MX173068B - PRINTED CIRCUIT BOARD, METHOD FOR ITS MANUFACTURE AND METHOD FOR JOINING ELECTRONIC PARTS TO THE SAME. - Google Patents
PRINTED CIRCUIT BOARD, METHOD FOR ITS MANUFACTURE AND METHOD FOR JOINING ELECTRONIC PARTS TO THE SAME.Info
- Publication number
- MX173068B MX173068B MX023042A MX2304290A MX173068B MX 173068 B MX173068 B MX 173068B MX 023042 A MX023042 A MX 023042A MX 2304290 A MX2304290 A MX 2304290A MX 173068 B MX173068 B MX 173068B
- Authority
- MX
- Mexico
- Prior art keywords
- circuit board
- manufacture
- printed circuit
- same
- electronic parts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
La presente invención se refiere a un tablero de circuitos que comprende una circuitería eléctricamente conductora sobre un substrato, caracterizado en que la circuitería comprende placas terminales y estas placas terminales están revestidas con partículas o polvos eléctricamente conductores y con un adhesivo aislante y este adhesivo aislante cubre, cuando menos, dichas partículas o polvo eléctricamente conductores y dichas placas terminales.The present invention relates to a circuit board comprising electrically conductive circuitry on a substrate, characterized in that the circuitry comprises end plates and these end plates are coated with electrically conductive particles or powders and with an insulating adhesive and this insulating adhesive covers at least said electrically conductive particles or dust and said end plates.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1281595A JPH03152992A (en) | 1989-10-27 | 1989-10-27 | Printed circuit and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
MX173068B true MX173068B (en) | 1994-01-31 |
Family
ID=17641338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX023042A MX173068B (en) | 1989-10-27 | 1990-10-26 | PRINTED CIRCUIT BOARD, METHOD FOR ITS MANUFACTURE AND METHOD FOR JOINING ELECTRONIC PARTS TO THE SAME. |
Country Status (11)
Country | Link |
---|---|
US (1) | US5332869A (en) |
JP (1) | JPH03152992A (en) |
KR (1) | KR910009127A (en) |
CN (1) | CN1023542C (en) |
AU (1) | AU6491590A (en) |
BR (1) | BR9005384A (en) |
CA (1) | CA2027939A1 (en) |
GB (1) | GB2240220B (en) |
HK (1) | HK33894A (en) |
MX (1) | MX173068B (en) |
ZA (1) | ZA908506B (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5648320A (en) * | 1985-05-31 | 1997-07-15 | Jacobs; Richard L. | Method of manufacturing ceramic superconductor circuit board |
JPH06125026A (en) * | 1992-10-12 | 1994-05-06 | Ngk Spark Plug Co Ltd | Terminal structure and input-output terminal member and wiring board using it |
US5616206A (en) * | 1993-06-15 | 1997-04-01 | Ricoh Company, Ltd. | Method for arranging conductive particles on electrodes of substrate |
JP3287140B2 (en) * | 1994-10-31 | 2002-05-27 | 松下電器産業株式会社 | Light beam heating device |
KR100342039B1 (en) * | 1994-12-29 | 2002-10-25 | 삼성에스디아이 주식회사 | Method for forming electrical contact structure |
US5798050A (en) * | 1997-01-10 | 1998-08-25 | International Business Machines Corporation | Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate |
US5892303A (en) * | 1997-03-28 | 1999-04-06 | Xerox Corporation | Compact design for combination of an electrical circuit with a segmented electrode development roll |
US5982630A (en) * | 1997-11-06 | 1999-11-09 | Intel Corporation | Printed circuit board that provides improved thermal dissipation |
JP2000113919A (en) * | 1998-08-03 | 2000-04-21 | Sony Corp | Electrical connection device and electrically connecting method |
KR100629923B1 (en) * | 1998-09-30 | 2006-09-29 | 돗빤호무즈가부시기가이샤 | Conductive paste, curing method therof, method for fabricating antenna for contactless data transmitter-receiver, and contactless data transmitter-receiver |
US6727197B1 (en) | 1999-11-18 | 2004-04-27 | Foster-Miller, Inc. | Wearable transmission device |
US6249434B1 (en) | 2000-06-20 | 2001-06-19 | Adc Telecommunications, Inc. | Surface mounted conduction heat sink |
EP1335831B1 (en) * | 2000-10-16 | 2011-01-05 | Foster-Miller, Inc. | Methods of manufacturing a fabric article including electronic circuitry and fabric articles |
US20040092186A1 (en) * | 2000-11-17 | 2004-05-13 | Patricia Wilson-Nguyen | Textile electronic connection system |
JP2004212955A (en) * | 2002-12-16 | 2004-07-29 | Sharp Corp | Liquid crystal display |
JP4157468B2 (en) * | 2003-12-12 | 2008-10-01 | 日立電線株式会社 | Wiring board |
US7331500B2 (en) * | 2004-06-25 | 2008-02-19 | Intel Corporation | Solder bumps formation using solder paste with shape retaining attribute |
KR100801073B1 (en) * | 2005-10-06 | 2008-02-11 | 삼성전자주식회사 | Semiconductor chip having bump with conductive particle and method of forming the same |
JP5252473B2 (en) * | 2006-10-19 | 2013-07-31 | 独立行政法人産業技術総合研究所 | Conductive pattern forming film, conductive pattern forming method and conductive pattern forming apparatus therefor |
KR101309319B1 (en) * | 2006-11-22 | 2013-09-13 | 삼성디스플레이 주식회사 | Driving circuit, method of manufacturing thereof and liquid crystal display apparatus having the same |
CN101836265B (en) * | 2007-10-22 | 2012-07-25 | 日本化学工业株式会社 | Coated conductive powder and conductive adhesive using the same |
US9211085B2 (en) | 2010-05-03 | 2015-12-15 | Foster-Miller, Inc. | Respiration sensing system |
US9028404B2 (en) | 2010-07-28 | 2015-05-12 | Foster-Miller, Inc. | Physiological status monitoring system |
US8585606B2 (en) | 2010-09-23 | 2013-11-19 | QinetiQ North America, Inc. | Physiological status monitoring system |
KR101513642B1 (en) * | 2013-08-21 | 2015-04-20 | 엘지전자 주식회사 | A device of a semiconductor |
CN107247749B (en) | 2017-05-25 | 2020-08-25 | 创新先进技术有限公司 | Database state determination method, consistency verification method and device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
US4522888A (en) * | 1980-12-29 | 1985-06-11 | General Electric Company | Electrical conductors arranged in multiple layers |
US4411980A (en) * | 1981-09-21 | 1983-10-25 | E. I. Du Pont De Nemours And Company | Process for the preparation of flexible circuits |
JPS59195837A (en) * | 1983-04-21 | 1984-11-07 | Sharp Corp | Chip bonding method for large-scale integrated circuit |
US4868637A (en) * | 1985-11-26 | 1989-09-19 | Clements James R | Electronic device including uniaxial conductive adhesive and method of making same |
GB8802003D0 (en) * | 1988-01-29 | 1988-02-24 | Marconi Instruments Ltd | Method of fabricating circuit |
US4940623A (en) * | 1988-08-09 | 1990-07-10 | Bosna Alexander A | Printed circuit board and method using thermal spray techniques |
EP0360971A3 (en) * | 1988-08-31 | 1991-07-17 | Mitsui Mining & Smelting Co., Ltd. | Mounting substrate and its production method, and printed wiring board having connector function and its connection method |
-
1989
- 1989-10-27 JP JP1281595A patent/JPH03152992A/en active Pending
-
1990
- 1990-10-17 US US07/600,042 patent/US5332869A/en not_active Expired - Lifetime
- 1990-10-18 CA CA002027939A patent/CA2027939A1/en not_active Abandoned
- 1990-10-23 AU AU64915/90A patent/AU6491590A/en not_active Abandoned
- 1990-10-24 BR BR909005384A patent/BR9005384A/en unknown
- 1990-10-24 ZA ZA908506A patent/ZA908506B/en unknown
- 1990-10-26 MX MX023042A patent/MX173068B/en unknown
- 1990-10-26 KR KR1019900017345A patent/KR910009127A/en not_active Application Discontinuation
- 1990-10-27 CN CN90108776A patent/CN1023542C/en not_active Expired - Fee Related
- 1990-10-29 GB GB9023469A patent/GB2240220B/en not_active Expired - Fee Related
-
1994
- 1994-04-14 HK HK33894A patent/HK33894A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CA2027939A1 (en) | 1991-04-28 |
CN1023542C (en) | 1994-01-12 |
KR910009127A (en) | 1991-05-31 |
US5332869A (en) | 1994-07-26 |
ZA908506B (en) | 1991-08-28 |
GB2240220B (en) | 1994-01-05 |
CN1051282A (en) | 1991-05-08 |
HK33894A (en) | 1994-04-22 |
GB2240220A (en) | 1991-07-24 |
GB9023469D0 (en) | 1990-12-12 |
AU6491590A (en) | 1991-05-02 |
JPH03152992A (en) | 1991-06-28 |
BR9005384A (en) | 1991-09-17 |
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