DE69111834D1 - Elektronische Vorrichtung mit einem elektrisch leitenden Klebstoff. - Google Patents
Elektronische Vorrichtung mit einem elektrisch leitenden Klebstoff.Info
- Publication number
- DE69111834D1 DE69111834D1 DE69111834T DE69111834T DE69111834D1 DE 69111834 D1 DE69111834 D1 DE 69111834D1 DE 69111834 T DE69111834 T DE 69111834T DE 69111834 T DE69111834 T DE 69111834T DE 69111834 D1 DE69111834 D1 DE 69111834D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic device
- electrically conductive
- conductive adhesive
- adhesive
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
- Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/468,458 US4970624A (en) | 1990-01-22 | 1990-01-22 | Electronic device employing a conductive adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69111834D1 true DE69111834D1 (de) | 1995-09-14 |
DE69111834T2 DE69111834T2 (de) | 1996-05-02 |
Family
ID=23859897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69111834T Expired - Fee Related DE69111834T2 (de) | 1990-01-22 | 1991-01-10 | Elektronische Vorrichtung mit einem elektrisch leitenden Klebstoff. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4970624A (de) |
EP (1) | EP0439256B1 (de) |
DE (1) | DE69111834T2 (de) |
ES (1) | ES2075337T3 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8800901A (nl) * | 1988-04-08 | 1989-11-01 | Philips Nv | Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie. |
US5270903A (en) * | 1990-09-10 | 1993-12-14 | Codex Corporation | Printed circuit board manufacturing method accommodates wave soldering and press fitting of components |
US5197889A (en) * | 1992-02-03 | 1993-03-30 | Motorola, Inc. | Electrical contact for battery package or similar device |
US5295214A (en) * | 1992-11-16 | 1994-03-15 | International Business Machines Corporation | Optical module with tolerant wave soldered joints |
US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
US5362421A (en) * | 1993-06-16 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
DE4326443C2 (de) * | 1993-08-06 | 1996-06-05 | Telefunken Microelectron | Folientastatur mit bedrahtetem Bauelement |
US5751514A (en) * | 1993-09-09 | 1998-05-12 | Western Digital Corporation | Intelligent disk drive having spring contacts on a board assembly for connecting to exterior-facing electrical contacts coupled to a spindle motor |
US5488539A (en) * | 1994-01-21 | 1996-01-30 | Sun Microsystems, Inc. | Protecting cot packaged ICs during wave solder operations |
US5384435A (en) * | 1994-01-28 | 1995-01-24 | Molex Incorporated | Mounting terminal pins in substrates |
US5456616A (en) * | 1994-02-04 | 1995-10-10 | Molex Incorporated | Electrical device employing a flat flexible circuit |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5983492A (en) * | 1996-11-27 | 1999-11-16 | Tessera, Inc. | Low profile socket for microelectronic components and method for making the same |
US5605477A (en) * | 1995-01-13 | 1997-02-25 | The Whitaker Corporation | Flexible etched circuit assembly |
US5514839A (en) * | 1995-02-09 | 1996-05-07 | Honeywell Inc. | Weldable flexible circuit termination for high temperature applications |
US5548488A (en) * | 1995-04-03 | 1996-08-20 | Prince Corporation | Electrical componet mounting system |
US5736679A (en) * | 1995-12-26 | 1998-04-07 | International Business Machines Corporation | Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board |
US6083340A (en) * | 1997-02-28 | 2000-07-04 | Hokuriku Electric Industry Co., Ltd. | Process for manufacturing a multi-layer circuit board |
US6086384A (en) * | 1997-08-22 | 2000-07-11 | Molex Incorporated | Method of fabricating electronic device employing a flat flexible circuit and including the device itself |
US6723928B1 (en) | 1997-09-29 | 2004-04-20 | Molex Incorporated | Terminal pins mounted in flexible substrates |
US6030234A (en) * | 1998-01-23 | 2000-02-29 | Molex Incorporated | Terminal pins mounted in flexible substrates |
SE9900163D0 (sv) * | 1999-01-20 | 1999-01-20 | Piezomotors Uppsala Ab | Flexible printed circuit board arrangement |
JP2004530249A (ja) * | 2001-06-08 | 2004-09-30 | シーゲイト テクノロジー エルエルシー | Z軸導電性接着フィルムを使用したヘッド・ジンバル・アセンブリのプリント回路板への取付け |
US6781088B2 (en) * | 2002-09-12 | 2004-08-24 | Wilson Greatbatch Technologies, Inc. | Pin to thin plate joint and method for making the joint |
US6808422B2 (en) * | 2003-03-19 | 2004-10-26 | Delphi Technologies, Inc. | Filter insert for an electrical connector assembly |
DE10344261A1 (de) * | 2003-09-23 | 2005-05-04 | Endress & Hauser Gmbh & Co Kg | Leiterplatte mit einer Haltevorrichtung zum Halten bedrahteter elektronischer Bauteile, Verfahren zur Herstellung einer solchen Leiterplatte und deren Verwendung in einem Lötofen |
DE102004037786A1 (de) * | 2004-08-03 | 2006-03-16 | Endress + Hauser Gmbh + Co. Kg | Leiterplatte mit SMD-Bauteilen und mindestens einem bedrahteten Bauteil sowie ein Verfahren zum Bestücken, Befestigen |
DE102004057505B4 (de) * | 2004-11-29 | 2008-08-21 | Lisa Dräxlmaier GmbH | Elektrisches Funktionsbauteil |
US20070096132A1 (en) * | 2005-11-01 | 2007-05-03 | Jiahn-Chang Wu | Coaxial LED lighting board |
KR100757910B1 (ko) * | 2006-07-06 | 2007-09-11 | 삼성전기주식회사 | 매립패턴기판 및 그 제조방법 |
US7876577B2 (en) * | 2007-03-12 | 2011-01-25 | Tyco Electronics Corporation | System for attaching electronic components to molded interconnection devices |
JP2009199809A (ja) * | 2008-02-20 | 2009-09-03 | Mitsumi Electric Co Ltd | コネクタ、光伝送モジュールおよび光−電気伝送モジュール |
CN101911393B (zh) * | 2008-10-21 | 2014-04-16 | 株式会社旭电化研究所 | 母连接器,与其组合的公连接器,使用它们的电气/电子设备 |
TWM383720U (en) * | 2009-12-08 | 2010-07-01 | Cooler Master Co Ltd | Heat dissipation plate |
TWM494399U (zh) * | 2014-04-02 | 2015-01-21 | Hon Hai Prec Ind Co Ltd | 電連接器 |
US20160103146A1 (en) * | 2014-10-09 | 2016-04-14 | Continental Automotive Systems, Inc. | Arrangement and method for connecting electronic components to a terminal for a sensor assembly |
KR102139755B1 (ko) | 2015-01-22 | 2020-07-31 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
EP3709777A1 (de) * | 2019-03-11 | 2020-09-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Lötfreie bauteilträgerverbindung mit einem elastischen element und verfahren |
EP3737215A1 (de) | 2019-05-10 | 2020-11-11 | BIOTRONIK SE & Co. KG | Verfahren zum anschliessen eines verbindungsstifts an einer leiterplatte |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4024627A (en) * | 1974-04-29 | 1977-05-24 | Amp Incorporated | Package mounting of electronic chips, such as light emitting diodes |
US4185378A (en) * | 1978-02-10 | 1980-01-29 | Chuo Meiban Mfg. Co., LTD. | Method for attaching component leads to printed circuit base boards and printed circuit base board advantageously used for working said method |
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
US4667401A (en) * | 1985-11-26 | 1987-05-26 | Clements James R | Method of making an electronic device using an uniaxial conductive adhesive |
GB2203442B (en) * | 1987-04-14 | 1991-10-16 | James Robert Clements | Electronic device including uniaxial conductive adhesive and method of making same |
-
1990
- 1990-01-22 US US07/468,458 patent/US4970624A/en not_active Expired - Lifetime
-
1991
- 1991-01-10 EP EP91300162A patent/EP0439256B1/de not_active Expired - Lifetime
- 1991-01-10 ES ES91300162T patent/ES2075337T3/es not_active Expired - Lifetime
- 1991-01-10 DE DE69111834T patent/DE69111834T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0439256B1 (de) | 1995-08-09 |
US4970624A (en) | 1990-11-13 |
DE69111834T2 (de) | 1996-05-02 |
EP0439256A1 (de) | 1991-07-31 |
ES2075337T3 (es) | 1995-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |