metodo para su fabricacion y metodo para unir partes electronicas al mismo.

Country Status (11)

Country Link
US (1) US5332869A (es)
JP (1) JPH03152992A (es)
KR (1) KR910009127A (es)
CN (1) CN1023542C (es)
AU (1) AU6491590A (es)
BR (1) BR9005384A (es)
CA (1) CA2027939A1 (es)
GB (1) GB2240220B (es)
HK (1) HK33894A (es)
MX (1) MX173068B (es)
ZA (1) ZA908506B (es)

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US5648320A (en) * 1985-05-31 1997-07-15 Jacobs; Richard L. Method of manufacturing ceramic superconductor circuit board
JPH06125026A (ja) * 1992-10-12 1994-05-06 Ngk Spark Plug Co Ltd 端子構造とこれを用いた入出力端子部材及び配線基板
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
JP3287140B2 (ja) * 1994-10-31 2002-05-27 松下電器産業株式会社 光ビーム加熱装置
KR100342039B1 (ko) * 1994-12-29 2002-10-25 삼성에스디아이 주식회사 전기적접촉구조의형성방법
US5798050A (en) * 1997-01-10 1998-08-25 International Business Machines Corporation Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
US5892303A (en) * 1997-03-28 1999-04-06 Xerox Corporation Compact design for combination of an electrical circuit with a segmented electrode development roll
US5982630A (en) * 1997-11-06 1999-11-09 Intel Corporation Printed circuit board that provides improved thermal dissipation
JP2000113919A (ja) * 1998-08-03 2000-04-21 Sony Corp 電気的接続装置と電気的接続方法
KR100629923B1 (ko) * 1998-09-30 2006-09-29 돗빤호무즈가부시기가이샤 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체
US6727197B1 (en) 1999-11-18 2004-04-27 Foster-Miller, Inc. Wearable transmission device
US6249434B1 (en) 2000-06-20 2001-06-19 Adc Telecommunications, Inc. Surface mounted conduction heat sink
DE60143811D1 (de) * 2000-10-16 2011-02-17 Foster Miller Inc Verfahren zur herstellung eines gewebeartikels mit elektronischer beschaltung und gewebeartikel
US20040092186A1 (en) * 2000-11-17 2004-05-13 Patricia Wilson-Nguyen Textile electronic connection system
JP2004212955A (ja) * 2002-12-16 2004-07-29 Sharp Corp 液晶表示装置
JP4157468B2 (ja) * 2003-12-12 2008-10-01 日立電線株式会社 配線基板
US7331500B2 (en) * 2004-06-25 2008-02-19 Intel Corporation Solder bumps formation using solder paste with shape retaining attribute
KR100801073B1 (ko) * 2005-10-06 2008-02-11 삼성전자주식회사 도전성 입자를 포함하는 범프를 구비하는 반도체 칩 및 이의 제조 방법
JP5252473B2 (ja) * 2006-10-19 2013-07-31 独立行政法人産業技術総合研究所 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
KR101309319B1 (ko) * 2006-11-22 2013-09-13 삼성디스플레이 주식회사 액정표시장치 구동회로 및 그의 제조방법과 액정표시장치구동회로가 실장 된 액정표시장치
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
US9211085B2 (en) 2010-05-03 2015-12-15 Foster-Miller, Inc. Respiration sensing system
US9028404B2 (en) 2010-07-28 2015-05-12 Foster-Miller, Inc. Physiological status monitoring system
US8585606B2 (en) 2010-09-23 2013-11-19 QinetiQ North America, Inc. Physiological status monitoring system
KR101513642B1 (ko) * 2013-08-21 2015-04-20 엘지전자 주식회사 반도체 디바이스
CN107247749B (zh) 2017-05-25 2020-08-25 创新先进技术有限公司 一种数据库状态确定方法、一致性验证方法及装置
JP7185252B2 (ja) * 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
US4522888A (en) * 1980-12-29 1985-06-11 General Electric Company Electrical conductors arranged in multiple layers
US4411980A (en) * 1981-09-21 1983-10-25 E. I. Du Pont De Nemours And Company Process for the preparation of flexible circuits
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
GB8802003D0 (en) * 1988-01-29 1988-02-24 Marconi Instruments Ltd Method of fabricating circuit
US4940623A (en) * 1988-08-09 1990-07-10 Bosna Alexander A Printed circuit board and method using thermal spray techniques
EP0360971A3 (en) * 1988-08-31 1991-07-17 Mitsui Mining & Smelting Co., Ltd. Mounting substrate and its production method, and printed wiring board having connector function and its connection method

Also Published As

Publication number Publication date
AU6491590A (en) 1991-05-02
CN1023542C (zh) 1994-01-12
CA2027939A1 (en) 1991-04-28
KR910009127A (ko) 1991-05-31
GB2240220A (en) 1991-07-24
BR9005384A (pt) 1991-09-17
ZA908506B (en) 1991-08-28
JPH03152992A (ja) 1991-06-28
CN1051282A (zh) 1991-05-08
US5332869A (en) 1994-07-26
HK33894A (en) 1994-04-22
GB9023469D0 (en) 1990-12-12
GB2240220B (en) 1994-01-05

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